Patents Assigned to Taiyo Holdings Co., Ltd.
  • Publication number: 20210301129
    Abstract: The present invention provides a poly(phenylene ether) which retains low-dielectric characteristics and is soluble in various solvents. The poly(phenylene ether) is characterized by being obtained from one or more raw-material phenols including a phenol satisfying at least Requirement 1 (to have hydrogen atoms in the ortho and para positions) and by having a slope calculated from a conformational plot of less than 0.6.
    Type: Application
    Filed: July 17, 2019
    Publication date: September 30, 2021
    Applicant: TAIYO HOLDINGS CO., LTD.
    Inventors: Mami NOSAKA, Satoko MATSUMURA, Nobuhiro ISHIKAWA, Toshiaki MASUDA
  • Patent number: 9453137
    Abstract: A photocurable and thermally curable composition having a viscosity suitable for application to an inkjet printer is prepared. By the composition, it is made possible to directly draw a pattern on a substrate for a printed wiring board. The composition is cured at a relatively low temperature, having excellent adhesion, chemical resistance, heat resistance, and insulating properties after curing. The photocurable and thermally curable composition includes a (meth)acryloyl group-containing monomer, a block isocyanate, and a photo-polymerization initiator, wherein the composition is applicable to inkjet printing.
    Type: Grant
    Filed: March 25, 2013
    Date of Patent: September 27, 2016
    Assignee: Taiyo Holdings Co., Ltd.
    Inventors: Sungho Choi, Masayuki Shimura, Takeshi Yoda, Shigeru Ushiki
  • Patent number: 9423691
    Abstract: In a layered structure having at least a substrate and a photosensitive resin layer or cured film layer formed on the substrate and containing an inorganic filler, the content of the inorganic filler in the photosensitive resin layer or cured film layer is low on the side contacting the substrate and high on the surface side away from the substrate, so that a linear thermal expansion coefficient of the photosensitive resin layer or cured film layer as a whole is maintained as low as possible. Preferably, the inorganic filler content in the layer gradually increases continuously obliquely or stepwise from the side contacting the substrate to the surface side away from the substrate. A photosensitive dry film containing the above-mentioned photosensitive resin layer is suitable for use as a solder resist or an interlayer resin insulation layer of a printed wiring board.
    Type: Grant
    Filed: March 16, 2015
    Date of Patent: August 23, 2016
    Assignee: TAIYO HOLDINGS CO., LTD.
    Inventors: Takahiro Yoshida, Shouji Minegishi, Masao Arima
  • Patent number: 9282644
    Abstract: Disclosed is a photosensitive resin composition which has excellent concealing properties for appearance defects of a circuit and the like, while having excellent coloring power and resolution that enable the formation of a high-resolution solder resist layer. Specifically disclosed is a photosensitive resin composition which contains a perylene coloring agent, a coloring agent that is in a complementary color relation with the perylene coloring agent, a carboxyl group-containing resin, a compound that contains two or more ethylenically unsaturated groups in each molecule, and a photopolymerization initiator.
    Type: Grant
    Filed: August 27, 2014
    Date of Patent: March 8, 2016
    Assignee: TAIYO HOLDINGS CO., LTD.
    Inventors: Chiho Ueta, Seiryo Kamata
  • Patent number: 9091921
    Abstract: In a layered structure having at least a substrate and a photosensitive resin layer or cured film layer formed on the substrate and containing an inorganic filler, the content of the inorganic filler in the photosensitive resin layer or cured film layer is low on the side contacting the substrate and high on the surface side away from the substrate, so that a linear thermal expansion coefficient of the photosensitive resin layer or cured film layer as a whole is maintained as low as possible. Preferably, the inorganic filler content in the layer gradually increases continuously obliquely or stepwise from the side contacting the substrate to the surface side away from the substrate. A photosensitive dry film containing the above-mentioned photosensitive resin layer is suitable for use as a solder resist or an interlayer resin insulation layer of a printed wiring board.
    Type: Grant
    Filed: August 8, 2012
    Date of Patent: July 28, 2015
    Assignee: TAIYO HOLDINGS CO., LTD.
