Abstract: A multi-layer ceramic electronic component includes a multi-layer unit and a side margin. The multi-layer unit includes a functional unit including internal electrodes laminated in a first direction, and a pair of covers that covers the functional unit from both sides in the first direction, the multi-layer unit satisfying a relationship of (2*t2)/t1?0.6, where t1 represents a dimension of the functional unit in the first direction and t2 represents a dimension of each of the pair of covers in the first direction. The side margin covers the multi-layer unit in a second direction orthogonal to the first direction.

Abstract: A ceramic electronic component includes a multilayer body in which internal electrodes are stacked in a first axis direction, the multilayer body having side faces perpendicular to a second axis direction that is orthogonal to the first axis direction, ends of the internal electrodes being positioned at the side faces and aligned within a range of 0.5 ?m in the second axis direction; and side margin portions covering the side faces, respectively, the side margin portions including a ceramic polycrystal as a main component and glass grains dispersed in the polycrystal, a total volume ratio of the glass grains with respect to the polycrystal being 1% or more and 20% or less, a median diameter of the glass grains is 0.20 ?m or more and less than 0.75 ?m, and is 90% or more of a median diameter of crystal grains constituting the polycrystal.

Abstract: A filter includes a first resonance circuit including a first capacitor and a first inductor connected in parallel between a ground terminal and a first node electrically connected to a first signal terminal not through any capacitor, no inductor being connected in series with the first capacitor between the first node and the ground terminal, a second resonance circuit including a second capacitor and a second inductor connected in parallel between the ground terminal and a second node electrically connected to a second signal terminal not through any capacitor, and a third resonance circuit including a third capacitor and a third inductor connected in parallel between a third node, located in a path through which a high-frequency signal is transmitted between the first and second nodes, and the ground terminal, and a first series inductor connected in series with the third capacitor between the third node and the ground terminal.

Abstract: A method for manufacturing a multilayer ceramic electronic component includes: forming a pair of side margin portions on side surfaces of each of a plurality of unfired laminates, respectively, by thermocompression bonding a ceramic sheet containing 10% by mass or more of a binder resin to one of the side surfaces of the laminate for forming each of the side margin portions, performing a first heat treatment on the plurality of laminates having the pair of side margin portions formed thereon in a first condition so as to remove a portion of the binder resin contained in the side margin portions; and thereafter, performing a second heat treatment on the plurality of laminates having the pair of side margin portions formed thereon in a second condition that is different from the first condition so as to remove a remaining binder resin from the side margin portions.

Abstract: An acoustic wave device includes a support substrate, a piezoelectric layer provided on the support substrate, at least a pair of comb-shaped electrodes provided on the piezoelectric layer, each of the comb-shaped electrodes including a plurality of electrode fingers, and an insulating layer provided between the support substrate and the piezoelectric layer, the insulating layer having, in at least a part thereof, a plurality of void regions of which extending directions are different from each other when viewed from a thickness direction of the support substrate, a width in the corresponding extending direction of each of the void regions being longer than a width in a direction orthogonal to the corresponding extending direction when viewed from the thickness direction of the support substrate.

Abstract: A ceramic electronic component includes a multilayer chip having a rectangular parallelepiped shape and including dielectric layers and internal electrode layers alternately stacked, the dielectric layers being mainly composed of ceramic, the internal electrode layers being alternately exposed to two edge faces of the multilayer chip opposite to each other, and external electrodes respectively formed on the two edge faces, wherein an average crystal grain size of the ceramic in a cross section is 200 nm or less in a dielectric portion, and a CV value of a grain size distribution of crystal grains of the ceramic in the cross section is less than 38% in the dielectric portion, the dielectric portion being defined as a region made of the ceramic in the multilayer chip that is in contact with one of the external electrodes and that has a width of 5 ?m from said one of the external electrodes.

