Abstract: A heat dissipation structure includes a vapor chamber (1), a heat pipe (2) and a working fluid. The vapor chamber (1) includes an upper shell (11), a lower shell (11) correspondingly sealed with the upper shell (11) and a first wick structure disposed on an inner surface of the upper shell (11). A chamber (S) is defined between the upper shell (11) and the lower shell (12). A penetration hole (111) communicating to the chamber (S) is defined on the upper shell (11). A second wick structure (22) includes a revealing section (221) exposed from a hollow slot (211). The working fluid is filled in the chamber (S). An inner diameter of the through hole (131) is smaller than that of the penetration hole (111). The first wick structure (13) is embedded in the hollow slot (211) and attached to the revealing section (221).

Abstract: A grooved vapor chamber capillary reflow structure includes a first plate, a second plate and a capillary structure. The first plate includes an inner surface, the second plate is sealed on the inner surface of the first plate, a chamber is formed between the second plate and the first plate, the capillary structure covers the inner surface of the first plate. The chamber contains at least one evaporation area and at least one condensation area, at least one reflow path is defined on the inner surface of the first plate, formed by a groove, and extends from one evaporation area to one condensation area in the chamber. In this way, the reflow path formed by the groove under the limited thickness space in the vapor chamber improves the condensation of the liquid state working fluid and facilitates quick reflow during heat exchange.

Abstract: A heat dissipation device includes a vapor chamber (1) and at least one heat pipe (2). The vapor chamber (1) includes a bottom plate (10) and a top plate (11) combined with each other to form a cavity (100); the cavity (100) contains a top plate capillary layer (11a) covering the top plate (11) which has at least one through hole (110). The heat pipe (2) includes a pipe body (20) with a closed end (200) and an open end (201) fixed in the through hole (110), and a pipe capillary layer (21) with a connecting portion (210). The top plate (11) includes at least one protrusion (111) corresponding to the through hole (110) and having a receiving portion (111a) recessed inside the top plate (11), and a capillary structure (11b) in the receiving portion (111a) and contacting with the connecting portion (210) and top plate capillary layer (11a).

Abstract: A vapor chamber and a manufacturing method thereof are disclosed. The vapor chamber includes a first housing, multiple supporting columns, a capillary structure, a second housing, a bonding layer, and a working fluid. The first housing includes an inner surface. Each supporting column is disposed on the inner surface of the first housing and includes an end surface. The capillary structure is disposed on the inner surface of the first housing. The second housing is sealed with the first housing correspondingly to jointly define a chamber. The bonding layer is formed between the inner surface of the first housing and the end surfaces of the supporting columns. The working fluid is arranged inside the chamber. Accordingly, it is able to swiftly changing the positions of the supporting columns according to the actual cooling needs, thereby significantly reducing the manufacturing time required.

Abstract: A display card includes a circuit board, a graphic processing unit and a noise reduction module. The circuit board has multiple gold fingers. The graphic processing unit is disposed on the circuit board. The noise reduction module is disposed on and electrically connected to the circuit board. The noise reduction module includes an active noise cancellation and a speaker electrically connected to the active noise cancellation. The speaker is capable of emitting a noise reduction sound to offset a noise from surrounding environment by the noise reduction sound. Thereby, the disclosure can effectively overcome the disturbing problem of noise.

Abstract: A separate active noise cancellation device is installed on an electronic device which includes a circuit board and a noise generating source. The separate active noise cancellation device includes an active noise cancellation controller, a microphone and a speaker, the active noise cancellation controller is installed on and electrically connected to the circuit board, the microphone and the active noise cancellation controller are separately installed, the microphone has a cable provided for electrically connecting the active noise cancellation controller, the microphone is arranged around the noise generating source, the speaker is electrically connected to the active noise cancellation controller and capable of issuing a noise cancelling sound to offset the noise generated by the noise generating source. In this way, the amount of noise may be accurately captured and reduced to overcome the annoying noise problem.

Abstract: A vapor chamber includes a shell body, a wick structure, a single-piece support structure and a working fluid. The shell body includes a first shell and a second shell. A chamber is formed between the first shell and the second shell. The wick structure is disposed in the chamber and attached on the shell body. The single-piece support structure is disposed in the chamber and between the first shell and the second shell, and includes support bodies and ribs. Each support body includes a hollow rod and an annular seat. Any adjacent two of the annular seats are connected by one of the ribs. The support body are arranged at an interval. The ribs are arranged along the support bodies to form hollow portions between each support body and each rib. The working fluid is disposed in the chamber.

Abstract: A separate capillary vapor chamber structure for dual heat sources is provided for transferring heat between low and high heat sources, and includes lower and upper plates covering each other, an evaporation area having the low and high heat sources, a first condensation area extended from a side of the evaporation area and adjacent to the low heat source, a second condensation area extended from another side of the evaporation area and adjacent to the high heat source. The lower plate has a lower capillary layer extended from the first condensation area to an end of the second condensation area through the evaporation area, and the upper plate has an upper capillary layer extended from an end of the first condensation area into the evaporation area to form a cut edge, such that the upper capillary layer is shorter than the lower capillary layer.

Abstract: A liquid immersion cooler includes a metal case, a soldering layer, a heat conduction layer, and a porous structure. The metal case has a heated surface and a cooling surface disposed on back of the heated surface. The soldering layer is laid on the cooling surface. The heat conduction layer is laid on the soldering layer. The porous structure is laid on the heat conduction layer. Therefore, the waste heat from an electronic heat source may be rapidly dissipated.

