Abstract: Exemplary embodiments described herein are directed to condiment packaging. The condiment packaging includes a first condiment receptacle having a hollow area for receiving a first condiment. The receptacle may be used as a food dipping dish and may be sealed by a removable lid adapted to fit over the receptacle. The condiment packaging also includes a second condiment reservoir attached to the receptacle that has a hollow area for a second condiment. The reservoir may be sealed by a removable tab adapted to fit over the reservoir. Also disclosed are embodiments of the condiment packaging that have eating utensils attached to the exterior surface of the receptacle or lid. The condiment packaging may be useful for containing and distributing of many types of condiments but may be particularly useful for sushi condiments such as soy sauce and wasabi.