Patents Assigned to TATEYAMA KAGAKU CO., LTD.
  • Electronic module and method for manufacturing same
    Patent number: 11049780
    Abstract: An electronic module includes a substrate having flexibility and an electrical insulation property, a circuit unit in which an electronic device is mounted on a wiring pattern formed on at least any one of surfaces of the substrate, and a resin body in which the circuit unit is sealed with an electrical insulating resin, wherein the substrate has flexibility to be deformable due to a pressure during sealing with the electrical insulating resin.
    Type: Grant
    Filed: April 17, 2018
    Date of Patent: June 29, 2021
    Assignee: TATEYAMA KAGAKU CO., LTD.
    Inventors: Osamu Watanuki, Kenichi Honda, Orie Shinohara, Akira Ishikawa, Tsutomu Ishikawa