Abstract: An object is to provide an immunochromatography detection method and an immunochromatography kit in which a prozone phenomenon occurring in a sandwich method when using an analyte in which an antigen is present in a large excess amount is suppressed/excluded. The object was achieved by retaining a nonionic and hydrophilic surfactant having an HLB value of 13 to 18 in a sample addition part of an immunochromatography device, and also using a membrane having a fast flow speed as a membrane to be used for a chromatograph medium.

Abstract: An organoplatinum compound with the following formula for use as a raw material in the chemical deposition of platinum compound thin films. In the formula, n is 1 or more and 5 or less. Each of substituents R1 to R5 on the alkenyl amine is a hydrogen atom, an alkyl group or the like and has a carbon number of 4 or less. Each of alkyl anions R6 and R7 is an alkyl group having a carbon number of 1 or more and 3 or less. The vapor pressure of the organoplatinum compound is high enough to allow for the manufacturing of a platinum thin film at low temperature. It also has moderate thermal stability.

Abstract: The present invention is a catalyst for a solid polymer fuel cell including: catalyst particles of platinum, cobalt and manganese; and a carbon powder carrier supporting the catalyst particles, wherein the component ratio (molar ratio) of the platinum, cobalt and manganese of the catalyst particles is of Pt:Co:Mn=1:0.06 to 0.39:0.04 to 0.33, and wherein in an X-ray diffraction analysis of the catalyst particles, the peak intensity ratio of a Co—Mn alloy appearing around 2?=27° is 0.15 or less on the basis of a main peak appearing around 2?=40°. It is particularly preferred that the catalyst have a peak ratio of a peak of a CoPt3 alloy and an MnPt3 alloy appearing around 2?=32° of 0.14 or more on the basis of a main peak.

Abstract: The present invention relates to a Ni-based heat-resistant alloy including Ir: 5.0 mass % or more and 50.0 mass % or less, Al: 1.0 mass % or more and 8.0 mass % or less, W: 5.0 mass % or more and 25.0 mass % or less, and balance Ni, having an L12-structured ?? phase present in the matrix, and including at least one of Zr: 0.01 mass % or more and 3.0 mase/0 or less and Hf: 0.01 mass % or more and 3.0 mass % or less. This Ni-based heat-resistant alloy has improved toughness over a conventional Ni-based heat-resistant alloy based on a Ni—Ir—Al—W-based alloy, and is also excellent in ambient-temperature strength.

Abstract: The present invention provides a catalyst for hydrogen peroxide decomposition with which hydrogen peroxide present in acid-containing water to be treated can be efficiently decomposed at low cost and which is less apt to dissolve away in the water being treated, can be stably used over a long period, and renders acid recovery and recycling possible. The present invention has solved the problems with a catalyst for hydrogen peroxide decomposition which is for use in decomposing hydrogen peroxide present in acid-containing water to be treated, the catalyst including a base and, a catalyst layer that is amorphous, includes a platinum-group metal having catalytic function and a Group-6 element metal having catalytic function and is formed over the base.

Abstract: The present invention provides a stirrer for manufacturing glass including a stirrer shaft and a multi-staged rod-shaped stirrer blade fixed so as to penetrate through the stirrer shaft. This stirrer blade is a hollow cylindrical body including: a cylinder obtained by seam welding of two opposing sides of a flat plate made, for example, from strengthened platinum containing platinum or a platinum alloy as a matrix and metallic oxide dispersed in the plate; and a disk welded to an entire circumference of both ends of the cylinder and made from an identical material, and it penetrates so that a weld line crosses a center axis of the stirrer shaft, and is fixed so that a locus of an end portion of the blade forms a spiral shape. In addition, the rod-shaped stirrer blade has a core layer showing a dispersed structure that exists in a cross-sectional structure at a fixing portion with the stirrer shaft and does not receive heat effect resulting from fixing.

Abstract: Provided is a tape-shaped contact member including a tape-shaped contact material. At least one wire-shaped brazing material is bonded to the tape-shaped contact material, at least one projection including the brazing material and protruding from a surface of the contact material is formed in a cross-sectional shape, a diffusion region containing a metal component forming the brazing material is formed along an interface with the brazing material inside the contact material, and the diffusion region has a thickness of 2 ?m or more and 10 ?m or less. A chip-shaped contact component can be obtained by cutting the tape-shaped contact member to an arbitrary length. The present contact component is useful as a constituent member for a switching electrical contact, and capable of adapting to height reduction of the electrical contact. The present invention can also contribute to reduction of occurrence of poor bonding.