    Inventors: Takahiro Yoshida, Shouji Minegishi, Masao Arima
  • Publication number: 20150185603
    Abstract: In a layered structure having at least a substrate and a photosensitive resin layer or cured film layer formed on the substrate and containing an inorganic filler, the content of the inorganic filler in the photosensitive resin layer or cured film layer is low on the side contacting the substrate and high on the surface side away from the substrate, so that a linear thermal expansion coefficient of the photosensitive resin layer or cured film layer as a whole is maintained as low as possible. Preferably, the inorganic filler content in the layer gradually increases continuously obliquely or stepwise from the side contacting the substrate to the surface side away from the substrate. A photosensitive dry film containing the above-mentioned photosensitive resin layer is suitable for use as a solder resist or an interlayer resin insulation layer of a printed wiring board.
    Type: Application
    Filed: March 16, 2015
    Publication date: July 2, 2015
    Applicant: TAIYO HOLDINGS CO., LTD.
    Inventors: Takahiro YOSHIDA, Shouji MINEGISHI, Masao ARIMA
  • Patent number: 9012559
    Abstract: Provided is a heat curable adhesive that can strongly bond a base material formed of a crystalline polyester resin, can freely regulate the thickness of an adhesive layer, has excellent chemical resistance, and, at the same time, has excellent storage stability. Furthermore, provided is a resin laminated-type IC card, in which a liquid heat curable adhesive of which use has been difficult in the past can be used, and the liquid heat curable adhesive can be coated with a good accuracy by a printing method without the need to perform molding into a hot-melt sheet to bond a base material formed of a crystalline polyester resin. Accordingly, the resin laminated-type IC card can have a high degree of freedom in design of the thickness of an IC card. The heat curable adhesive comprises (a) a hydroxyl group-containing non-crystalline polyester resin, (b) a resin containing a carboxylic acid anhydride, and (c) a solvent for dissolving (a) the hydroxyl group-containing non-crystalline polyester resin.
    Type: Grant
    Filed: June 10, 2009
    Date of Patent: April 21, 2015
    Assignee: Taiyo Holdings Co., Ltd.
    Inventors: Chihiro Funakoshi, Yoshitomo Aoyama
  • Publication number: 20150064417
    Abstract: A photocurable and thermally curable composition having a viscosity suitable for application to an inkjet printer is prepared. By the composition, it is made possible to directly draw a pattern on a substrate for a printed wiring board. The composition is cured at a relatively low temperature, having excellent adhesion, chemical resistance, heat resistance, and insulating properties after curing. The photocurable and thermally curable composition includes a (meth)acryloyl group-containing monomer, a block isocyanate, and a photo-polymerization initiator, wherein the composition is applicable to inkjet printing.
    Type: Application
    Filed: March 25, 2013
    Publication date: March 5, 2015
    Applicant: TAIYO HOLDINGS CO., LTD.
    Inventors: Sungho Choi, Masayuki Shimura, Takeshi Yoda, Shigeru Ushiki
  • Patent number: 8962712
    Abstract: An alkali-developable photosensitive resin composition comprises a carboxyl group-containing urethane resin having a biphenyl novolak structure, a photopolymerization initiator, and aluminum hydroxide and/or a phosphorus-containing compound. The composition may be formulated as a photocurable and thermosetting resin composition by further incorporating therein a thermosetting component having a plurality of cyclic ether groups and/or cyclic thioether groups in the molecule, besides the components described above. The photosensitive resin composition may further contain a colorant.
    Type: Grant
    Filed: June 14, 2012
    Date of Patent: February 24, 2015
    Assignee: Taiyo Holdings Co., Ltd.
    Inventors: Nobuhito Ito, Kazuyoshi Yoneda, Masao Arima
  • Publication number: 20140360758
    Abstract: Disclosed is a photosensitive resin composition which has excellent concealing properties for appearance defects of a circuit and the like, while having excellent coloring power and resolution that enable the formation of a high-resolution solder resist layer. Specifically disclosed is a photosensitive resin composition which contains a perylene coloring agent, a coloring agent that is in a complementary color relation with the perylene coloring agent, a carboxyl group-containing resin, a compound that contains two or more ethylenically unsaturated groups in each molecule, and a photopolymerization initiator.
    Type: Application
    Filed: August 27, 2014
    Publication date: December 11, 2014
    Applicant: TAIYO HOLDINGS CO., LTD.
