Patents Assigned to Tanazawa Hallosha Co., Ltd.
  • Patent number: 8794951
    Abstract: An object of the present invention is to provide a mold for resin molding which ensures ventilation characteristic without requiring an enormous amount of work. The mold for resin molding of the present invention includes: a mold 12; a design layer 16 formed inside the mold 12; and a air permeable interposing layer 22 for forming the design layer 16 on an inner surface of the mold 12. The mold 12 forms a ventilating throughhole 14. The design layer 16 is made of a resin having projections and depressions on the surface, and has a ventilating throughhole 18 formed so as to couple to the ventilating throughhole 14. The air permeable interposing layer 22 is arranged next to the inner surface of the mold 12 so that an inner surface of the design layer 16, the ventilating throughhole 18 of the design layer 16, and the ventilating throughhole 14 of the mold 12 couple to each other.
    Type: Grant
    Filed: November 21, 2007
    Date of Patent: August 5, 2014
    Assignee: Tanazawa Hallosha Co., Ltd.
    Inventors: Sadayuki Yoneshima, Masayuki Sakai, Hisao Aota, Hiroshi Watanabe, Mitsuaki Samejima, Yumiko Omiya