Abstract: A method for making conductive traces and interconnects on a surface of a substrate includes, for an embodiment, forming a dielectric or polymer layer on the surface of the substrate, forming a seed layer of an electrically conductive material on the dielectric or polymer layer, patterning a photoresist on the seed layer, forming the conductive traces on the patterned photoresist and seed layer, removing the photoresist from the substrate, and irradiating the surface of the substrate with a fluence of laser light effective to ablate the seed layer from areas of the substrate surface exclusive of the conductive traces.

Abstract: A method for making conductive traces and interconnects on a surface of a substrate includes, for an embodiment, forming a dielectric or polymer layer on the surface of the substrate, forming a seed layer of an electrically conductive material on the dielectric or polymer layer, patterning a photoresist on the seed layer, forming the conductive traces on the patterned photoresist and seed layer, removing the photoresist from the substrate, and irradiating the surface of the substrate with a fluence of laser light effective to ablate the seed layer from areas of the substrate surface exclusive of the conductive traces.

Abstract: A Dyson lens system includes a radiation source, a concave mirror, and a plano-convex lens. There is also incorporated in the system an additional lens that is spaced from the plano-convex lens a large part of the distance from the plano-convex lens to the mirror. A roof prism and a turning prism are provided to conduct radiation from the radiation source to the plano-convex lens and also from the plano-convex lens to an image plane. An image adjustor or compensator is provided between the prisms and either the image plane or an object plane--the latter being disposed between the radiation source and the prisms. An adjustment mechanism is provided to effect highly accurate adjustment of the location of the image, the adjustment mechanism including physical shifting to a slight degree of a portion of one or both prisms.

Abstract: Scanning microlithography apparatus for effecting exposures of substrates to radiation sources. A mask support and a substrate stage are disposed in spaced-apart positions directly opposite each other, witch a lens system between them and with a radiation source on the outer side of the mask support. The mask support and substrate stage are at a substantial angle to horizontal in order to achieve benefits including reduction in gravitation-induced sagging of the mask. A massive block of granite is provided at the substantial angle to horizontal, and has a flat face that keeps the mask support and substrate stage at desired positions relative to the radiation source and lens system, during scanning.

Abstract: Endpoint control of thickness of a film being deposited or etched is achieved by use of an ellipsometer that derives delta and psi coordinates of a polarized light beam reflected from the work piece during the course of processing. Measured film thickness is a function of the delta and psi coordinates and other parameters. Delta and psi coordinates of a selected end point (final film thickness) of the process are calculated, and an unbounded line through the endpoint perpendicular to the direction of a plot of delta and psi coordinates adjacent the endpoint is defined. As the processing continues, an ERROR is generated that becomes zero when measured delta and psi coordinates are on the line. When this error changes sign, in the appropriate cycle and within a reasonable range of the endpoint, the desired thickness has been attained, and the process is stopped. The improved film thickness endpoint control is used in a rapid thermal processing system wherein temperatures are changed at a rate of 100.degree. C.

Abstract: The angles of the walls of vias being ablated by excimer lasers are controlled by interposing refractive elements between the masks and the workpieces, and rotating the refractive elements about axes parallel to the optical axis. In one embodiment, the refractive element has parallel faces, and is inclined. In another embodiment, the faces of the refractive element are at a small angle to each other.

Abstract: In accordance with the method, an integrating kaleidoscope and lamps combine to cause heating of a semiconductor wafer to achieve desired effects such as annealing, etc. In one form of the method, the heating of the wafer is such as to achieve rapid annealing by isothermal heating alone. In another form of the method the heating is such as to effect isothermal heating immediately followed by thermal flux heating.

Abstract: An integrating light pipe, very preferably a kaleidoscope, encloses a source of radiant thermal energy, the light pipe and energy source being so arranged as to achieve efficient and substantially uniform heating of a workpiece in a target plane. The pipe has closed ends so as to heat the workpiece from both sides uniformly and efficiently. The apparatus employs CW lamps, pulsed lamps, and a combination of the two.

Abstract: An automatic system for exposing and handling double-sided printed circuit boards without scuffing either side, which effects precise positioning of the circuit boards at exposure stations, and which holds the circuit boards firmly clamped on a planar stage during exposure. The system includes a first apparatus to expose one side of each circuit board, and a second apparatus to expose the other side thereof. Air-bearing and mechanical-engagement means cooperate with each other to float and actuate the circuit boards from one station to the other, and coarse and fine positioning means are provided at each station to effect accurate locating of the boards thereat followed by vacuum clamping onto the exposure stage. Means are provided for automatically inverting each board as it moves from the first exposure station to the second, the inverting means incorporating air-bearing and mechanical-actuating means to insure that there is no scuffing at the inverting station.

Abstract: A process is disclosed for exposing to ultraviolet light a semi-conductor or hybrid substrate coated with photo-resist, in back of a mask having bars and very narrow slits, the diffraction patterns ordinarily experienced at the substrate being virtually eliminated through use, between the light source and the mask, of a light integrator comprised of two successive matrixes of very small lenses or lenticules. The lenticules form a large number of magnified, superimposed, slightly displaced images of the light source in the plane of the substrate; and when the slitted mask is interposed, this light forms a large number of diffraction patterns on the substrate which, because of their large number, superimposition, and slight displacement, results in extreme uniformity of light intensity and sharp resolution throughout the pattern of light on the substrate.

Abstract: There is disclosed a vacuum contact printer and process for printing copy plates from master photomask plates depicting electronic circuitry.The printer embodies a vacuum-tight enclosure or casing, containing three vacuum chambers, two outside master and copy plate plenum chambers, and an intermediate main chamber. Retainers for the master and copy chambers hold and frame the master photomask and copy plates, respectively, and these retainers are mounted in confronting printing frames. The one of these printing frames which supports the master photomask plate is carried by a mounting plate fixed to an outside casing, and the other of the printing frames is carried by a swinging door of this casing. The master and copy photomask plates form partitions across the interior of the casing, and are positioned against flexible elastomeric framing seals, which complete these partitions.

Abstract: A system is disclosed for exposing to ultraviolet light a semi-conductor or hybrid substrate coated with photo-resist, in back of a mask having bars and very narrow slits, the diffraction patterns ordinarily experienced at the substrate being virtually eliminated through use, between the light source and the mask, of a light integrator comprised of two successive matrixes of very small lenses or lenticules. The lenticules form a large number of magnified, superimposed, slightly displaced images of the light source in the plane of the substrate; and when the slitted mask is interposed, this light forms a large number of diffraction patterns on the substrate which, because of their large number, superimposition, and slight displacement, results in extreme uniformity of light intensity and sharp resolution throughout the pattern of light on the substrate.