Abstract: A micro-display element used in displaying original images and reflection control module for optical projection display includes a control chip, a driving circuit, a plurality of metallic mirror surface reflection gate elements. The gate element, the driving circuit and the control chip are mounted in sequence from the top to the bottom layer, and the driving circuit is controlled by displaying control signals of the control chip so as to drive the reflection gate elements to cause, the “ON” and “OFF” control and at the outer surrounding of the reflection gate element, along the horizontal axial (X-axis) and the vertical axis (Y-axis) direction, equivalent number of adjustment pixels are provided, such that the micro-displays of R, G, B projected light, during optical module calibration, can be accurately adjusted to superimposed state by means of adjustment pixels which provide sufficient biased calibration in a horizontal axial direction in a vertical axial direction.

Abstract: A method of manufacturing micro-display includes the steps of testing individual chips on a base wafer forming the micro-display, and the tested “void” chips being marked, inputting the testing data into a sealant/glue machine and a laser puncher; sealant/glue forming on the external surrounding of a “passed” chip a sealant frame by the sealant/glue machine; forming an injection hole on an ITO glass panel at a position corresponding to the position of the “passed” chip, by means of the laser puncher; dispensing spacing particles within a chip's square box which has been formed with the sealant frame; position-aligning the ITO glass panel onto the wafer based on the wafer testing data; injecting a liquid crystal via the injection hole of the ITO glass panel located on the top layer of the “passed” chip to the space between the chips and the ITO glass; and sealing and dicing handling of the ITO glass panel to precisely manufacture the micro-display with a pas