Patents Assigned to TDK Electronics AG
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Patent number: 12387860Abstract: In an embodiment an electrical component includes an electrical resistor having a PTC ceramic with a reference temperature exceeding 150° C., wherein, at the reference temperature, a reference resistance is twice an amount of a minimum resistance of the PTC ceramic.Type: GrantFiled: May 27, 2021Date of Patent: August 12, 2025Assignee: TDK Electronics AGInventors: Michael Krenn, Hans Prem, Huinan Xie
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Patent number: 12379782Abstract: A pen-shaped input and/or output device and a method for generating a haptic signal are disclosed. In an embodiment a device includes an actuator unit comprising a piezoelectric actuator, wherein the device is a pen-shaped input and/or output device, and wherein the pen-shaped input and/or output device is configured to determine an acceleration based on voltages recorded by the piezoelectric actuator.Type: GrantFiled: August 3, 2023Date of Patent: August 5, 2025Assignee: TDK Electronics AGInventors: Georg Kügerl, Harald Kastl, Günter Aflenzer, Roman Puchleitner
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Patent number: 12332086Abstract: In an embodiment a sensor device includes a sensor element in a housing, wherein a mechanical fastening element is arranged and fastened to the housing, the mechanical fastening element including a spring element, wherein the housing includes a plastic having a liquid crystal polymer filled with boron nitride, and wherein the housing includes a base part and a cover part connected to each other, and a cavity in which the sensor element is arranged.Type: GrantFiled: October 27, 2020Date of Patent: June 17, 2025Assignee: TDK Electronics AGInventors: Philipp Foerster, Carsten Dehoff
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Patent number: 12322820Abstract: In an embodiment an assembly includes at least one surface mounted device (SMD) component, a metallic wiring configured to lead current from the at least one SMD component to an external circuit and at least one protection element is configured to cover all outer surface of the at least one SMD component and at least parts of the metallic wiring, wherein the assembly has a structure of a molded module, and wherein the at least one SMD component includes a rechargeable all solid-state battery.Type: GrantFiled: March 30, 2021Date of Patent: June 3, 2025Assignee: TDK Electronics AGInventors: Yongli Wang, Qirong Li, Masahiro Oishi, Axel Pecina
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Patent number: 12320716Abstract: In an embodiment a sensor element includes at least one carrier having a top side and a bottom side, the top side being electrically insulating, at least one functional layer including a material with a temperature-dependent electrical resistance, the functional layer being arranged on the carrier, at least two electrodes arranged on the carrier at a distance from one another and at least two contact pads configured for electrically contacting the sensor element, wherein a respective contact pad is arranged directly on a partial region of one of the electrodes, wherein the sensor element is configured to measure a temperature, and wherein the sensor element is configured for direct integration into an electrical system as a discrete component.Type: GrantFiled: August 31, 2021Date of Patent: June 3, 2025Assignee: TDK Electronics AGInventors: Anke Weidenfelder, Jan Ihle, Bernhard Ostrick, Jeffrey Krotosky
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Publication number: 20250157740Abstract: An improved capacitor is provided. The capacitor is of the wound-type category and surface-mountable to provide high capacities in a compact form factor.Type: ApplicationFiled: February 16, 2023Publication date: May 15, 2025Applicant: TDK Electronics AGInventors: Tim LI, William LIANG, Royal QIU, Hongzhi WANG, David OLALLA MARTINEZ, Eduardo DREHMER
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Patent number: 12289059Abstract: An electrical inverter system including a first heat sink, a second heat sink and an electrical capacitor, stacked in that order. These three components can be fixed by a fixing means in such a way that they are not displaceable against each other and at least partially lie flat against each other. Furthermore, the system includes a semiconductor power module clamped between the heat sinks, and electrical contact elements electrically connecting the electrical capacitor and the semiconductor power module.Type: GrantFiled: May 21, 2021Date of Patent: April 29, 2025Assignee: TDK Electronics AGInventors: Wolfgang Rambow, Jürgen Wassmuth, Anthony Thomas
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Patent number: 12287246Abstract: In an embodiment a sensor element includes at least one carrier having a top side and a bottom side, the top side being electrically insulating, at least one functional layer including a material with a temperature-dependent electrical resistance, the functional layer being arranged on the carrier, at least two electrodes arranged on the carrier at a distance from one another and at least two contact pads configured for electrically contacting the sensor element, wherein a respective contact pad is arranged directly on a partial region of one of the electrodes, wherein the sensor element is configured to measure a temperature, and wherein the sensor element is configured for direct integration into an electrical system as a discrete component.Type: GrantFiled: August 31, 2021Date of Patent: April 29, 2025Assignee: TDK Electronics AGInventors: Anke Weidenfelder, Jan Ihle, Bernhard Ostrick, Jeffrey Krotosky
