Abstract: A soldering machine using lead-free solders is provided which can uniformly heat a printed circuit board and electronic parts to be mounted thereon, and which can solder the electronic parts without thermally damaging them. A porous member having a number of holes formed therein is disposed between a blower fan and a heater for making uniform the pressure of a fluid. A radiation plate is disposed between the heater and a heating target for blowing the fluid having been heated by the heater to the heating target in the form of a turbulent flow. The heated fluid is blown to the heating target for heating the same, whereby solder is melted.
Type:
Grant
Filed:
March 15, 2002
Date of Patent:
July 13, 2004
Assignees:
Hitachi, Ltd., Tamura/FA System Co., Ltd., Hitachi Car Engineering Co., Ltd., Tamura Corporation
Abstract: A soldering machine using lead-free solders is provided which can uniformly heat a printed circuit board and electronic parts to be mounted thereon, and which can solder the electronic parts without thermally damaging them. A porous member having a number of holes formed therein is disposed between a blower fan and a heater for making uniform the pressure of a fluid. A radiation plate is disposed between the heater and a heating target for blowing the fluid having been heated by the heater to the heating target in the form of a turbulent flow. The heated fluid is blown to the heating target for heating the same, whereby solder is melted.
Type:
Grant
Filed:
December 11, 2000
Date of Patent:
July 2, 2002
Assignees:
Hitachi, Ltd., Tamura Fa System Co., Ltd., Hitachi Car Engineering Co., Ltd., Tamura Corporation