Abstract: A ceramic electronic device includes: a multilayer chip in which dielectric layers are stacked, the multilayer chip having two end faces, an upper face, a lower face and two side faces; a plurality of internal electrode layers that are provided inside of the multilayer chip; and a pair of external electrodes that are provided on the two end faces and are connected to the plurality of internal electrode layers, wherein each of the pair of external electrodes has a smaller thickness in a region not connected to the plurality of internal electrode layers, has an inwardly inflected point as viewed toward the plurality of internal electrode layers, and has a larger thickness in a region connected to the plurality of internal electrode layers, as measured in a direction perpendicular to the corresponding end face.

Abstract: A multilayer ceramic capacitor includes: a multilayer chip in which each of dielectric layers and each of internal electrode layers are stacked, the plurality of internal electrode layers being exposed to at least one of a first end face and a second end face of the multilayer structure, the first end face being opposite to the second end face, a first external electrode provided on the first end face; a second external electrode provided on the second end face; and a fluorine compound that is adhered to at least a part of a region including a surface of the multilayer chip where neither the first external electrode nor the second external electrode is formed and surfaces of the first external electrode and the second external electrode, fluorine compound being released at a temperature of 380 degrees C. or more.

Abstract: A method for manufacturing magnetic alloy powder constituted by magnetic grains whose alloy phase is coated with an oxide film, includes: providing a material powder for magnetic alloy whose Fe content is 96.5 to 99 percent by mass and which also contains Si and at least one of non-Si elements (element M) that oxidize more easily than Fe; and heat-treating the material powder and thus forming an oxide film on a surface of each grain constituting the material powder, to obtain a magnetic alloy powder, wherein a content of Fe in the alloy phase is higher than in the material powder; and at a location in the oxide film where its content of Si is in element distributions in a film thickness direction is highest, the content of Si is higher than a content of Fe, and also higher than its content of element M, at the location.

Abstract: A circuit board includes a multilayer ceramic electronic component; and a mounting board mounting the multilayer ceramic electronic component thereon, wherein the multilayer ceramic electronic component comprises: a ceramic main body having a dimension in the first axis direction of the ceramic main body of 0.1 mm or more, and a ratio of a dimension in the second axis direction of the ceramic main body to the dimension in the first axis direction of 130 or more, a plurality of internal electrodes laminated inside the ceramic main body in the first axis direction, and both edges of the plurality of internal electrodes in the second axis direction being aligned with each other within 0.5 ?m in the second axis direction, and external electrodes respectively covering the end surfaces, and wherein the mounting board faces the second principal surface of the multilayer ceramic electronic component mounted thereon.

Abstract: A ceramic electronic device includes a multilayer structure having a parallelepiped shape in which a first dielectric layer of which a main component is ceramic, a first internal electrode layer, a second dielectric layer of which a main component is ceramic, and a second internal electrode layer are stacked in this order, the first internal electrode layer being exposed to a first end face of the parallelepiped shape, the second internal electrode layer being exposed to a second end face of the parallelepiped shape, wherein in the multilayer structure, a conductive layer is provided on a side of the first end face, at a same level in a stacking direction as the second internal electrode, the conductive layer being spaced from the second internal electrode layer. A length of a gap between the second internal electrode layer and the conductive layer is 30 ?m or less.

Abstract: A ceramic electronic component includes a multilayer structure having a substantially rectangular parallelepiped shape and including dielectric layers and internal electrode layers that are alternately stacked, the dielectric layers being mainly composed of ceramic, the internal electrode layers being alternately exposed to two edge faces of the multilayer structure opposite to each other, wherein x/y is 0.143 or less where x represents an average concentration of hydrogen in ppm in a capacitance section where the internal electrode layers exposed to one of the two edge faces and the internal electrode layers exposed to the other of the two edge faces are opposed to each other, as measured by secondary ion mass spectrometry (SIMS), and y represents an average concentration of titanium in ppm in the capacitance section, as measured by SIMS at the same time of measuring the average concentration of hydrogen.

