Abstract: A first organometallic compound is an organometallic compound for manufacturing a ruthenium film or a ruthenium compound film by a chemical vapor deposition process, wherein the organometallic compound is alkylcyclopentadienyl(cyclopentadienyl)ruthenium having a substituent of n-propyl group, iso-propyl group, n-butyl group, iso-butyl group, tert-butyl group. A second organometallic compound is an organometallic compound for manufacturing an iridium film or an iridium oxide film by a chemical vapor deposition process, wherein the organometallic compound for chemical vapor deposition is alkylcyclopentadienyl(1,5-cyclooctadiene)iridium having a substituent of any alkyl group of n-propyl group, iso-propyl group, or n-butyl group, iso-butyl group, tert-butyl group.

Abstract: The invention provides a method for producing a sputtering target material including electrolyzing a molten salt mixture containing a precious metal salt and a solvent salt, to thereby deposit a precious metal or a precious metal alloy. The method enables simplification of production steps and produces high-purity target materials. In addition, the electrodeposited precious metal or precious metal alloy is heat-treated at a temperature of at least 800° C. but lower than the melting point of the precious metal, to thereby produce a target material of higher purity.

Abstract: An object of the present invention is to provide a material for a sliding contact whose alloy composition does not contain an environmentally detrimental substance such as Cd, which exhibits excellent contact resistance, whose electrical functions are good and free of time-course variation, and which further exhibits excellent wear resistance. The material for a sliding contact assumes the form of an Ag—Zn—Pd, Ag—Zn—Pd—Cu, Ag—Zn—Pd—Ni, or Ag—Zn—Pd—Cu—Ni alloy. In the compositions of these alloys, the Zn content is 0.1-3.0% by weight, the Pd content is 0.1-1.5% by weight, and the balance is Ag. When Cu is contained, the Cu content is 0.1-3.0% by weight. When Ni is contained, the Ni content is 0.01-0.5% by weight. Zn, Pd, and Cu are present in the Ag &agr; phase in the form of solid solution. Ni particles are finely dispersed in the alloys. A composite clad material is formed through use of the material for a sliding contact.