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Publication number: 20250067972Abstract: A piezoelectric mirror component including a mirror element, a piezoelectric drive ring which surrounds the mirror element and is connected to the mirror element by way of at least one first torsion spring element, and a frame element connected to the drive ring via at least one second torsion spring element is specified, wherein the drive ring has a first diameter in a first direction and a second diameter in a second direction perpendicular to the first direction, and the first diameter is greater than the second diameter. A method for operating the piezoelectric mirror component and a projection apparatus are also specified.Type: ApplicationFiled: December 7, 2022Publication date: February 27, 2025Applicant: TDK Electronics AGInventors: Matthias WULF, Franz RINNER
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Patent number: 12237819Abstract: A hybrid filter circuit for reducing common-mode interference signals with frequencies of at least 150 kHz in a power line with at least one phase. The circuit has a passive filter stage and an active filter unit with an active filter stage. The circuit can be coupled to an electrical device on a load side and to a power supply system on a supply side via the power line. The first active filter stage includes a sensor for measuring a common mode noise signal in the power line and a feedback unit with an active amplifier unit for generating a compensation signal counteracting the common mode noise signal, which is coupled into the power line via an output of the first active filter stage. The passive filter stage and the active filter circuit are arranged in cascade between the load terminal and a supply terminal.Type: GrantFiled: June 9, 2023Date of Patent: February 25, 2025Assignee: TDK Electronics AGInventors: Yasin Karinca, Christian Gesell
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Patent number: 12232422Abstract: In an embodiment a piezoelectric multilayer component includes a ceramic main body comprising a ceramic material, wherein a main component of the ceramic material has the general empirical formula (KxNa1-x)NbO3, where 0?x?1, wherein the ceramic material comprises at least two additives selected from a number of compounds respectively comprising at least one metal, wherein a metal of a first additive comprises at least K, Nb, Cu, Mn or Ta, and wherein a metal of a second additive comprises K, Nb or Ta.Type: GrantFiled: October 1, 2019Date of Patent: February 18, 2025Assignee: TDK Electronics AGInventors: Denis Orosel, Yongli Wang
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Patent number: 12217906Abstract: In an embodiment, an inductive component includes at least one electrical conductor, a coil former with a hollow-shaped winding former, on a surface of which the at least one electrical conductor is wound around the winding former, a magnetic core arranged in a first cavity of the winding former and a potting material, wherein the at least one electrical conductor is surrounded by the potting material, wherein the potting material has no directly adherent contact with the magnetic core, wherein the magnetic core comprises a first part-body and a second part-body, which are connected to one another, wherein at least one of the first part-body or the second part-body of the magnetic core comprises a leg arranged in the first cavity of the winding former and at least one further leg arranged outside the first cavity of the winding former.Type: GrantFiled: March 15, 2021Date of Patent: February 4, 2025Assignee: TDK Electronics AGInventors: Matthias Jung, Günter Feist
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Patent number: 12209913Abstract: In an embodiment a device includes a piezoelectric transducer element and a support connected mechanically to each other thereby forming an assembly, wherein the piezoelectric transducer element and the support are configured to be jointly deformed under an action of a first force, wherein the support includes a neutral fiber arranged inside the support, the neutral fiber configured to not undergo any change in length during a bending of the assembly, and wherein the piezoelectric transducer element includes a ferroelectric polymer layer or a layer having a composite material including a ceramic material and a piezoelectric polymer matrix.Type: GrantFiled: May 15, 2020Date of Patent: January 28, 2025Assignee: TDK Electronics AGInventors: Sandro Kappert, Stefan Sax, Dominik Taferner, Amira Hedhili
