Abstract: A light-emitting diode (LED) module includes a substrate, an LED, a first encapsulation element and a second light-pervious encapsulation element. The substrate has a first surface, a second surface, a circuit layer and an opening, wherein the opening penetrates through the first surface and the second surface, and the circuit layer includes at least one first conductive contact disposed on the first surface. The LED is disposed in the opening and is electrically connected to the first conductive contact. The first encapsulation element and the second light-pervious encapsulation element are respectively disposed on the first surface and the second surface, for encapsulating the LED and the first conductive contact. The aforementioned LED module may output light from the back of the LED, thereby improving the light output efficiency of the LED module. A manufacturing method of the aforementioned LED module is also herein disclosed.

Abstract: A manufacture method of light emitting diode (LED) module includes: providing a carrier board including a carrying area and a shaping area; arranging at least one substrate having at least one circuit layer in the carrying area of the carrier board; arranging at least one LED in the carrying area of the carrier board; electrically connecting the LED to the circuit layer of the substrate; encapsulating the LED and at least part of the circuit layer by at least one light transmissive encapsulation element; and fabricating the shaping area of the carrier board into a desired appearance. The above-mentioned carrier board not only can be a heat sink but also can be easily fabricated into various types of design shapes. Therefore, a light emitting diode module manufactured by the above-mentioned method has preferred heat dissipation effects and a better appearance with relatively low production costs.

Abstract: The present invention discloses a chip package carrier and a fabrication method, which have the advantages of high reliability, thickness reduction and the scale reduction. The carrier and the method uses blind holes., which penetrates the substrate but external traces and external bonding pads, which cover the external traces. A chip can be installed and encapsulated directly on a first surface.

Abstract: A chip package structure and its fabrication method are disclosed. Method of electrically connecting a chip with plural different metal layers is utilized to replace the conventional method of connecting identical metal layer merely. Besides, the method of a protective layer directly set on the metal layer to cover the chip and the conductive connecting structure is different from the general method of coating the solder mask on the metal layer. Moreover, a carrier utilized for support makes lighter and thinner substrate be fabricated. The fabrication method is utilized to manufacture by using the fabrication process of present package manufacturing. No additional equipments and fabrication processes are needed so that the PCB production flow may be simplified to reduce the package cost.

Abstract: The present invention discloses a manufacture method for a thin double-sided package substrate, which includes steps: providing a carrier; respectively forming a first conductive layer and a second conductive layer on the upper and lower surfaces of the carrier; forming a through-hole penetrating the first conductive layer and the carrier but not penetrating the second conductive layer; setting a conductive element in the through-hole to electrically connect the first conductive layer with the second conductive layer; forming desired circuits on the first conductive layer and/or the second conductive layer; forming a first metal layer on the first conductive layer and/or the second conductive layer; and removing the carrier located in a predetermined region to form a chip receiving bay.

Abstract: A fabrication method for a chip packaging structure disclosed herein is utilizing the method of plating metal to connect different layers so as to replace the traditional method that drill hole firstly and then plate metal in the hole. In the present invention, the metal in the conductive through hole is solid metal so as can provide good ability of heat sinking. Besides, the present fabrication method utilizes the existing manufacturing processes without extra process or equipment so as can decrease the PCB processes and lower the package cost.