Abstract: The present disclosure relates to a method and a corresponding arrangement for producing a hardened sheet metal product. The method includes placing a sheet metal piece in a heating station and heating selected areas of the sheet metal piece in the heating station by means of induction. In this process, a coil induces currents that flow in a front metal layer on a front side of the coil. Opposing ends of the front metal layer are interconnected by a low resistance short-circuiting arrangement running on a rear side of the coil. The short-circuiting arrangement comprises a material with lower resistivity than the front metal layer. The heated piece is moved to a pressing station, where it is pressed while the heated areas are cooled.

Abstract: The present disclosure relates to a method and a corresponding arrangement for producing a hardened sheet metal product. The method includes placing a sheet metal piece in a heating station (3) and heating selected areas of the sheet metal piece in the heating station by means of induction. In this process, a coil (17) induces currents that flow in a front metal layer on a front side of the coil. Opposing ends of the front metal layer are interconnected by a low resistance short-circuiting arrangement (23) running on a rear side of the coil. The short-circuiting arrangement comprises a material with lower resistivity than the front metal layer. The heated piece is moved to a pressing station (7), where it is pressed while the heated areas are cooled.

Abstract: The present disclosure relates to a tool such as an injection molding tool or an embossing tool. A heating device including a stack of layers is provided for heating a tool surface. The stack may include a coil carrier layer with a number of wound coils for generating a magnetic field, and a conductive top layer, being adjacent to the tool surface currents are induced in the top layer to heat the surface. Efficient heating may be provided by solutions involving low resistivity layers that lead currents to the top layer without themselves developing heat to any greater extent. A conduction frame device can be provided beneath the top layer and around the perimeter thereof to provide reliable contact with a backing layer. A thermal resistance layer may placed between the intermediate layer and the top layer, and may comprise a heat resistive plastic material such as a polyimide.

Abstract: The present disclosure relates to a tool such as an injection moulding tool or an embossing tool. A heating device including a stack of layers is provided for heating a tool surface. The stack may include a coil carrier layer with a number of wound coils for generating a magnetic field, and a conductive top layer, being adjacent to the tool surface currents are induced in the top layer to heat the surface. Efficient heating may be provided by solutions involving low resistivity layers that lead currents to the top layer without themselves developing heat to any greater extent. A conduction frame device can be provided beneath the top layer and around the perimeter thereof to provide reliable contact with a backing layer.

Abstract: The present disclosure relates to a tool for injection moulding or embossing/pressing with means for heating an active tool surface, including a coil for generating an oscillating magnetic field in a conductive top layer adjacent to the active tool surface, and an electrically conductive intermediate layer (23), located between the coil carrier layer and the top layer. A thermal resistance layer (29) is located between the intermediate layer and the top layer and comprises a ceramic material thermal spray coating which is bonded to the layer beneath the thermal resistance layer as seen from the active tool surface.

Abstract: The present disclosure relates to a tool such as an injection moulding tool or an embossing tool. A heating device including a stack of layers is provided for heating a tool surface. The stack may include a coil carrier layer with a number of wound coils for generating a magnetic field, and a conductive top layer, being adjacent to the tool surface currents are induced in the top layer to heat the surface. Efficient heating may be provided by solutions involving low resistivity layers that lead currents to the top layer without themselves developing heat to any greater extent. A conduction frame device can be provided beneath the top layer and around the perimeter thereof to provide reliable contact with a backing layer.