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Patent number: 12207559Abstract: In an embodiment a method includes applying an AC voltage to an input region, converting, by the input region, the AC voltage into a mechanical oscillation, converting, by an output region, the mechanical oscillation into an electrical voltage and igniting a plasma at an output-side end side of an piezoelectric transformer, wherein the piezoelectric transformer includes the input region and the output region, wherein the piezoelectric transformer includes a longest edge and a shortest edge, and wherein the longest edge has a length that is twenty times a length of the shortest edge or less.Type: GrantFiled: April 16, 2021Date of Patent: January 21, 2025Assignee: TDK Electronics AGInventors: Michael Weilguni, Markus Puff, Pavol Kudela, Bernhard Döllgast
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Publication number: 20250014826Abstract: A bus bar for a capacitor is described, wherein the bus bar is laminated and wherein the bus bar includes a round shape. Furthermore, a capacitor including the bus bar is described.Type: ApplicationFiled: October 11, 2022Publication date: January 9, 2025Applicant: TDK Electronics AGInventors: Tomás WAGNER, Fernando RODRÍGUEZ, Alvaro GONZALEZ, Adrian ARCAS, Manuel GÓMEZ
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Patent number: 12176766Abstract: In an embodiment an EMC filter component includes a first interface, a second interface, a filter circuit, a mechanical connection and a DC-Link capacitor as a circuit element, wherein the filter circuit is electrically connected between the first interface and the second interface, wherein the mechanical connection is configured for mechanically connecting the EMC filter component to an external mounting location, and wherein the mechanical connection is configured for electrically connecting the filter circuit to a ground potential of the external mounting location.Type: GrantFiled: March 24, 2021Date of Patent: December 24, 2024Assignee: TDK Electronics AGInventors: Fabian Beck, Karl Niklas, Wolfgang Rambow
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Patent number: 12177986Abstract: In an embodiment a component includes at least one carrier layer, the carrier layer having a top side and a bottom side and at least one functional layer arranged on the top side of the carrier layer, the functional layer including a material having a specific electrical characteristic, wherein the component is configured for direct integration into an electrical system as a discrete component.Type: GrantFiled: October 12, 2020Date of Patent: December 24, 2024Assignee: TDK Electronics AGInventors: Jan Ihle, Thomas Bernert, Stefan Endler, Michael Krenn, Stephan Bigl, Markus Puff, Sebastian Redolfi
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Patent number: 12172184Abstract: A method for applying a coating to at least one electronic component. The method includes providing a coating carrier having a main base, a coating base having a recess, and a moveable reservoir having a further recess. The method further includes filling a coating material into the recess of the reservoir; sliding the reservoir along a longitudinal axis of the coating carrier such that the recess of the coating base is filled with coating material; providing an electronic component and dipping at least parts of the electronic component into the coating material provided in the recess of the coating base to form a coating of the electronic component. Furthermore, a sensor arrangement for measuring a temperature is described having a coating applied by the method. A coating carrier for applying a coating to an electronic component is described.Type: GrantFiled: August 2, 2022Date of Patent: December 24, 2024Assignee: TDK Electronics AGInventors: Subramanian Ravichandran, Gerhard Hojas
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Patent number: 12154716Abstract: In an embodiment a method for producing an inductive component includes applying a conductive material and an insulating material in an additive manufacturing process. The conductive material forms at least one winding having a plurality of superimposed turns and the insulating material forms a carrier for the at least one winding. The turns are connected to form a spiral-shaped winding.Type: GrantFiled: July 26, 2019Date of Patent: November 26, 2024Assignee: TDK Electronics AGInventors: Michael Rottner, Stefan Weber
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Patent number: 12148553Abstract: The present disclosure specifies a varistor comprising a ceramic body, which comprises a functional ceramic, and electrodes arranged inside the ceramic body. The electrodes include non-floating electrodes, which are electrically connected to external contacts of the varistor, respectively. The electrodes include at least three floating electrodes, which are electrically isolated with respect to the external contacts. At least two floating electrodes are arranged in the same layer, and each of the floating electrodes overlaps with at least two further electrodes. At least two floating electrodes overlap with one of the non-floating electrodes, respectively. A distance (D1) is defined along a longitudinal axis of the ceramic body between two of the electrodes overlapping with a first floating electrodes, and a distance (D2) is defined perpendicular to the longitudinal axis between the first floating electrode and one of the overlapping electrodes. The distance (D1) is at least twice the distance (D2).Type: GrantFiled: November 6, 2020Date of Patent: November 19, 2024Assignee: TDK Electronics AGInventors: Prahlad Malpe Mohandas, S. Soran Nabavi, Alfred Hofrichter