Patents Assigned to TAIWAN SEMICODUCTOR MANUFACTURING COMPANY, LTD.
  • SEMICONDUCTOR DEVICE HAVING A BOUNDARY STRUCTURE, A PACKAGE ON PACKAGE STRUCTURE, AND A METHOD OF MAKING
    Publication number: 20150069604
    Abstract: A semiconductor device includes a substrate and a first conductive pad on a top surface of the substrate. The semiconductor device further includes a boundary structure on the top surface of the substrate around the conductive pad.
    Type: Application
    Filed: September 9, 2013
    Publication date: March 12, 2015
    Applicant: TAIWAN SEMICODUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chien Ling HWANG, Yeong-Jyh LIN, Bor-Ping JANG, Hsiao-Chung LIANG