Abstract: A heterogeneous polynuclear complex for use as a raw material in the chemical deposition of composite metal or composite metal thin films with the below formula. In the formula, M1 and M2 are mutually different transition metals, x is an integer of 0 or more and 2 or less, y is in integer of 1 or more and 2 or less, z is an integer of 1 or more and 10 or less, R1 to R4 are each one of a hydrogen atom and an alkyl group with a carbon number of 1 or more and 5 or less, and R5 is a hydrogen atom, a carbonyl, an alkyl group with a carbon number of 1 or more and 7 or less, an allyl group or an allyl derivative. The heterogeneous polynuclear complex allows a composite metal thin film or a composite metal compound thin film containing a plurality of metals to be formed from a single raw material.

Abstract: A waste liquid treatment device (20) treats water to be treated that contains at least hydrogen peroxide, by decomposing the hydrogen peroxide. The waste liquid treatment device (20) is equipped with a housing (21), an introduction port (22) that is provided to the housing (21) and that introduces the water to be treated into the housing (21), a discharge port (23) that is provided to the housing (21) and that discharges treated water to be obtained by treating the water to be treated, and one or more channel-defining members (24) that are disposed within the housing (21) and that have a surface that a catalyst is disposed on, wherein the one or more channel-defining members (24) define, between the introduction port (22) and the discharge port (23), a channel (P) for the water to be treated, the channel (P) having a turning in at least one position.

Abstract: The present invention provides a method for producing a cyclometalated iridium complex, the method including producing a cyclometalated iridium complex by reacting a cyclometalated iridium complex raw material including an organoiridium material with an aromatic heterocyclic bidentate ligand capable of forming an iridium-carbon bond and an iridium-nitrogen bond, and using as the raw material an organoiridium material represented by the following general formula (1). The present invention allows a cyclometalated iridium complex to be produced with a high yield without by-production of a halogen-crosslinked iridium dimer.

Abstract: The present invention is a sliding contact material having a composition of Cu of 6.0% by mass or more and 9.0% by mass or less, Ni of 0.1% by mass or more and 2.0% by mass or less, an additive element M of 0.1% by mass or more and 0.8% by mass or less, and the balance being Ag. The additive element M is at least one element selected from the group consisting of Sm, La and Zr. The present sliding contact material has a material structure in which dispersion particles containing an intermetallic compound containing at least both Ni and an additive element M are dispersed in an Ag alloy matrix. It is required that the ratio of a Ni content (% by mass) and a content of an additive element M (% by mass) (KNi/KM) in the dispersion particles falls within a predetermined range. The present invention is an Ag alloy-based sliding contact material more excellent also in abrasion resistance than conventional ones, and a material adaptable to higher rotation numbers of micromotors.

Abstract: A precious metal paste which does not cause contamination of a member, which can be uniformly coated to a member to be bonded, and which is in good condition after bonding is provided. The present invention relates to a precious metal paste for bonding a semiconductor element, of the paste including a precious metal powder and an organic solvent, in which the precious metal powder has a purity of 99.9 mass % or more and an average particle diameter of 0.1 to 0.5 ?m, the organic solvent has a boiling point of 200 to 350° C., and a thixotropy index (TI) value calculated from a measurement value of a viscosity at a shear rate of 4/s with respect to a viscosity at a shear rate of 40/s at 23° C. by means of a rotational viscometer is 6.0 or more.

Abstract: A ceramic circuit substrate according to the present invention includes a ceramic substrate, a copper circuit made of a copper-based material bonded, via a bonding layer, to a surface of the ceramic, and a copper heat sink made of the copper-based material bonded, via a bonding layer, to the other surface of the ceramic. The bonding layers each include a brazing material component including two or more kinds of metals, such as Ag, and an active metal having a predetermined concentration. The bonding layers each include a brazing material layer including the brazing material component, and an active metal compound layer containing the active metal. A ratio of a bonding area of the active metal compound layer in a bonding area of each of the bonding layers is 88% or more.

