Abstract: A chip inductor is made up of a coiled conducting wire and a magnetic member which is formed by sintering and in which the coiled conducting wire is embedded. Both end portions of the coiled conducting wire are exposed to both end surfaces of the magnetic member. External electrodes are formed with conducting thin films and are connected to respective end portions of the coiled conducting wire. An inorganic material is interposed in a clearance between winds of both end portions of the conducting wire and external surfaces of the magnetic member and a clearance between adjoining winds of the conducting wire.

Abstract: A chip inductor has a coiled conducting wire and a magnetic core which is formed by sintering and in which the coiled conducting wire is embedded. Both end portions of the coiled conducting wire are exposed to both end surfaces of the magnetic core in an arcuate or similar shape. External electrodes are coated on both the end surfaces of the magnetic core and are connected to both end portions of the coiled conducting wire.

Abstract: A chip inductor is made up of a coiled conducting wire and a magnetic member which is formed by sintering and in which the coiled conducting wire is embedded. Both end portions of the coiled conducting wire are exposed to both end surfaces of the magnetic member. External electrodes are formed with conducting thin films and are connected to respective end portions of the coiled conducting wire. An inorganic material is interposed in a clearance between winds of both end portions of the conducting wire and external surfaces of the magnetic member and a clearance between adjoining winds of the conducting wire.

Abstract: A chip inductor is made up of a coiled conducting wire and a magnetic member which is formed by sintering and in which the coiled conducting wire is embedded. Both end portions of the coiled conducting wire are exposed to both end surfaces of the magnetic member. External electrodes are formed with conducting thin films and are connected to respective end portions of the coiled conducting wire. An inorganic material is interposed in a clearance between winds of both end portions of the conducting wire and external surfaces of the magnetic member and a clearance between adjoining winds of the conducting wire.

Abstract: A variable linearity coil has a coil which is wound around a magnetic core, a permanent magnet for charging a bias magnetic field to the magnetic core, and a magnetic field adjusting coil for adjusting the bias magnetic field. The coil and the magnetic field adjusting coil are respectively disposed horizontally such that an axial line of each of the coils lies perpendicular to lead terminals to which terminal ends of each of the coils are connected. The coil, the magnetic field adjusting coil, and the permanent magnet may be contained in a casing and the terminal ends of each of the coil and the magnetic field adjusting coil are connected to lead terminals which are embedded into the casing.

Abstract: A chip inductor is made up of a coiled conducting wire and a magnetic member which is formed by sintering and in which the coiled conducting wire is embedded. Both end portions of the coiled conducting wire are exposed to both end surfaces of the magnetic member. External electrodes are formed with conducting thin films and are connected to respective end portions of the coiled conducting wire. An inorganic material is interposed in a clearance between winds of both end portions of the conducting wire and external surfaces of the magnetic member and a clearance between adjoining winds of the conducting wire.

Abstract: A variable linearity coil has a coil which is wound around a first core, a permanent magnet for charging a bias magnetic field to the first core, a bias magnetic field adjusting coil which is wound around a second core, and an electrically insulating base for mounting thereon the coil, the permanent magnet, and the magnetic field adjusting coil. The first core and the second core are placed one on top of the other with a non-magnetic and shock-absorbing spacer in between. Alternatively, the first core and the second core may be placed one on top of the other with a non-magnetic spacer in between, and a combination of the first core, the second core and the non-magnetic spacer is mounted on the base with a shock-absorbing spacer between the combination and the base.

Abstract: A chip inductor has a coiled conducting wire and a magnetic core which is formed by sintering and in which the coiled conducting wire is embedded. Both end portions of the coiled conducting wire are exposed to both end surfaces of the magnetic core in an arcuate or similar shape. External electrodes are coated on both the end surfaces of the magnetic core and are connected to both end portions of the coiled conducting wire.

Abstract: Electronic parts, such as an inductor, of improved connectivity between magnetic and conductive materials are made by sintering magnetic material under a condition in which no accumulation is developed, by forming a hollow-core of a shape different from an external shape of said conductive material through said magnetic material to be molded by an extrusion-molding means while inserting said magnetic material into said hollow-core, or by providing an erasable means to be removed by a heat treatment in said conductive material and conducting extrusion molding so as to embed said conductive material into said magnetic material, said erasable means being removed during a sintering treatment to form a space between said conductive material and said magnetic material, and a method for making same.

Abstract: A noise filter has a magnetic core having a pair of magnetic core members each with a coupling surface. Each of the magnetic core members has a dented portion so arranged that, when the magnetic core members are closed together on the coupling surfaces, a closed magnetic path and an opening for inserting therethrough a cable are formed between the magnetic core members. An electrically insulating outer sheath member is disposed on an outer surface of each of the pair of magnetic core members. An electrically insulating coating member is disposed on an inner wall surface of each of the dented portions.

Abstract: A winding core is formed by extruding a kneaded material to be obtained by kneading a powdered magnetic material and a binder. A plurality of bundled conducting wires are wound around the winding core into a coiled shape. An external cover element is formed by extruding the kneaded material to enclose the plurality of conducting wires. The winding core and the external cover element are sintered such that the plurality of bundled conducting wires wound around the core into a coiled shape are deformed into a zigzag manner by the stress due to shrinkage of the external cover element at the time of sintering thereof. The partially manufactured product obtained by the preceding steps, is cut into a predetermined length to thereby obtain a plurality of chip inductor main bodies. An external electrode is formed on each of end surfaces of the respective chip inductor main bodies. The external electrode is connected to each end portion of the conducting wires.