Abstract: A liquid immersion cooling sheet includes a metal case and a porous structure. The metal case has a heated surface and a cooling surface formed on a back of the heated surface. The porous structure is disposed on the cooling surface and has multiple gaps. A width of each gap is less than or equal to about 0.2 mm. Therefore, the waste heat from an electronic heat source may be rapidly dissipated.

Abstract: A combination structure of a vapor chamber and a heat pipe includes a half-shell seat element, a half-shell cover element, a wick structure, and a working fluid. The half-shell seat element includes a vapor chamber half-shell seat and multiple heat pipe half-shell seats. Each heat pipe half-shell seat is extended from the vapor chamber half-shell seat. The vapor chamber half-shell seat includes a vapor chamber cavity. Each heat pipe half-shell seat includes a heat pipe cavity. Each heat pipe cavity communicates with the vapor chamber cavity. The half-shell cover element is sealedly connected with the half-shell seat element. The wick structure is continuously laid on the vapor chamber half-shell seat and each heat pipe half-shell seat, and is formed in the vapor chamber cavity and each heat pipe cavity. The working fluid is disposed in the vapor chamber cavity.

Abstract: A heat dissipating module includes a heat dissipating assembly, a centrifugal fan, an airflow guiding hood and an auxiliary fan. The heat dissipating assembly includes a heat dissipating board and fins disposed thereon. Heat dissipating channels are formed between the fins. The centrifugal fan is disposed at a side of the heat dissipating channels. The airflow guiding hood covers the heat dissipating assembly and the centrifugal fan and is provided with a first airflow opening over the centrifugal fan, a second airflow opening over the fins and a third airflow opening at another side of the heat dissipating channels. The auxiliary fan is disposed between the fins and the second airflow opening.

Abstract: A heat dissipating apparatus using phase change heat transfer includes a box, a heat conductive block, a working fluid, and a heat transfer device. The box has a first shell plate and a second plate between both of which a chamber is defined. An opening is formed through the first shell plate. The heat conductive block is disposed corresponding to the opening; a portion of the heat conductive block is formed inside the chamber and the other portion of the heat conductive block is exposed out of the first shell plate. The working fluid is disposed in the chamber and in contact with the heat conductive block. The heat transfer device has an evaporator section installed inside the chamber to absorb the heat generated by the working fluid after phase change. Thus, the heat dissipating efficiency of the whole apparatus can be enhanced.

Abstract: A vapor chamber structure includes a thin-sheet housing with a hollow interior and a composite capillary layer installed in the thin-sheet housing. The composite capillary layer is a metal woven mesh formed by weaving plural metal filaments, and each metal filament of the composite capillary layer is a steel wire having a coating layer on the exterior of the steel wire. By pulling and drawing the steel into a linear shape, a smaller wire diameter is obtained, so that the composite capillary layer will not be broken easily and can be used for making a finer woven mesh which can be installed in a thinner vapor chamber.

Abstract: A water-cooled pressurized distributive heat dissipation system used for dissipating heat of servers in the rack is provided. The servers are fixed in the rack in a ranging direction. The system includes a water tank having a distributing duct, branch modules separately corresponding to the servers and a converging duct. Each branch module has a branch pump and a water block in a corresponding one of the servers. The branch pump of each branch module connects between the distributing duct and the water block. The converging duct connects to the water blocks in the ranging direction.

Abstract: A water-cooled pressurized distributive heat dissipation system includes a water tank having a distributing duct, branch modules separately corresponding to the servers and a converging duct. Each branch module has a branch pipe inserted into a corresponding one of the servers and a water block connecting to the branch pipe. An end of each of the branch pipe connects to the distributing duct in order. The converging duct connects to another end of each branch pipe in order. A working fluid is accommodated in the water tank and driven by a pump to flow toward the distributing duct to the branch modules and the converging duct. A flow direction of the working fluid in the distributing duct is the same as a flow direction of the working fluid in the converging duct.

Abstract: A vapor chamber and a manufacturing method thereof are provided. The vapor chamber includes a housing, a capillary structure, at least two liquid-filling and gas-discharging pipes and a working fluid; the housing has a bottom housing plate and a top housing plate correspondingly engaged and sealed with the bottom housing plate, and a single chamber is formed between the top housing plate and the bottom housing plate; the capillary structure is disposed in the single chamber; each of the liquid-filling and gas-discharging pipes is allowed to penetrate into the housing and communicate with the single chamber; and the working fluid is disposed in the single chamber. Accordingly, the working fluid can be evenly and widely distributed in the single chamber.

Abstract: A cooling fan module includes a fan frame, a light emitting part installed in the fan frame, an LED controller installed in the fan frame and electrically connected to the light emitting part, a fan body, and an external connector. The fan body includes a supporting stand detachably connected to the fan frame, a blade set installed on the supporting stand and can rotate with respect to the supporting stand, and a fan connector fixed to the supporting stand and electrically connected to the blade set. The external connector is fixed to the fan frame. The external connector can be electrically plugged in the fan connector to send a first signal; the external connector is electrically connected to the LED controller to send a second signal. Therefore, the cooling fan module has the advantages of easy assembly and reduced incorrect connection.

Abstract: In a thermal conduction structure and its manufacturing method, the thermal conduction structure includes a vapor chamber, a heat pipe and a working fluid. The vapor chamber includes an upper casing, a lower casing, and a cavity formed between the lower and upper casings. The upper casing has a through hole communicated with the cavity and a first capillary tissue disposed on the internal surface of the upper casing. The first capillary tissue has a penetrating hole corresponsive to the through hole. The heat pipe includes a tube and a second capillary tissue disposed in the tube and extended out from the tube to define an exposed section, and the heat pipe is passed and coupled to the through hole, and the exposed section is passed through the penetrating hole to attach to the first capillary tissue. The working fluid is filled in the cavity.