Patents Assigned to Taiwan Semiconductore Manufaturing Co., Ltd
  • Publication number: 20220149180
    Abstract: The present disclosure relates to a semiconductor device that includes a first terminal formed on a fin region and having a first spacer. The semiconductor device further includes a second terminal having a hard mask and a second spacer opposing the first spacer. The hard mask and the second spacer are formed using different materials. The semiconductor device also includes a seal layer formed between first and second spacers of the first and second terminals, respectively. The semiconductor device further includes an air gap surrounded by the seal layer, the fin region, and the first and second spacers.
    Type: Application
    Filed: January 24, 2022
    Publication date: May 12, 2022
    Applicant: Taiwan Semiconductore Manufaturing Co., Ltd
    Inventor: Yi-Lun CHEN