Abstract: A method for making an actuator device includes providing a wafer comprising a layer of an electrically conductive material and forming a plurality of rotationally symmetrical dies in the electrically conductive material, each die including a plurality of radial tabs and complementarily sized radial recesses arranged in alternating fashion and at equal angular increments around the circumfery of the die. To maximize the use of available wafer space, the dies are arranged in a pattern on the wafer in which each die is rotated relative to adjacent dies through an angle of 360 degrees divided by twice the number of tabs or recesses on the die and, except for dies located at an outer periphery of the wafer, each die is disposed in edge-to-edge near abutment with an adjacent die and each tab of each die is nested within a complementary recess of an adjacent die.