Patents Assigned to Taiwan Microloops Corp.
  • Patent number: 11892240
    Abstract: A combination structure of a vapor chamber and a heat pipe includes a half-shell seat element, a half-shell cover element, a wick structure, and a working fluid. The half-shell seat element includes a vapor chamber half-shell seat and multiple heat pipe half-shell seats. Each heat pipe half-shell seat is extended from the vapor chamber half-shell seat. The vapor chamber half-shell seat includes a vapor chamber cavity. Each heat pipe half-shell seat includes a heat pipe cavity. Each heat pipe cavity communicates with the vapor chamber cavity. The half-shell cover element is sealedly connected with the half-shell seat element. The wick structure is continuously laid on the vapor chamber half-shell seat and each heat pipe half-shell seat, and is formed in the vapor chamber cavity and each heat pipe cavity. The working fluid is disposed in the vapor chamber cavity.
    Type: Grant
    Filed: May 26, 2022
    Date of Patent: February 6, 2024
    Assignee: TAIWAN MICROLOOPS CORP.
    Inventor: Chun-Hung Lin
  • Patent number: 11304331
    Abstract: A heat dissipating module includes a heat dissipating assembly, a centrifugal fan, an airflow guiding hood and an auxiliary fan. The heat dissipating assembly includes a heat dissipating board and fins disposed thereon. Heat dissipating channels are formed between the fins. The centrifugal fan is disposed at a side of the heat dissipating channels. The airflow guiding hood covers the heat dissipating assembly and the centrifugal fan and is provided with a first airflow opening over the centrifugal fan, a second airflow opening over the fins and a third airflow opening at another side of the heat dissipating channels. The auxiliary fan is disposed between the fins and the second airflow opening.
    Type: Grant
    Filed: September 30, 2020
    Date of Patent: April 12, 2022
    Assignee: TAIWAN MICROLOOPS CORP.
    Inventor: Chun-Hung Lin
  • Patent number: 11125507
    Abstract: A heat dissipating apparatus using phase change heat transfer includes a box, a heat conductive block, a working fluid, and a heat transfer device. The box has a first shell plate and a second plate between both of which a chamber is defined. An opening is formed through the first shell plate. The heat conductive block is disposed corresponding to the opening; a portion of the heat conductive block is formed inside the chamber and the other portion of the heat conductive block is exposed out of the first shell plate. The working fluid is disposed in the chamber and in contact with the heat conductive block. The heat transfer device has an evaporator section installed inside the chamber to absorb the heat generated by the working fluid after phase change. Thus, the heat dissipating efficiency of the whole apparatus can be enhanced.
    Type: Grant
    Filed: November 21, 2019
    Date of Patent: September 21, 2021
    Assignee: TAIWAN MICROLOOPS CORP.
    Inventors: Chun-Hung Lin, Chun-Teng Chiu, Yi-Chung Chen, Chih-Wei Wang
  • Patent number: 11060799
    Abstract: A vapor chamber structure includes a thin-sheet housing with a hollow interior and a composite capillary layer installed in the thin-sheet housing. The composite capillary layer is a metal woven mesh formed by weaving plural metal filaments, and each metal filament of the composite capillary layer is a steel wire having a coating layer on the exterior of the steel wire. By pulling and drawing the steel into a linear shape, a smaller wire diameter is obtained, so that the composite capillary layer will not be broken easily and can be used for making a finer woven mesh which can be installed in a thinner vapor chamber.
    Type: Grant
    Filed: March 24, 2020
    Date of Patent: July 13, 2021
    Assignee: TAIWAN MICROLOOPS CORP.
    Inventor: Chun-Hung Lin
  • Patent number: 11044832
    Abstract: A water-cooled pressurized distributive heat dissipation system includes a water tank having a distributing duct, branch modules separately corresponding to the servers and a converging duct. Each branch module has a branch pipe inserted into a corresponding one of the servers and a water block connecting to the branch pipe. An end of each of the branch pipe connects to the distributing duct in order. The converging duct connects to another end of each branch pipe in order. A working fluid is accommodated in the water tank and driven by a pump to flow toward the distributing duct to the branch modules and the converging duct. A flow direction of the working fluid in the distributing duct is the same as a flow direction of the working fluid in the converging duct.
    Type: Grant
    Filed: October 16, 2019
    Date of Patent: June 22, 2021
    Assignee: TAIWAN MICROLOOPS CORP.
    Inventors: Yen-Chia Huang, Chun-Hung Lin
  • Patent number: 11044833
    Abstract: A water-cooled pressurized distributive heat dissipation system used for dissipating heat of servers in the rack is provided. The servers are fixed in the rack in a ranging direction. The system includes a water tank having a distributing duct, branch modules separately corresponding to the servers and a converging duct. Each branch module has a branch pump and a water block in a corresponding one of the servers. The branch pump of each branch module connects between the distributing duct and the water block. The converging duct connects to the water blocks in the ranging direction.
    Type: Grant
    Filed: October 16, 2019
    Date of Patent: June 22, 2021
    Assignee: TAIWAN MICROLOOPS CORP.