    Inventors: Chiho UETA, Seiryo KAMATA
  • Patent number: 8765831
    Abstract: Provided is a photocurable resin composition, which has sensitivity equal to or greater than existing compositions, has alkali development properties, and which produces a cured product that does not become brittle with changes in temperature, and which also has excellent reliability in terms of water resistance, electrical insulating properties, PCT resistance, and the like. The photocurable resin composition comprises a carboxyl group-containing resin, a photopolymerization initiator, a vinyl group-containing elastomer, and a styryl group-containing compound.
    Type: Grant
    Filed: July 21, 2010
    Date of Patent: July 1, 2014
    Assignee: Taiyo Holdings Co., Ltd.
    Inventors: Shoji Minegishi, Masao Arima
  • Patent number: 8748502
    Abstract: Disclosed is a photocurable resin composition which comprises a photopolymerization initiator having two oxime ester groups in the molecule, a resin containing a carboxyl group, and a compound having two or more ethylenically unsaturated groups in the molecule. The composition can achieve high sensitivity, can provide a dried coating film having excellent touch dryness of fingers, can prevent the generation of an out gas during curing or the like, and can achieve all of excellent alignment accuracy, high productivity and high reliability in the formation of a solder resist for a printed wiring board or the like.
    Type: Grant
    Filed: July 14, 2010
    Date of Patent: June 10, 2014
    Assignee: Taiyo Holdings Co., Ltd.
    Inventors: Yoko Shibasaki, Masao Arima
  • Patent number: 8722816
    Abstract: A solder resist having both adequate sensitivity at photo-irradiation and alkali developability, and the solder resist forming a cured product which is excellent in dimensional stability against temperature change, does not exhibit brittleness, and further, is excellent in water resistance, electrical insulation, thermal cycle test resistance (TCT resistance) and the like is provided, and further, a dry film having a solder resist layer, a cured product and a printed wiring board are provided. The solder resist comprising an acid-modified vinyl ester synthesized from an epoxy compound, a phenol compound, an unsaturated monobasic acid and a polybasic acid anhydride, wherein the epoxy compound contains a crystalline epoxy resin having a melting point of 90° C. or more, and the phenol compound contains a compound having a bisphenol S structure.
    Type: Grant
    Filed: March 4, 2008
    Date of Patent: May 13, 2014
    Assignees: Nippon Shokubai Co., Ltd., Taiyo Holdings Co., Ltd.
    Inventors: Nobuaki Otsuki, Manabu Akiyama, Shouji Minegishi, Masao Arima
  • Patent number: 8642234
    Abstract: A carboxyl group-containing photosensitive resin is obtained by reacting an ?,?-ethylenically unsaturated group-containing monocarboxylic acid (c) with a phenolic compound (a) containing the structure represented by the following general formula (I) and having at least two phenolic hydroxyl groups in its molecule, wherein part or the whole of the phenolic hydroxyl groups being modified into an oxyalkyl group, and further reacting a polybasic acid anhydride (d) with the resultant reaction product; wherein R1 represents either one of a hydrocarbon radical of 1 to 11 carbon atoms, a SO2 group, an oxygen atom and sulfur atom, R2 represents a hydrocarbon radical of 1 to 11 carbon atoms, “a” represents an integer of 0 to 3, “n” represents an integer of 1 to 2, and “m” represents an integer of 1 to 10.
    Type: Grant
    Filed: September 13, 2011
    Date of Patent: February 4, 2014
    Assignees: Taiyo Holdings Co., Ltd., Showa Denko K.K.
    Inventors: Nobuhito Ito, Masao Arima, Syouji Nishiguchi, Kouji Ogawa, Masayuki Kobayashi, Atsushi Sakamoto
  • Publication number: 20130192886
    Abstract: Provided is a heat-curable resin filler in which the deterioration in thixotropic properties over time can be prevented and which has excellent shape retaining properties after being filled in hole parts in a printed wiring board and being cured and also has excellent abradability. The heat-curable resin filler comprises an epoxy resin, an epoxy resin curing agent, an inorganic filler and a fatty acid represented by the following general formula: (R1COO)n-R2 (wherein the substituent R1 represents a hydrocarbon group having 5 or more carbon atoms; the substituent R2 represents a hydrogen atom, an metal alkoxide group or a metal atom; and n is 1 to 4).
