Patents Assigned to Takao Injection Mold Engineering Co., Ltd.
  • Patent number: 8029267
    Abstract: An ejector apparatus moves a lift core extending through a core of a component of a resin molding mold to form an undercut portion in a molded piece and is installed so as to be capable of moving obliquely with respect to the core surface in a longitudinal direction. An ejector plate is arranged between the core and a base plate below the core, so as to be capable of moving up and down. A slide path is formed in the ejector plate extending in a direction in which a lower end of the lift core makes relative horizontal movement during ascent and descent of the lift core. A slide base is movably arranged in the slide path and coupled to the lower end of the lift core. A guide rod imparts a moving force within the slide path to the lower end of the lift core during ascent and descent of the ejector plate.
    Type: Grant
    Filed: May 19, 2008
    Date of Patent: October 4, 2011
    Assignee: Takao Injection Mold Engineering Co., Ltd.
    Inventor: Hiroshi Takao
  • Publication number: 20100221379
    Abstract: An ejector apparatus moves a lift core extending through a core of a component of a resin molding mold to form an undercut portion in a molded piece and is installed so as to be capable of moving obliquely with respect to the core surface in a longitudinal direction. An ejector plate is arranged between the core and a base plate below the core, so as to be capable of moving up and down. A slide path is formed in the ejector plate extending in a direction in which a lower end of the lift core makes relative horizontal movement during ascent and descent of the lift core. A slide base is movably arranged in the slide path and coupled to the lower end of the lift core. A guide rod imparts a moving force within the slide path to the lower end of the lift core during ascent and descent of the ejector plate.
    Type: Application
    Filed: May 19, 2008
    Publication date: September 2, 2010
    Applicant: TAKAO INJECTION MOLD ENGINEERING CO., LTD.
    Inventor: Hiroshi Takao
  • Patent number: 7153126
    Abstract: An ejector apparatus wherein, in mounting a lift core to a slide base, and in mounting an ejector core to an ejector plate, it is easy to mount the lift and ejector cores to the slide base and the ejector plate, and simultaneously perform adjustment that allows for thermal expansion of the cores. The ejector apparatus includes a lift core extending through a core constituting a mold and movably installed in a longitudinal direction of the lift core with respect to a surface of the core; an ejector plate arranged between the core and a base plate, and being capable of moving up and down, the base plate being arranged below and spaced from the core; and an adjustment coupling constructed such that a lower end portion of the lift core is supported to expand and contract in a longitudinal direction of the lift core relative to the ejector plate.
    Type: Grant
    Filed: September 29, 2003
    Date of Patent: December 26, 2006
    Assignee: Takao Injection Mold Engineering Co., Ltd.
    Inventor: Hiroshi Takao
  • Publication number: 20050042322
    Abstract: An ejector apparatus wherein, in mounting a lift core to a slide base, and in mounting an ejector core to an ejector plate, it is easy to mount the lift and ejector cores to the slide base and the ejector plate, and simultaneously perform adjustment that allows for thermal expansion of the cores. The ejector apparatus includes a lift core extending through a core constituting a mold and movably installed in a longitudinal direction of the lift core with respect to a surface of the core; an ejector plate arranged between the core and a base plate, and being capable of moving up and down, the base plate being arranged below and spaced from the core; and an adjustment coupling constructed such that a lower end portion of the lift core is supported to expand and contract in a longitudinal direction of the lift core relative to the ejector plate.
    Type: Application
    Filed: September 29, 2003
    Publication date: February 24, 2005
    Applicant: Takao Injection Mold Engineering Co., Ltd.
    Inventor: Hiroshi Takao