Abstract: A method for forming an alpha-tantalum layer comprising disposing a nitrogen containing base layer on a semiconductor substrate, bombarding the nitrogen containing base layer with a bombarding element, thereby forming an alpha-tantalum seed layer, and sputtering a layer of tantalum on the alpha-tantalum seed layer, thereby forming a surface layer of substantially alpha-tantalum.
Type:
Grant
Filed:
November 1, 2007
Date of Patent:
June 28, 2011
Assignee:
Taiwan Semiconductor Company, Ltd.
Inventors:
Jung-Chih Tsao, Miao-Cheng Liao, Phil Sun, Kei-Wei Chen