Patents Assigned to Tanaka Kikinzoku Kogky K.K.
  • Method for hermetic sealing of electronic parts
    Patent number: 6691911
    Abstract: There is provided a method of hermetically sealing electronic parts, comprising the step of bonding a base having semiconductor devices mounted thereon and a cap together via a solder. The solder is composed, by weight, of 78% or more but less than 79.5% Au, and the balance Sn. It is particularly preferred that the bonding is performed with the use of a solder composition composed, by weight, of 78% or more but 79% or less Au, and the balance Sn as the solder and furthermore through plating the cap with gold.
    Type: Grant
    Filed: June 13, 2002
    Date of Patent: February 17, 2004
    Assignee: Tanaka Kikinzoku Kogky K.K.
    Inventors: Shozaburo Iwai, Masaru Kobayashi, Osamu Sawada