Abstract: A reactor coil includes first and second coil elements each formed by edgewise and rectangular winding of one piece of rectangular wire rod in a manner in which the wound rectangular wire rod is stacked rectangularly and cylindrically and, at a winding terminating end point of the first coil element, the rectangular wire rod is bent approximately 90 degrees in a direction opposite to the winding direction of the first coil element so that the rectangular wire rod is stacked in a direction opposite to the stacking direction of the first coil element and is wound edgewisely and rectangularly in a direction opposite to the winding direction of the first coil element to form the second coil element and, as a result, the first coil element and second coil element are aligned in parallel to each other in a continuous state.

Abstract: A coil formed by winding one flat type wire material rectangularly edgewise thereby stacking the rectangularly edgewise wound flat type wire in rectangular tube shape, wherein not only one edge of the coil including the flat type wire including an end portion of start-of-winding thereof but also another edge of the coil including the flat type wire including an end portion of finish-of-winding thereof are formed to be projecting from an outer circumference of the coil.

Abstract: A reactor coil includes first and second coil elements each formed by edgewise and rectangular winding of one piece of rectangular wire rod in a manner in which the wound rectangular wire rod is stacked rectangularly and cylindrically and, at a winding terminating end point of the first coil element, the rectangular wire rod is bent approximately 90 degrees in a direction opposite to the winding direction of the first coil element so that the rectangular wire rod is stacked in a direction opposite to the stacking direction of the first coil element and is wound edgewisely and rectangularly in a direction opposite to the winding direction of the first coil element to form the second coil element and, as a result, the first coil element and second coil element are aligned in parallel to each other in a continuous state.

Abstract: A coil formed by winding one flat type wire material rectangularly edgewise thereby stacking the rectangularly edgewise wound flat type wire in rectangular tube shape, wherein not only one edge of the coil including the flat type wire including an end portion of start-of-winding thereof but also another edge of the coil including the flat type wire including an end portion of finish-of-winding thereof are formed to be projecting from an outer circumference of the coil.

Abstract: A reactor coil includes first and second coil elements each formed by edgewise and rectangular winding of one piece of rectangular wire rod in a manner in which the wound rectangular wire rod is stacked rectangularly and cylindrically and, at a winding terminating end point of the first coil element, the rectangular wire rod is bent approximately 90 degrees in a direction opposite to the winding direction of the first coil element so that the rectangular wire rod is stacked in a direction opposite to the stacking direction of the first coil element and is wound edgewisely and rectangularly in a direction opposite to the winding direction of the first coil element to form the second coil element and, as a result, the first coil element and second coil element are aligned in parallel to each other in a continuous state.

Abstract: A reactor coil 12 has a first coil element 121 formed by winding one flat type wire 17 edgewisely and rectangularly in a manner in which the wound flat type wire 17 is stacked rectangularly and cylindrically, and a second coil element 122 formed by winding the flat type wire 17 edgewisely and rectangularly at a winding terminating end point of the first coil element 121 in a direction opposite to the winding direction of the first coil element 121 and thereby stacked in a direction opposite to the stacking direction of the first coil element 121. Parts of the flat type wire 17 constituting each one edge of the first coil element 121 and the second coil element 122 are rendered to be projecting from outer circumferences of the first coil element 121 and the second coil element 122 by distances capable of obtaining insulation between a core and lead portions 121L, 122L formed in end portions of start-of-windings of the first coil element 121 and the second coil element 122.

Abstract: Soldering can be performed in a state where the temperature in an object zone is stable, regardless of the heat capacity of a soldering object. A soldering device includes: a position calculation unit which calculates the position of a heated object according to operational information of a conveyer which sequentially transfers the heated object into a plurality of zones for heat processing communicated with each other; a heat capacity calculation unit which calculates the heat capacity of the heated object; and a temperature management unit which controls the temperature in an object zone into which the heated object is carried, upon receiving positional information from the position calculation unit. The temperature management unit feedforward-controls the temperature in the object zone by adjusting the heat capacity of the object zone according to the heat capacity calculated by the heat capacity calculation unit.

Abstract: The present invention provides a reflow apparatus capable of precisely adjusting the heating temperature and heating time when heating a work for reflow. A work transfer conveyor for transferring a work into a furnace body is disposed, wherein a plurality of preheating zones through for preheating the work, a plurality of reflow zones for heating the work for reflow, and a plurality of cooling zones for cooling the work are successively arranged along the work transfer conveyor in the furnace body. The individual reflow zones are formed shorter than the individual preheating zones in the work transfer direction. It is preferable that the sizes of the individual reflow zones in the transfer direction are shortened to approximately 65% to 85% with respect to the individual preheating zones or the conventional individual reflow zones.

