Patents Assigned to Taiwan Microloops Corp.
  • Patent number: 8074706
    Abstract: A heat spreader comprising a casing, a micro-structure layer, a support device, and a working fluid is provided. The casing has an inner surface and is defined by a sealed chamber where the working fluid circulates therein. The micro-structure layer is formed on the inner surface of the casing, wherein the micro-structure layer comprises a first structure layer which is formed by the first metallic mesh. Specifically, the first metallic mesh forms the first structure layer on the inner surface through diffusion bonding so that the working fluid can circulate within the micro-structure layer by capillary action. In addition, the support device is disposed in the sealed chamber for supporting the casing. Thus, a heat spreader with a composite micro-structure can not only enhance the capillarity but also reduce the flowing resistance during operation.
    Type: Grant
    Filed: April 20, 2007
    Date of Patent: December 13, 2011
    Assignee: Taiwan Microloops Corp.
    Inventors: Cherng-Yuh Su, Kuo-Ying Lee, Chien-Hung Liin
  • Publication number: 20080040925
    Abstract: The present invention discloses a heat spreader and method for making the heat spreader. The heat spreader comprises: a hollow metallic housing including an upper cover having an inner surface and a lower cover having an inner surface, the upper and lower covers being bonded together along their perimeters defining a cavity; a capillary structure in a form of metallic meshes bonded to the inner surfaces of the upper and lower covers of the metallic housing; a plurality of reinforcing members disposed in the cavity and bonded between the inner surfaces of the upper and lower covers of the metallic housing; and a working fluid receive in the cavity; wherein bonded surfaces between the metallic meshes and the inner surfaces of the metallic housing, the upper cover and the lower cover, and the reinforcing members and the inner surfaces of the metallic housing all are diffusion-bonded interfaces.
    Type: Application
    Filed: October 17, 2007
    Publication date: February 21, 2008
    Applicant: Taiwan Microloops Corp.
    Inventors: Kuo-Ying Lee, Chien-Wen Chiu, Chien-Hung Lin, Cherng-Yuh Su
  • Publication number: 20060098411
    Abstract: The present invention discloses a heat spreader and method for making the heat spreader. The heat spreader comprises: a hollow metallic housing including an upper cover having an inner surface and a lower cover having an inner surface, the upper and lower covers being bonded together along their perimeters defining a cavity; a capillary structure in a form of metallic meshes bonded to the inner surfaces of the upper and lower covers of the metallic housing; a plurality of reinforcing members disposed in the cavity and bonded between the inner surfaces of the upper and lower covers of the metallic housing; and a working fluid receive in the cavity; wherein bonded surfaces between the metallic meshes and the inner surfaces of the metallic housing, the upper cover and the lower cover, and the reinforcing members and the inner surfaces of the metallic housing all are diffusion-bonded interfaces.
    Type: Application
    Filed: May 27, 2005
    Publication date: May 11, 2006
    Applicant: Taiwan Microloops Corp.
    Inventors: Kuo-Ying Lee, Chien-Wen Chiu, Chien-Hung Lin, Cherng-Yuh Su