Abstract: A method for fixation, onto a layer comprising an amorphous carbon film and provided on a base material, of a layer comprising a material condensation-reacting with hydroxyl groups on a surface of the amorphous carbon film, whereby, in the layer comprising an amorphous carbon film and provided on the base material, the amorphous carbon film can have a holding power which is strong enough to fix the layer comprising a material condensation-reacting with a hydroxyl group on the surface of the amorphous carbon film and can have uniformity of the holding power. Si and O are added into the layer comprising an amorphous carbon film to thereby improve adhesion durability and binding uniformity of the layer comprising a material condensation-reacting with a hydroxyl group.

Abstract: One object is to provide a structure including a thin primer film formed by a dry process and tightly bound to a fluorine-containing silane coupling agent. In accordance with one aspect, a structure according to an embodiment of the present disclosure includes: a substrate; and a thin primer film containing at least one substance selected from the group consisting of silicon, titanium, aluminum, aluminum oxide, and zirconium and formed on a surface of the substrate by a dry process.

Abstract: [Object] One object is to provide a primer composition composed of an amorphous carbon material and used for forming a primer layer that tightly binds with fluorine-containing silane coupling agent. A primer composition according to an embodiment of the present disclosure is composed of an amorphous carbon material containing at least one element of silicon, oxygen, and nitrogen.

Abstract: [Object] To provide a screen printing stencil including an amorphous carbon film, such as a DLC film, and a water-oil-repellent layer provided on at least part of the amorphous carbon film so as to exhibit high fixability. [Solution] A screen printing plate 10 of an embodiment of the present invention includes a mesh 16 fixed to a frame body 12; an emulsion layer 14 which fills up the mesh 16 and has a print pattern opening 18; an amorphous carbon film formed on at least part of the surface of an inner wall 22 of the print pattern opening 18 and composed of at least one element of silicon, oxygen, and nitrogen; and a thin film 20 of a fluorine-containing silane coupling agent formed on at least part of the amorphous carbon film.

Abstract: A method for fixation, onto a layer comprising an amorphous carbon film and provided on a base material, of a layer comprising a material condensation-reacting with hydroxyl groups on a surface of the amorphous carbon film, whereby, in the layer comprising an amorphous carbon film and provided on the base material, the amorphous carbon film can have a holding power which is strong enough to fix the layer comprising a material condensation-reacting with a hydroxyl group on the surface of the amorphous carbon film and can have uniformity of the holding power. Si and O are added into the layer comprising an amorphous carbon film to thereby improve adhesion durability and binding uniformity of the layer comprising a material condensation-reacting with a hydroxyl group.

Abstract: A tin electrolytic plating solution comprises a suitably selected nonionic surfactant having a branched alkyl group. The nonionic surfactant is contained either alone, or with a suitably selected cationic surfactant and/or a suitably selected alkyl imidazole. The invention also provides a tin electrolytic plating method using such a tin electrolytic plating solution, and a tin electroplated electronic part obtained by such a method.

Abstract: There are provided an electronic component having external electrodes and a method for manufacturing thereof for which treatment of the wastewater is not needed and has electrolytically plated layers which are substantially plated only on the conductive layers but not on the ceramic surfaces. In the method for manufacturing the electronic component, an activation treatment is performed in which palladium is deposited on a conductive layer on the electronic component, and then electrolytic Ni plating and electrolytic solder plating are performed sequentially.