Abstract: An all solid battery includes a multilayer chip in which each of a plurality of solid electrolyte layers including solid electrolyte and each of a plurality of internal electrodes including an electrode active material are alternately stacked, the multilayer chip having a rectangular parallelepiped shape, the plurality of internal electrodes being alternately exposed to two side faces of the multilayer chip other than two end faces of a stacking direction of the multilayer chip, and a pair of external electrodes that contacts the two side faces and include solid electrolyte.

Abstract: Solid electrolyte includes a first solid electrolyte that is a phosphate salt including Li and Ta, and a second solid electrolyte that is NASICON type solid electrolyte. In a cross section of the solid electrolyte, an area ratio of the first solid electrolyte is more than 10% and an area ratio of the second solid electrolyte is more than 10%.

Abstract: A ceramic electronic component includes a multilayer chip including a multilayer structure, which includes ceramic dielectric layers and internal electrode layers that are alternately stacked, and cover layers respectively disposed on top and bottom faces of the multilayer structure in a first direction in which the dielectric layers and the internal electrode layers are alternately stacked, wherein each of the cover layers includes a relatively high porous section and a first relatively less porous section having a pore ratio less than a pore ratio of the relatively high porous section, the relatively high porous section laterally spreading and spanning an entire length of the cover layer in a second direction orthogonal to the first direction, the pore ratio of the relatively high porous section being 1% or greater, the first relatively less porous section being interposed between the relatively high porous section and the multilayer structure.

Abstract: A coil component includes: a first substrate body and a second substrate body, both formed in a manner containing a magnetic material; an adhesive containing an organic material and a filler, for bonding the first substrate body and the second substrate body; a coil formed by a conductor having an insulating film; and electrodes connected electrically to the coil; wherein the surface roughness of the face of the first substrate body bonded to the second substrate body via the adhesive is higher than the average grain size of the filler.

Abstract: A multi-layer ceramic electronic component includes a ceramic body including: a multi-layer unit including an electrode laminating unit including internal electrodes laminated in a first axis direction, covers covering the electrode laminating unit in the first axis direction, and covered surfaces perpendicular to a second axis, end portions of the internal electrodes being aligned on the covered surfaces within a range of 0.5 ?m in the second axis direction; and side margins covering the covered surfaces and having a porosity of 3% or more in end regions. The ceramic body has a dimension in the first axis direction, which is 1.5 times or more a dimension in the second axis direction, and a proportion of an area of the electrode laminating unit to an entire cross-section perpendicular to a third axis and located at the center portion of the ceramic body in a third axis direction is 80% or more.

Abstract: An odor sensor includes a base material, and a plurality of MOF particles arranged on the base material. In an XRD measurement for the plurality of MOF particles arranged on the base material, in a range of 2? = 5 ° to 20 °, a peak intensity of a third highest peak is ? or less with respect to a peak intensity of a first highest peak.

Abstract: A piezoelectric thin film resonator includes a substrate, a lower electrode provided over the substrate, a piezoelectric layer provided on the lower electrode, an upper electrode provided on the piezoelectric layer, the lower electrode and the upper electrode sandwiching at least a part of the piezoelectric layer therebetween to form a resonance region, and an acoustic mirror provided between the substrate and the lower electrode, the acoustic mirror including one or more first layers and second layers that are alternately stacked, each of the one or more first layers having an end face inclined such that a first surface at the lower electrode side is larger than a second surface at the substrate side and having an edge positioned outside the resonance region in a plan view, the second layers being made of a material different from a material of the one or more first layers.

Abstract: A multi-layer ceramic electronic component includes: a multi-layer unit including ceramic layers laminated in a direction of a first axis, internal electrodes disposed between the ceramic layers, and first and second side surfaces on which end portions of the internal electrodes in a direction of a second axis orthogonal to the first axis are positioned; and first and second side margins that cover the first and second side surfaces, respectively. When the first and second side margins are each divided equally into first and second regions along a plane perpendicular to the direction of the first axis, the first side margin has a larger average thickness in the first region than in the second region, and the second side margin has a larger average thickness in the second region than in the first region.