Patents Assigned to Taiwan Semiconductor Manufaturing Co., Ltd.
  • Patent number: 10727111
    Abstract: A method includes: forming a first conductive structure in a first dielectric layer; forming a conductive protection structure that is coupled to at least part of the first conductive structure; forming a second dielectric layer over the first dielectric layer; forming a via hole extending through at least part of the second dielectric layer to expose a portion of the conductive protection structure; cleaning the via hole; and refilling the via hole with a conductive material to form a via structure.
    Type: Grant
    Filed: July 18, 2017
    Date of Patent: July 28, 2020
    Assignee: Taiwan Semiconductor Manufaturing Co., Ltd.
    Inventors: Hung-Chih Yu, Chien-Mao Chen
  • Patent number: 9991123
    Abstract: A semiconductor device is provided. The semiconductor device includes a semiconductor substrate including a first doped region and a second doped region and a gate stack on the semiconductor substrate. The semiconductor device also includes a main spacer layer on a sidewall of the gate stack and a protection layer between the main spacer layer and the semiconductor substrate. The protection layer is doped with a quadrivalent element. The semiconductor device further includes an insulating layer formed over the semiconductor substrate and the gate stack and a contact formed in the insulating layer. The contact includes a first portion contacting the first doped region, and the contact includes a second portion contacting the second doped region. The first portion extends deeper into the semiconductor substrate than the second portion.
    Type: Grant
    Filed: May 2, 2017
    Date of Patent: June 5, 2018
    Assignee: TAIWAN SEMICONDUCTOR MANUFATURING CO., LTD.
    Inventors: Mei-Chun Chen, Ching-Chen Hao, Wen-Hsin Chan, Chao-Jui Wang
  • Publication number: 20140252525
    Abstract: A method and device is disclosed for reducing noise in CMOS image sensors. An improved CMOS image sensor includes a light sensing structure surrounded by a support feature section. An active section of the light sensing structure is covered by no more than optically transparent materials. A light blocking portion includes an opaque layer or a black light filter layer in conjunction with an opaque layer, covering the support feature section. The light blocking portion may also cover a peripheral portion of the light sensing structure. The method for forming the CMOS image sensors includes using film patterning and etching processes to selectively form the opaque layer and the black light filter layer where the light blocking portion is desired, but not over the active section. The method also provides for forming microlenses over the photosensors in the active section.
    Type: Application
    Filed: May 23, 2014
    Publication date: September 11, 2014
    Applicant: Taiwan Semiconductor Manufaturing Co., Ltd.
    Inventors: Tien-Chi WU, Tsung-Yi LIN
  • Publication number: 20040220996
    Abstract: The present invention provides a multiple platform computer network having: at least one client device; a main service platform, the main service platform in selective communication with the client device when the client device is properly authenticated and authorized for use with the main service platform; a support platform for providing support to the main service platform; a dummy log-in user interface for interfacing between the main service platform and the at least one client device; and a control handling system for handling communications between the main service platform and the support platform. Optionally, a content ID mapping table capable of associating each of a plurality of support platform user numbers with content accessible within the support platform is provided. Two methods of using a multiple platform computer network to simplify access to the network and to reduce licensing fees associated with user access is provided herewithin.
    Type: Application
    Filed: April 29, 2003
    Publication date: November 4, 2004
    Applicant: Taiwan Semiconductor Manufaturing Co., Ltd.
    Inventors: Chien-Chung Huang, Gean-Weijeffrey Liou, Tien-Der Chiang, Chun-Yi Chen, Wen-Chang Kuo