Abstract: To satisfactorily apply a protective tape to a bump wafer, an application apparatus (1) for applying a protective tape (PT) to a wafer (W) includes: an application table (60) configured to support the wafer (W); a tape holding body (30) capable of holding the protective tape (PT) and configured to supply the protective tape (PT) held by the tape holding body (30) onto the wafer (W); and a pressing member (62) configured to press the protective tape (PT) from above. The pressing member (62) includes a protective layer outer periphery retainer (620) configured to press a peripheral portion of a protective layer (PL), which is laminated on the protective tape (PT) and has an outer diameter smaller than an outer diameter of the wafer (W), to apply the protective tape (PT) to the wafer (W).

Abstract: In order to respond flexibly to various processing modes, such as forming curved surface shapes, when cutting a workpiece using a wire saw, this wire saw device (1) is provided with: a single robot arm (2) that is capable of moving freely by means of multi-axis control; a wire saw unit (3) that is detachably connected to the robot arm (2) via a tool changer (7); a wire (8) that spans a plurality of pulleys supported within the wire saw unit (3); and a workpiece cutting zone (20) that is established between the pulleys. The workpiece is cut to a prescribed shape by moving the robot arm (2) in a preset direction while running the wire (8) of the wire saw unit (3) and pressing the wire (8) against the supported workpiece.

Abstract: To reduce residual stress generated on a protective tape at a time of application of the protective tape to a semiconductor wafer, provided is an application apparatus (1) for applying a protective tape (PT) to a semiconductor wafer (W), including: a tape conveyance mechanism (2) configured to convey the protective tape (PT) temporarily applied to a base material (BM) to a peeling position; a tape holding body (30) capable of holding the protective tape (PT); a holding-body moving mechanism (31) configured to move the tape holding body (30) to the peeling position; and a peeling mechanism (4) configured to peel the base material (BM) from the protective tape (PT) held by the tape holding body (30) at the peeling position.

Abstract: To satisfactorily apply a protective tape to a bump wafer, an application apparatus (1) for applying a protective tape (PT) to a wafer (W) includes: an application table (60) configured to support the wafer (W); a tape holding body (30) capable of holding the protective tape (PT) and configured to supply the protective tape (PT) held by the tape holding body (30) onto the wafer (W); and a pressing member (62) configured to press the protective tape (PT) from above. The pressing member (62) includes a protective layer outer periphery retainer (620) configured to press a peripheral portion of a protective layer (PL), which is laminated on the protective tape (PT) and has an outer diameter smaller than an outer diameter of the wafer (W), to apply the protective tape (PT) to the wafer (W).

Abstract: Provided are a stock solution concentrating device, a stock solution treatment device and a circulation-type treatment device that can prevent the deposition of cells and the like on a filtration member and that can continuously filter and concentrate a stock solution such as pleural and ascitic fluid or blood plasma. The stock solution concentrating device concentrates a stock solution such as pleural and ascitic fluid or blood plasma to form a concentrated solution, and is equipped with: a filter (10) having a filtration member that filters the stock solution; a concentrator (20) to which the filtrate which has been filtered is supplied, and which concentrates the filtrate to form a concentrated solution; and a stock solution supply unit that supplies the stock solution to the filter (10). The stock solution supply unit has a supply amount adjustment function for adjusting the amount of the stock solution supplied to the filter.

Abstract: The invention provides a wire saw in which wire tension fluctuations occurring in swinging of a row of wires can be accommodated to thereby increase a velocity of the wire and to carry out cutting with efficiency and precision by utilizing swinging of the row of wires even with thin wire. In the wire saw having the row of wires formed by winding the wire about a plurality of work rollers provided to a swinging disk many times, for pushing a workpiece against the row of wires caused to reciprocate or travel in one direction at high velocity to cut the workpiece into a plurality of pieces, and for swinging the row of wires in cutting of the workpiece, a feed side pulley for guiding feed side wire going into the work rollers to the work rollers and a retrieving side pulley for guiding retrieving side wire going out of the work rollers to an outside are disposed coaxially on an axial center of rotation of the swinging disk so that the tension fluctuations do not occur in the wire even if the row of wires swings.

Abstract: In a cutting method by a wire saw, in which a wire A at a wire array wound around work rollers 10 is made to reciprocate or travel in one direction at a high speed and numerous pieces of wafers are cut out in abutment of a workpiece B against the wire array, a receiving member 27 of a cassette type having numerous support wires 34 arranged at the same pitch as that of the wire at the wire array is disposed at a position immediately under the wire array for cutting the workpiece B; and wafers b cut out of the workpiece B by the wire A are contained in separation one from another between the support wires 34 in the receiving member 27. Thus, the wafers can be prevented from adhering to each other during a cutting operation, thus to be accurately cut, and further, the wafers can be prevented from being cracked during the cutting operation, thus to be efficiently separated one from another, so as to enhance wafer cleansing performance.

Abstract: Panty hose sewing processes can be fully automatized (allowing unattended operation) by providing a processing apparatus which is enabled to perform working steps from the pickup of hose material to the opening of the welt portion by using suction air flow synchronously and iteratively under phase differences in working position for the respective working steps, and which allows one piece of hose material to be taken out at a time with reliability, and yet which fully opens the welt portion onto the slide pipe in an unfolding manner and delivers the welt portion to a fitting arm with reliability.