    Type: Application
    Filed: September 27, 2011
    Publication date: August 1, 2013
    Applicant: TAIYO HOLDINGS CO., LTD.
    Inventor: Arata Endo
  • Publication number: 20130048357
    Abstract: Disclosed is a photosensitive resin composition which has excellent concealing properties for appearance defects of a circuit and the like, while having excellent coloring power and resolution that enable the formation of a high-resolution solder resist layer. Specifically disclosed is a photosensitive resin composition which contains a perylene coloring agent, a coloring agent that is in a complementary color relation with the perylene coloring agent, a carboxyl group-containing resin, a compound that contains two or more ethylenically unsaturated groups in each molecule, and a photopolymerization initiator.
    Type: Application
    Filed: September 24, 2010
    Publication date: February 28, 2013
    Applicant: TAIYO HOLDINGS CO., LTD.
    Inventors: Chiho Ueta, Seiryo Kamata
  • Publication number: 20120308838
    Abstract: Disclosed are: a photocurable resin composition which may be developed with an alkali, has excellent resolution properties, and enables a cured article having excellent (humidity) heat resistance and thermal impact resistance to be formed; a dry film; a cured article thereof; and a printed wiring board using the cured article. The photocurable resin composition of the present invention is characterized by containing a carboxyl group-containing resin, a photopolymerization initiator, and surface-treated Neuburg siliceous earth particles.
    Type: Application
    Filed: February 2, 2011
    Publication date: December 6, 2012
    Applicant: TAIYO HOLDINGS CO., LTD.
    Inventors: Nobuhito Ito, Daichi Okamoto, Takahiro Yoshida, Masao Arima
  • Publication number: 20120301825
    Abstract: In a layered structure having at least a substrate and a photosensitive resin layer or cured film layer formed on the substrate and containing an inorganic filler, the content of the inorganic filler in the photosensitive resin layer or cured film layer is lower in a surface layer region away from the substrate than in other region, so that a linear thermal expansion coefficient of the layer as a whole is maintained as low as possible. Preferably, the photosensitive resin layer or cured film layer comprises at least two layers having different inorganic filler contents, wherein the inorganic filler content in the layer on the surface side away from the substrate is lower than the inorganic filler content in the other layer. A photosensitive dry film containing the photosensitive resin layer is suitable for use as a solder resist or an interlayer resin insulation layer of a printed wiring board.
    Type: Application
    Filed: August 8, 2012
    Publication date: November 29, 2012
    Applicant: TAIYO HOLDINGS CO., LTD.
    Inventors: Takahiro YOSHIDA, Shouji Minegishi, Masao Arima
  • Publication number: 20120301824
    Abstract: In a layered structure having at least a substrate and a photosensitive resin layer or cured film layer formed on the substrate and containing an inorganic filler, the content of the inorganic filler in the photosensitive resin layer or cured film layer is low on the side contacting the substrate and high on the surface side away from the substrate, so that a linear thermal expansion coefficient of the photosensitive resin layer or cured film layer as a whole is maintained as low as possible. Preferably, the inorganic filler content in the layer gradually increases continuously obliquely or stepwise from the side contacting the substrate to the surface side away from the substrate. A photosensitive dry film containing the above-mentioned photosensitive resin layer is suitable for use as a solder resist or an interlayer resin insulation layer of a printed wiring board.
    Type: Application
    Filed: August 8, 2012
    Publication date: November 29, 2012
    Applicant: TAIYO HOLDINGS CO., LTD.
    Inventors: Takahiro YOSHIDA, Shouji Minegishi, Masao Arima
  • Publication number: 20120250268
    Abstract: An alkali-developable photosensitive resin composition comprises a carboxyl group-containing urethane resin having a biphenyl novolak structure, a photopolymerization initiator, and aluminum hydroxide and/or a phosphorus-containing compound. The composition may be formulated as a photocurable and thermosetting resin composition by further incorporating therein a thermosetting component having a plurality of cyclic ether groups and/or cyclic thioether groups in the molecule, besides the components described above. The photosensitive resin composition may further contain a colorant.
    Type: Application
    Filed: June 14, 2012
    Publication date: October 4, 2012
    Applicant: TAIYO HOLDINGS CO., LTD.
    Inventors: Nobuhito ITO, Kazuyoshi YONEDA, Masao ARIMA