Patents Assigned to Tanakaya, Inc.
  • Patent number: 6821608
    Abstract: To provide practical corrugated cardboard pallets that cope with rain, humidity or the like and water-resistant corrugated cardboard for use as the material thereof. Water-resistant paper is used for base paper for corrugated paperboard and base paper for flat paperboard, and cornstarch glue containing 7 to 10 percent by weight modified ketone resin is used as an additive for water-resistance, all of which are used to manufacture the corrugated cardboard. Such corrugated cardboard is used at least in the beam portion to produce a pallet.
    Type: Grant
    Filed: July 12, 2002
    Date of Patent: November 23, 2004
    Assignee: Tanakaya, Inc.
    Inventor: Keiji Tanaka
  • Patent number: 6092684
    Abstract: A connectable case and method of forming the connectable case from a synthetic resin plate. The case includes a bottom panel, four side-wall panels each extending from a respective side of the bottom panel and a flap panel extending from the side of at least one side-wall panel, the flap panel extending downwardly adjacent to its respective side-wall panel, such that the space between the downwardly extending flap panel and its respective side-wall panel is approximately equal to the thickness of a side-wall panel. One side-wall panel has at leat one hole formed therein, and one of the flap panel and its associated side-wall panel has at least one protrusion formed therein extend into the space.
    Type: Grant
    Filed: July 18, 1997
    Date of Patent: July 25, 2000
    Assignee: Tanakaya, Inc.
    Inventor: Hidekiyo Sato