Abstract: A reflow furnace comprises: a carrier device to carry a printed circuit board with electronic components mounted thereon; a heating chamber to heat through an ambient gas the printed circuit board carried therein to solder the electronic components on a surface of the printed circuit board; and an ambient gas purification equipment including a retrieving device to retrieve a part of the ambient gas containing vaporized flux component when soldering, a heating device to heat the retrieved ambient gas to a desired temperature, an oxidation catalyst to burn the flux component contained in the heated ambient gas, and a returning device to return a high temperature gas after being burned to the heating chamber.

Abstract: In the first buffering area provided between the inlet of the furnace and the heating chamber, the ambient gas is blown to the printed circuit board from the lower side of the carrier device, while the ambient gas is sucked in the upper side of the carrier device, thus the outside air is prevented from infiltrating and the ambient gas is prevented from flowing out. Furthermore, the flux is prevented from being attached to the printed circuit board, by installing the flux dropping prevention mechanism in the suction port of the ambient gas.

Abstract: A reflow system in which a reflow furnace is sequentially divided into a plurality of zones along a conveying path of a heat target which is conveyed and by controlling temperatures of the plurality of zones, the heat target which is conveyed is reflowed has: a cooling and flux collecting apparatus circulating and cooling atmosphere gases in furnace bodies of a part or all of the plurality of zones and collecting a flux; and a flow rate control unit which is inserted into a circulating path of the atmosphere gas of each of the zones and can control a flow rate. When the temperature of the zone is reduced, by controlling the flow rate control unit, the flow rate is set to be higher than that upon collecting the flux.

Abstract: Soldering can be performed in a state where the temperature in an object zone is stable, regardless of the heat capacity of a soldering object. A soldering device includes: a position calculation unit which calculates the position of a heated object according to operational information of a conveyer which sequentially transfers the heated object into a plurality of zones for heat processing communicated with each other; a heat capacity calculation unit which calculates the heat capacity of the heated object; and a temperature management unit which controls the temperature in an object zone into which the heated object is carried, upon receiving positional information from the position calculation unit. The temperature management unit feedforward-controls the temperature in the object zone by adjusting the heat capacity of the object zone according to the heat capacity calculated by the heat capacity calculation unit.

Abstract: A passivation film including a nitride-reformed layer that excludes chromium nitride (CrN) is formed on a surface of an austenitic stainless steel. The passivation film composed of chromium oxide functions as protection film against lead-free solder. As a result, the surface of stainless steel is hard to be corroded even when it contacts with the lead-free solder in its melted solder, thereby improving its corrosion resistance and its wear resistance substantially. In a case of SUS316 stainless steel, on an outermost surface of which the passivation film is formed, a period of lapsed time until corrosion of the stainless steel starts extends to about 500 hours as line Le shown in FIG. 4, and its corrosion depth indicates shallower one (20 through 25 ?m) as compared with the conventional one, thereby expecting that its durable year can be improved to an extent similar to that using a lead-filled solder, in order to obtain a stainless steel with enhanced corrosion resistance.

Abstract: A method for controlling a heating apparatus whereby the heating apparatus is started up effectively with limited power consumption. A heating priority is determined by multiplying the temperature deviation in each zone by a heat capacity coefficient specific for each zone. The heating priority of each zone is determined alternatively by multiplying an adjacency temperature deviation between adjacent zones by an adjacency coefficient that is set based on the adjacency relationship. The order of zones from the highest to lowest heating priorities is determined, and a plurality of zones are combined in such a manner as to include ones having, respectively, the highest and lowest heating priorities to prepare a group. Similarly, other plurality of zones are combined to prepare groups repeatedly. The power consumption of heaters is limited in each of these groups.

Abstract: This invention provides a soldering method capable of solving soldering defects due to excess molten solder in the case of soldering while applying an inner pressure into a through-hole of a lead component mounting substrate: (a) In a primary soldering step, a lead component mounting substrate is lowered, and the rear surface thereof is put close to or brought into close contact with an upper end opening edge of a nozzle. Simultaneously, the soldering surface of the molten solder supplied to the nozzle is elevated. (b) In a secondary soldering step, the rear surface of the lead component mounting substrate is relatively spaced from the soldering surface of molten solder by lowering the soldering surface. (c) In a lead separating step, the lead component mounting substrate is elevated while tilting the lead component mounting substrate.