Abstract: A method for sewing panty hose with a backpanel-like gusset inserted includes steps of cutting inner thigh portion of left-and-right aligned cylindrical hose materials and thereafter inserting the backpanel-like gusset material to a position ranging from rear portion to inner thigh portion of the panty part. The backpanel-like gusset material is folded into two and inserted into between the upper middle clamp and the lower middle clamp of a pair of left and right clamp groups. After the cutting of the gusset material, upper edge portion and lower edge portion of the gusset material inserted between the upper and lower middle clamps are sewn individually to cut edges of the hose materials.

Abstract: A method for mounting pantyhose blanks which enables a pair of pantyhose blanks to be efficiently and accurately mounted on a stretch holder member of a crotch sewing machine employed in pantyhose sewing. Panty portions of a pair of pantyhose blanks are inserted on a pair of upper and lower insertion plates at a first position. At a second position, the panty portions are shifted widthwise on the respective insertion plates so that a cutting site at which the panty portions are to be cut is positioned in alignment with a center line extending across the insertion plate pair. At a third position, the panty portions are drawn so that run guard portions are set in position on the respective insertion plates; the panty portions are stretched in opposite lateral directions by a pair of pawls which act as a transfer member and are held as such before they are withdrawn from the insertion plate pair, the panty portions being then mounted on the stretch holder member of the crotch sewing machine.

Abstract: A finishing device for setting and finishing stockings hose such as stockings and panty hose through steam treatment while they are loaded onto templates, the finishing device including a pair of templates which intermittently move, a steam setting section, a stocking take-off section, and opening-closing mechanisms for the templates.When the templates having a stocking inserted thereon face the steam setting section, the stocking is steam set with steam supply. The steam setting section is composed of a two-part kiln. The templates are folded in two after the setting, and the stocking is taken off the templates at the stocking take-off section for the transfer to the packaging process, with the template open in parallel, ready for the insertion of another stocking.

Abstract: An apparatus for automatically positioning welt portions and garter lines of pantyhose materials by aligning upper and lower positions in relation to each other for carrying out a pantyhose panty part seaming process, in which when detection sensors detect materials roughly fitted to respective upper and lower template assemblies, plates for positioning garter lines cause a panty part to move backward to be inserted deeply onto the template assemblies and the garter lines of the upper and lower materials are positioned by aligning with each other through detection sensors for positioning garter lines, and successively, a plate for positioning welt portions causes the panty part to move backward, stretching the panty part to a prescribed length so that the welt portions of the upper and lower materials are aligned with each other, thus fully fitting the upper and lower materials to the template assemblies and, at the same time completing the positioning of the welt portions and garter lines by aligning upper a

Abstract: A wire saw has a wire wound a number of turns around a plurality of multigrooved rollers to form rows of the wire between the rollers which cut a workpiece. By reversibly rotating the multigrooved rollers, the wire is moved gradually from a wire feeding side to wire recovery side of the saw while undergoing a reciprocating motion between the multigrooved rollers. In addition, the multigrooved rollers are rotated around a fixed axis to swing the wire in a manner that provides contact with the workpiece which is quite close to point contact. Thus, a concentrated load is applied to the workpiece fully utilizing the permissible tension on the wire, and thus accelerating the cutting speed and raising the cutting accuracy.

Abstract: An automatic fitting apparatus for holding and forwarding a pair of tubular hose parts of half made pantyhose to a panty part sewing maching includes a forwarding mechanism, a transfer device, movable back and forth to transfer the parts to a table, capable of moving and inclining, and provided with right and left slits for receiving the hose parts, a suction mechanism for opening the welt portions, a drive for moving the table between upright and sideways positions, and a stretching device movable between the table and a clamping mechanism of a panty part sewing machine. The forwarding mechanism may include pairs of flexible plates mounted on a conveyor.

Abstract: A method for applying a protective tape on a wafer and cutting it out to the shape of the wafer in the process of manufacture of integrated circuits and the like, and an apparatus for use in carrying out the method. The method enables the protective tape to be applied on the wafer without allowing intersurface inclusion of air bubbles and to be accurately cut along the perimeter of the wafer. Any dimensional change with respect to the wafer can be properly coped with.The protective tape, as drawn out from a winder shaft, is applied by means of an application roller on the wafer which is supported and fixed in position on a transfer table.The tape is cut along an orientation flat of the wafer by a subcutter which is in movement integrally with the application roller. A main cutter positioned above the wafer is then lowered and caused to swivel, whereby the protective tape is cut along a circumferential edge of the wafer so that the tape on the wafer is cut out to the contour of the wafer.

Abstract: An apparatus for automatically finishing pantyhose includes pairs of pattern frames on which a pair of pantyhose are fitted and which are respectively mounted on a revolving ring plate which stops at stations for pantyhose inspection, drying, and pulling-out. At the inspection station, the pattern frames are lifted by an elevating device and their width is increased for inspection of the pantyhose. At the drying station, they are dried and set to the shape of the widened pattern frames by an infrared heater. At the pulling-out station, a device clamps their toe portion and pulls them into a folding device, a lowering device lowers the pattern frames and narrows their widths, and a tucking-up device is lifted so as to raise the mouth portion of the pantyhose. The folding device folds them in two before they are forwarded to a packaging station.

Abstract: A method for making methylolated hydantoins by reacting a hydantoin, a formaldehyde such as paraformaldehyde and an alkaline catalyst at conditions of temperature and pressure sufficient to induce reaction to obtain a product in essentially 100% active form. Dry methylolated hydantoin product made by this process may be stored or shipped more economically than an aqueous solution containing a methylolated hydantoin.