Abstract: Provided is a method of plating a non-conductive product comprising the steps of: forming a coating film on a surface of the non-conductive product with a conductive paint having the following composition of solid ingredients: (a) a resin vehicle in 20 to 80 weight %, and (b) a conductive whisker in 80 to 20 weight %; and executing electroless plating on a surface of the coating film. Also provided are products produced by this method.
Type:
Grant
Filed:
November 25, 1998
Date of Patent:
October 22, 2002
Assignees:
Kanto Kasei Co., Ltd., Tanabe Chemical Industry Co., Ltd.