    Inventors: Yen-Chia Huang, Chun-Hung Lin
  • Patent number: 10999952
    Abstract: A vapor chamber and a manufacturing method thereof are provided. The vapor chamber includes a housing, a capillary structure, at least two liquid-filling and gas-discharging pipes and a working fluid; the housing has a bottom housing plate and a top housing plate correspondingly engaged and sealed with the bottom housing plate, and a single chamber is formed between the top housing plate and the bottom housing plate; the capillary structure is disposed in the single chamber; each of the liquid-filling and gas-discharging pipes is allowed to penetrate into the housing and communicate with the single chamber; and the working fluid is disposed in the single chamber. Accordingly, the working fluid can be evenly and widely distributed in the single chamber.
    Type: Grant
    Filed: January 2, 2020
    Date of Patent: May 4, 2021
    Assignee: TAIWAN MICROLOOPS CORP.
    Inventors: Chun-Hung Lin, Chien-Cheng Hsu
  • Patent number: 10927842
    Abstract: A cooling fan module includes a fan frame, a light emitting part installed in the fan frame, an LED controller installed in the fan frame and electrically connected to the light emitting part, a fan body, and an external connector. The fan body includes a supporting stand detachably connected to the fan frame, a blade set installed on the supporting stand and can rotate with respect to the supporting stand, and a fan connector fixed to the supporting stand and electrically connected to the blade set. The external connector is fixed to the fan frame. The external connector can be electrically plugged in the fan connector to send a first signal; the external connector is electrically connected to the LED controller to send a second signal. Therefore, the cooling fan module has the advantages of easy assembly and reduced incorrect connection.
    Type: Grant
    Filed: July 25, 2018
    Date of Patent: February 23, 2021
    Assignee: TAIWAN MICROLOOPS CORP.
    Inventors: Chun-Hung Lin, Yi-Shen Chien
  • Patent number: 10483190
    Abstract: In a thermal conduction structure and its manufacturing method, the thermal conduction structure includes a vapor chamber, a heat pipe and a working fluid. The vapor chamber includes an upper casing, a lower casing, and a cavity formed between the lower and upper casings. The upper casing has a through hole communicated with the cavity and a first capillary tissue disposed on the internal surface of the upper casing. The first capillary tissue has a penetrating hole corresponsive to the through hole. The heat pipe includes a tube and a second capillary tissue disposed in the tube and extended out from the tube to define an exposed section, and the heat pipe is passed and coupled to the through hole, and the exposed section is passed through the penetrating hole to attach to the first capillary tissue. The working fluid is filled in the cavity.
    Type: Grant
    Filed: June 6, 2017
    Date of Patent: November 19, 2019
    Assignee: TAIWAN MICROLOOPS CORP.
    Inventor: Chun-Hung Lin
  • Patent number: 10288356
    Abstract: A vapor chamber and heat pipe combined structure and method; the vapor chamber and heat pipe combined structure includes a heat pipe, a vapor chamber and a working fluid. The heat pipe includes a pipe body, a fixing section, and a first capillary tissue. The vapor chamber includes an upper metal casing, a lower metal casing, a containing chamber and a second capillary tissue installed in the containing chamber. The working fluid is filled into the containing chamber, and the fixing section of the heat pipe is coupled to the upper metal casing, so that the first capillary tissue is coupled to the second capillary tissue. The combined structure facilitates the connection and fixation of the heat pipe and improves the reflux speed of the liquid-state working fluid.
    Type: Grant
    Filed: October 14, 2016
    Date of Patent: May 14, 2019
    Assignee: TAIWAN MICROLOOPS CORP.
    Inventor: Chun-Hung Lin
  • Patent number: 10048015
    Abstract: A liquid-vapor separating type heat conductive structure includes a vapor chamber, a heat pipe, a separation plate, and a working fluid. The vapor chamber includes a housing and a cavity. The housing includes a bottom plate and an upright plate. A first capillary structure is disposed on an inner surface of the bottom plate, and a through hole is formed on the upright plate. The heat pipe includes a pipe body and a second capillary structure. The pipe body includes an open end, the open end of the pipe body is inserted and sealingly connected to the through hole. The separation plate is disposed at the open end and covers the first capillary structure and the second capillary structure, so as to form a vapor passage and a liquid passage at two sides of the separation plate respectively. The working fluid is filled inside the cavity.
    Type: Grant
    Filed: May 24, 2017
    Date of Patent: August 14, 2018
    Assignee: TAIWAN MICROLOOPS CORP.
    Inventor: Chun-Hung Lin
  • Patent number: 10018427
    Abstract: A vapor chamber structure includes an upper metal casing, a lower metal casing, a partition plate and a working fluid. The lower metal casing is engaged and sealed with the upper metal casing, and a containing chamber is formed between the upper metal casing and the lower metal casing. The partition plate is laid inside the containing chamber and includes a gas channel configured to be facing the upper metal casing. The working fluid is filled in the containing chamber. Therefore, the gas evaporated in the vapor chamber will move along a fixed path to prevent the occurrence of turbulence effectively.