Abstract: A winding core is formed by extruding a kneaded material to be obtained by kneading a powdered magnetic material and a binder. A plurality of bundled conducting wires are wound around the winding core into a coiled shape. An external cover element is formed by extruding the kneaded material to enclose the plurality of conducting wires. The winding core and the external cover element are sintered such that the plurality of bundled conducting wires wound around the core into a coiled shape are deformed into a zigzag manner by the stress due to shrinkage of the external cover element at the time of sintering thereof. The partially manufactured product, obtained by the preceding steps, is cut into a predetermined length to thereby obtain a plurality of chip inductor main bodies. An external electrode is formed on each of end surfaces of the respective chip inductor main bodies. The external electrode is connected to each end portion of the conducting wires.

Abstract: Electronic parts such as an inductor of improved connectivity between magnetic and conductive materials made by sintering the magnetic material under a condition where no accumulation is developed, by forming a hollow-core of a shape different from an external shape of said conductive material through said magnetic material to be molded by an extrusion-molding means while inserting said magnetic material into said hollow-core, or by providing an erasable means to be removed by a heat treatment in said conductive material and conducting extrusion molding so as to embed said conductive material into said magnetic material, said erasable means being removed during a sintering treatment to form a space between said conductive material and said magnetic material, and a method for making same.

Abstract: A winding core is formed by extruding a kneaded material which is obtained by kneading a powdered magnetic material and a binder. A conducting wire is wound around the winding core in a coiled manner. An external cover element is formed by extruding the kneaded material to enclose the winding core, and the winding core and the external cover element are sintered. The semimanufactured product obtained by the above steps is cut into a predetermined length to thereby obtain a plurality of chip inductor main bodies. An external electrode is formed on each of end surfaces of the respective chip inductor main bodies such that the external electrode is connected to each of end portions of the conducting wire, the end portions being exposed to both end surfaces of the respective chip inductor main bodies.

Abstract: A mist supplying device for supplying a film-forming solution to form a thin film on a substrate includes a nozzle having an elongate outlet port, an atomizer coupled to the nozzle for atomizing the film-forming solution, and a disperser movably disposed in the nozzle between the outlet port and the atomizer and having a plurality of substantially uniformly distributed mist passages for passing the atomized film-forming solution in a first flow passage direction therethrough. An air blower is coupled to the atomizer for delivering the atomized film-forming solution into the nozzle. A driver unit is coupled to the disperser for reciprocally moving the mist passages in a second flow passage direction transverse to the first flow passage direction.

Abstract: An insulative ceramic composition comprising from 25 to 60 wt % of Al.sub.2 O.sub.3, from 10 to 40 wt % of SiO.sub.2, from 3 to 30 wt % of from B.sub.2 O.sub.3, from 1 to 15 wt % of MgO, from 0.2 to 10 wt % of Cr.sub.2 O.sub.3, from 0.1 to 3 wt % of Li.sub.2 O, and from 1 to 20 wt % of at least one member selected from the group consisting of CaO, SrO and BaO. The ceramic composition has a small coefficient of linear expansion and can avoid cracking when undergoing thermal shock.

Abstract: A reduction-reoxidation type semiconductor ceramic capacitor according to the first invention includes: semiconductor ceramic; a reoxidated dielectric layer formed on the surface of the semiconductor ceramic; at least a pair of electrodes formed on the reoxidated dielectric layer; one of the electrodes being formed with an electrical conductor containing one kind or more of metals or metal compounds selected from Zn, Al, Ni, and Sn; one kind or more of metals in extremely small quantities selected from the metals being diffused into the interior of a portion, in contact with said electrode, of the reoxidated dielectric layer.In addition, a method of manufacturing of the reduction-reoxidation type semiconductor ceramic capacitor comprising the steps of: rendering the semiconductor ceramic to a heat treatment at temperature of from 950.degree. to 1200.degree. C.

Abstract: A dielectric ceramic composition which comprises a mixture of 7 to 25 mole% of BaTiO.sub.3, 0.1 to 15 mole% of Bi.sub.2 O.sub.3, 50 to 65 mole% of TiO.sub.2, 0.1 to 5 mole% of LaO.sub.3/2 and 15 to 45 mole% of NdO.sub.3/2 in a total of 100 mole%. At least one member selected from the group consisting of Y.sub.2 O.sub.3, Gd.sub.2 O.sub.3 and CeO.sub.2, and at least one member selected from the group consisting of Cr.sub.2 O.sub.3, MnO.sub.2, NiO and CoO are further added to the mixture in amounts of from 0.1 to 5 parts by weight and from 0.01 to 1 part by weight per 100 parts by weight of the mixture, respectively.

Abstract: An amorphous silicon solar battery is formed by applying a sequence of layers on a transparent substrate, preferably of glass. A transparent electrode film of conductive material is applied on the substrate, followed by an amorphous silicon semi-conductor, which is in turn followed by a back electrode film of transparent conductive film. In addition, a metallic film may be formed on the back electrode. The surface roughness of the first transparent conductive film is such that the average grain diameter is in the range of 0.1-0.9 micron. Impinging light rays are refracted at random by this uneven surface. The result is an increase in the current density of the solar battery, due to the increased optical paths of the light rays through the semi-conductor material and the increased reflection effect at the second transparent conductive film.

Abstract: A thin-film forming device has a support frame for supporting a substrate to be coated with a thin film, a reaction chamber having a space surrounded by the substrate supported on the support frame, side walls mounted under both sides of the substrate and a bottom wall mounted under the side walls, an atomizer for delivering an atomized solution of a material to be coated on the surface of the substrate, a heater disposed behind the substrate for heating the substrate to a temperature higher than a reaction temperature of the material, and a nozzle connected to the atomizer and disposed in the reaction chamber in facing relation to the substrate for spraying the atomized solution toward the surface of the substrate, and cooling means for cooling at least an inside portion of the bottom wall in facing relation to the substrate to a temperature below the reaction temperature of the material.