Patents Assigned to Taiwan Semiconductor Manufacturing Ltd. Co.
  • SOI chip with mesa isolation and recess resistant regions
    Patent number: 6979867
    Abstract: A semiconductor-on-insulator structure includes a substrate and a buried insulator layer overlying the substrate. A plurality of semiconductor islands overlie the buried insulator layer. The semiconductor islands are isolated from one another by trenches. A plurality of recess resistant regions overlie the buried insulator layer at a lower surface of the trenches.
    Type: Grant
    Filed: December 27, 2004
    Date of Patent: December 27, 2005
    Assignee: Taiwan Semiconductor Manufacturing Ltd. Co.
    Inventors: Yee-Chia Yeo, Hao-Yu Chen, Hsun-Chih Tsao, Fu-Liang Yang, Chenming Hu