Abstract: A multilayer semiconductor device structure comprising a first buried oxide and a first semiconductor device layer fabricated above the first buried oxide is provided. The first semiconductor device layer comprises a patterned top surface. The patterned surface comprises insulator material and conductor material. The surface density of the insulator material is greater than 40 percent. The multilayer semiconductor device structure further comprises a second buried oxide bonded to the patterned surface of the first semiconductor device layer and a second semiconductor device layer fabricated above the second buried oxide.

Abstract: A stabilizing circuit is provided that is connected to a biased voltage. The stabilizing circuit is configured to inhibit a change in voltage of the biased voltage caused by a first change in voltage of one or more nodes that are connected to the biased voltage through a first parasitic capacitance. In some embodiments, the stabilizing circuit induces a voltage on the biased voltage through a second parasitic capacitance that changes from a first voltage level to a second voltage level during the first change in voltage such that a total change in parasitic voltage that is induced at the biased voltage during the first change in voltage is close to 0 V.

Abstract: Among other things, one or more techniques for enhancing device (e.g., transistor) performance are provided herein. In one embodiment, device performance is enhanced by forming an extended dummy region at an edge of a region of a device and forming an active region at a non-edge of the region. Limitations associated with semiconductor fabrication processing present in the extended dummy region more so than in non-edge regions. Accordingly, a device exhibiting enhanced performance is formed by connecting a gate to the active region, where the active region has a desired profile because it is comprised within a non-edge of the region. A dummy device (e.g., that may be less responsive) may be formed to include the extended dummy region, where the extended dummy region has a less than desired profile due to limitations associated with semiconductor fabrication processing, for example.

Abstract: An object of the present invention is to provide a charged-device model (CDM) electrostatic discharge (ESD) protection circuit for an integrated circuit (IC). The ESD protection circuit comprises an ESD clamp device and a functional component. The ESD clamp device is coupled to a pad and a substrate having a first conductivity type. Under normal power operation, the ESD clamp device is closed. The functional component is formed on the substrate and coupled to the pad. The functional component has a first well having the first conductivity type and an isolating region having a second conductivity type for isolating the first well from the substrate. Under normal power operation, the functional component transmits signals between the IC and an external linkage. During an CDM ESD event, the CDM charges accumulated in the substrate are discharged via the ESD clamp circuit. Hence, the functional component is protected.