    Type: Grant
    Filed: September 8, 2016
    Date of Patent: July 10, 2018
    Assignee: TAIWAN MICROLOOPS CORP.
    Inventor: Chun-Hung Lin
  • Patent number: 10012445
    Abstract: A vapor chamber and heat pipe combined structure includes a vapor chamber, a first capillary tissue, a heat pipe, and a working fluid. The vapor chamber includes an upper metal casing, a lower metal casing, a containing chamber between the upper and lower metal casings, a riser at the lower metal casing, and a through hole communicated with the containing chamber. The first capillary tissue is installed in the containing chamber and has a receiving hole corresponsive to the through hole. The heat pipe includes a pipe body and a second capillary tissue installed in the pipe body and extended out of the pipe body to form an exposed section. The heat pipe is connected to the through hole and the receiving hole, so that the exposed section is attached to the receiving hole of the first capillary tissue. The working fluid is filled into the containing chamber.
    Type: Grant
    Filed: September 8, 2016
    Date of Patent: July 3, 2018
    Assignee: TAIWAN MICROLOOPS CORP.
    Inventor: Chun-Hung Lin
  • Patent number: 9841246
    Abstract: In a dual material vapor chamber and an upper shell thereof, the dual material vapor chamber includes an upper shell, a copper lower shell, and a working fluid. The upper shell includes an aluminum substrate and plural aluminum fins. The aluminum substrate has an outer surface and an inner wall. The aluminum fins individually extend from the outer surface and are formed integrally. A copper deposition layer is coated on the inner wall. The copper lower shell is sealed to the upper shell correspondingly. A chamber is formed between the upper shell and the copper lower shell. The working fluid is filled in the chamber. Therefore, the weight and material cost of the whole vapor chamber can be reduced, and the packing combination between the upper shell and the copper lower shell can be simplified.
    Type: Grant
    Filed: March 21, 2016
    Date of Patent: December 12, 2017
    Assignee: TAIWAN MICROLOOPS CORP.
    Inventor: Chun-Hung Lin
  • Patent number: 8074706
    Abstract: A heat spreader comprising a casing, a micro-structure layer, a support device, and a working fluid is provided. The casing has an inner surface and is defined by a sealed chamber where the working fluid circulates therein. The micro-structure layer is formed on the inner surface of the casing, wherein the micro-structure layer comprises a first structure layer which is formed by the first metallic mesh. Specifically, the first metallic mesh forms the first structure layer on the inner surface through diffusion bonding so that the working fluid can circulate within the micro-structure layer by capillary action. In addition, the support device is disposed in the sealed chamber for supporting the casing. Thus, a heat spreader with a composite micro-structure can not only enhance the capillarity but also reduce the flowing resistance during operation.
    Type: Grant
    Filed: April 20, 2007
    Date of Patent: December 13, 2011
    Assignee: Taiwan Microloops Corp.
    Inventors: Cherng-Yuh Su, Kuo-Ying Lee, Chien-Hung Liin
  • Publication number: 20080040925
    Abstract: The present invention discloses a heat spreader and method for making the heat spreader. The heat spreader comprises: a hollow metallic housing including an upper cover having an inner surface and a lower cover having an inner surface, the upper and lower covers being bonded together along their perimeters defining a cavity; a capillary structure in a form of metallic meshes bonded to the inner surfaces of the upper and lower covers of the metallic housing; a plurality of reinforcing members disposed in the cavity and bonded between the inner surfaces of the upper and lower covers of the metallic housing; and a working fluid receive in the cavity; wherein bonded surfaces between the metallic meshes and the inner surfaces of the metallic housing, the upper cover and the lower cover, and the reinforcing members and the inner surfaces of the metallic housing all are diffusion-bonded interfaces.
    Type: Application
    Filed: October 17, 2007
    Publication date: February 21, 2008
    Applicant: Taiwan Microloops Corp.
    Inventors: Kuo-Ying Lee, Chien-Wen Chiu, Chien-Hung Lin, Cherng-Yuh Su
  • Publication number: 20060098411
    Abstract: The present invention discloses a heat spreader and method for making the heat spreader. The heat spreader comprises: a hollow metallic housing including an upper cover having an inner surface and a lower cover having an inner surface, the upper and lower covers being bonded together along their perimeters defining a cavity; a capillary structure in a form of metallic meshes bonded to the inner surfaces of the upper and lower covers of the metallic housing; a plurality of reinforcing members disposed in the cavity and bonded between the inner surfaces of the upper and lower covers of the metallic housing; and a working fluid receive in the cavity; wherein bonded surfaces between the metallic meshes and the inner surfaces of the metallic housing, the upper cover and the lower cover, and the reinforcing members and the inner surfaces of the metallic housing all are diffusion-bonded interfaces.
    Type: Application
    Filed: May 27, 2005
    Publication date: May 11, 2006
    Applicant: Taiwan Microloops Corp.
    Inventors: Kuo-Ying Lee, Chien-Wen Chiu, Chien-Hung Lin, Cherng-Yuh Su