Abstract: [Problem] Provided is a thermally and electrically conductive adhesive composition used as a die-bonding material which shows high heat dissipation performance and stable electric conductivity as well as high adhesion force. [Solution] Provided is a thermally and electrically conductive adhesive composition, comprising: (A) an electrically conductive filler; (B) an epoxy resin; (C) a curing agent, and (D) an organic solvent, in which the electrically conductive filler (A) is a submicron fine silver powder, and the content of the electrically conductive filler (A) is such that (A)/(B) is 96.0/4.0 to 99.5/0.5 in the mass ratio to the content of the epoxy resin (B); and the epoxy resin (B) comprises at least a bisphenol-type epoxy resin and a novolac-type epoxy resin; and the curing agent (C) is diaminodiphenyl sulfone and/or a derivative thereof, and the content of the curing agent (C) is 0.4 to 2.

Abstract: A transfer substrate for transferring a metal wiring material to a transfer target including a substrate, at least one metal wiring material formed on the substrate, at least one coating layer formed on a surface of the metal wiring material, and an underlying metal film formed between the substrate and the metal wiring material, in which the metal wiring material is a compact formed by sintering metal powder such as gold powder having a purity of 99.9 wt % or more and an average particle size of 0.01 ?m to 1.0 ?m, and the coating layer is a predetermined metal such as gold or an alloy having a different composition from that of the metal wiring material and has a total thickness of 1 ?m or less, and the metal underlying film is made of a predetermined metal such as gold or an alloy. The transfer substrate can lower heating temperature on the transfer target side.

Abstract: A gold sputtering target is made of gold and inevitable impurities, and has a surface to be sputtered. In the gold sputtering target, an average value of Vickers hardness is 40 or more and 60 or less, and an average crystal grain size is 15 ?m or more and 200 ?m or less. A {110} plane of gold is preferentially oriented at the surface to be sputtered.

Abstract: The present invention relates to a silicide alloy film that is formed on a substrate containing Si, the silicide alloy film including a metal M1 having a work function of 4.6 eV or more and 5.7 eV or less, a metal M2 having a work function of 2.5 eV or less and 4.0 eV or more, and Si, the silicide alloy film having a work function of 4.3 eV or more and 4.9 eV or less. Here, the metal M1 is preferably Pt, Pd, Mo, Ir, W or Ru, and the metal M2 is preferably Hf, La, Er, Ho, Er, Eu, Pr or Sm. The silicide alloy film according to the present invention is a thin-film which has excellent heat-resistance and favorable electrical property.

Abstract: The present invention provides an easy-to-use and higher-sensitivity immunochromatography device for an RSV, the device using an antibody that binds specifically to F protein of the RSV in a determination region of a chromatography medium, a test kit by an immunochromatography method, and a method for detecting an RSV using these device and kit. The present invention relates to an immunochromatography device in which not only an antibody that binds specifically to F protein of an RSV but also an antibody that binds specifically to N protein of the RSV is solid-phased in a determination region of a chromatography medium. The present invention also relates to a test kit by an immunochromatography method, and a method for detecting an RSV using these device and kit.

Abstract: The present invention is an alloy for medical use including an Au—Pt alloy, containing 34 to 36 mass % of Pt with the balance being Au, and having an ?-phase single structure in which a ratio of a peak intensity (X) of a Pt (111) plane to a peak intensity (Y) of an Au (111) plane (X/Y) is 0.01 or less in an X-ray diffraction analysis. The alloy can be produced in such a manner that after the Au—Pt alloy ingot is molten and cast, cold working and a heat treatment for homogenization are performed at least two times on the molten and cast alloy. The alloy of the present invention is an artifact-free material that exhibits excellent compatibility with a magnetic field environment such as an MRI and has magnetic susceptibility of ±4 ppm with respect to that of water.

Abstract: An FePt—C-based sputtering target containing Fe, Pt, and C, wherein the FePt—C-based sputtering target has a structure in which primary particles of C that contain unavoidable impurities are dispersed in an FePt-based alloy phase containing 33 at % or more and 60 at % or less of Pt with the balance being Fe and unavoidable impurities, the primary particles of C being dispersed so as not to be in contact with each other.