Abstract: A zinc electroplating bath includes zinc ions and a brightening agent. The brightening agent is a polyamine or a mixture of polyamines that include a quaternary ammonium group.

Abstract: Disclosed are systems and methods of plating a tin alloy in an efficient, economical, and environmentally friendly manner. An electrochemical cell containing an anolyte compartment and a catholyte compartment separated by a selective membrane is employed. The selective membrane prevents ionic metals from migrating from the catholyte compartment to the anolyte compartment. A conduit may be employed in the electrochemical cell to permit one way flow of anolyte to the catholyte compartment thereby replenishing tin to the catholyte compartment.

Abstract: The present invention relates to an apparatus (12) for applying a zinc-nickel electroplate to a workpiece. The apparatus comprises a zinc-nickel electroplating bath (16) comprising an amine additive, such as poly(alkyleneimine), which is capable of being oxidized in the bath to cyanides. The bath has a pH more than about 14. A cathode workpiece (18) is positioned in the bath. An anode assembly (20) is also positioned in the bath. The anode assembly comprises an enclosure (22) defining an anolyte compartment (24), at least a portion of the enclosure being an ion exchange membrane (26). An anolyte (28) is positioned in the compartment. An insoluble metal anode (30) is immersed in the anolyte. The anolyte is a conductive salt or base solution and the anode is a metal or metal coating selected from the group consisting of nickel, cobalt, iron, chromium and alloys thereof.

Abstract: One aspect of the invention relates to an aqueous copper plating bath containing sulfuric acid with a specific ratio to at least one supplemental acid selected from the group consisting of fluoboric acid, alkane sulfonic acids, and alkanol sulfonic acids; a copper salt; chloride ions; and at least one sulfate bath brightener. Another aspect of the invention relates to aqueous copper plating bath containing fluoboric acid and/or an alkane sulfonic acid but no sulfuric acid, copper sulfate, chloride ions, and at least one sulfate bath brightener. Yet another aspect of the invention relates to methods of plating copper from the aforementioned copper plating baths. Still yet another aspect of the invention relates to methods of plating copper at high speed using relatively high current densities.

Abstract: An alkaline zinc-nickel electroplating bath comprises zinc ions, nickel ions, a primary brightener which is an N-methylpyridinium compound substituted at the 3-position of the pyridine ring with a carboxylate group or a group hydrolyzable to a carboxylate group and a secondary brightener which is an aliphatic amine. An example of a preferred brightener is N-methylpyridinium-3-carboxylate or a salt thereof. A preferred polyamine is a polyethyleimine. By the present invention, a mirror bright zinc-nickel deposit can be obtained having more than 4% by weight nickel, without blistering or decomposition of the primary brightener.

Abstract: A zinc alloy electroplating bath comprising zinc ions, alloy metal ions of a metal of the first transition of the Periodic Table, and a brightening agent comprising a ureylene quaternary ammonium polymer, an iminoureylene quaternary ammonium polymer, or a thioureylene quaternary ammonium polymer.