Patents Assigned to TDK Electronics AG
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Patent number: 12782556Abstract: In an embodiment an ultrasonic transducer includes a container having an opening, a base and a wall, a piezoelectric disk arranged within the container on the base, a cover closing the container and an electronics system integrated in the cover, wherein the electronics system makes electrical contact with the piezoelectric disk and is configured to control and to read the piezoelectric disk.Type: GrantFiled: May 29, 2020Date of Patent: November 3, 2026Assignee: TDK Electronics AGInventors: Michael Gebhart, Martina Kreuzbichler, Amira Hedhili, Peter Lukan
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Patent number: 12784995Abstract: A hybrid polymer capacitor includes an anode layer, a cathode layer, a plurality of layers stacked between the anode layer and the cathode layer, and a liquid electrolyte. The plurality of layers includes: (i) a not hydrated metal oxide layer having a thickness of at least 100 nm in a stacking direction, and (ii) a hydrated metal oxide layer arranged on a surface of the not hydrated metal oxide layer. The liquid electrolyte has a conductivity of at least 200 ?S/cm at 30° C. and a water content of at least 0.5%. The hydrated metal oxide layer and the not hydrated metal oxide layer are impregnated with the liquid electrolyte.Type: GrantFiled: February 23, 2023Date of Patent: November 3, 2026Assignee: TDK Electronics AGInventors: László Dobai, Giuseppe Scaduto, Henrietta Rauchne Kocsis
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Patent number: 12759233Abstract: In an embodiment a method includes applying, by a dispenser, a layer of a first raw material to a work surface, the dispenser moving laterally across the work surface, wherein a layer thickness of the first raw material corresponds at least to a desired layer thickness of a layer to be added to the component, bringing the layer of the first raw material into contact with a surface of the component to be coated on the work surface and structurally curing a portion of the first raw material to form a new structured layer of the component, lifting the component comprising the new layer off the work surface, removing, by a first recovering device, a remaining first raw material from the work surface, the first recovering device moving laterally across the work surface and returning the first raw material to a first dispenser and repeating the aforementioned method steps with a second raw material and a second dispenser, wherein a second recovering device is provided so that the first and second raw materials areType: GrantFiled: August 6, 2024Date of Patent: October 13, 2026Assignee: TDK Electronics AGInventors: Christoph Recher, Thomas Lenzen
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Publication number: 20260302087Abstract: A bus bar for a capacitor is described, wherein the bus bar is laminated and wherein the bus bar includes a round shape. Furthermore, a capacitor including the bus bar is described.Type: ApplicationFiled: June 11, 2026Publication date: October 1, 2026Applicant: TDK Electronics AGInventors: Tomás WAGNER, Fernando RODRÍGUEZ, Alvaro GONZALEZ, Adrian ARCAS, Manuel GÓMEZ
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Patent number: 12744160Abstract: The application relates to the process for producing a dielectric for a capacitor, the process for producing a capacitor and a capacitor. The process comprises the production of polymer chains from monomers by polymerization. In this process, some repeating units in the polymer chain are functionalized with reactive groups. The reactive groups branch off from the respective polymer chains. Furthermore, the reactive groups are suitable for reacting with a linker molecule. The reactive groups are therefore suitable for forming a covalent bond with a linker molecule. As a further process step, linker molecules are added to the polymer chains, each linker molecule having at least two chemical linking points, each of which is suitable for forming a covalent bond with a reactive group. Finally, crosslinking of the polymer chains is achieved by reactions of the linker molecules with two reactive groups.Type: GrantFiled: September 22, 2022Date of Patent: September 22, 2026Assignees: TDK Electronics AG, Polymer Competence Center Leoben GmbHInventors: Birgit Six, Stefan Sax, Frank Wiesbrock, Stefan Hirner, Lukas Heupl
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Patent number: 12721167Abstract: A cooling system for a semiconductor device. The system includes a first heat sink containing a ceramic material as a main component and a semiconductor device having a first contact surface. The first heat sink serves for cooling the semiconductor device and as an electrical insulator with respect to the semiconductor device. Furthermore, a first metal-containing layer is provided on at least one outer surface of the first heat sink, the first metal-containing layer having a size at least equal to the area of the first contact surface of the semiconductor device. The semiconductor device is attached to the first metal-containing layer via the contact surface by a first bonding layer formed by soldering or sintering.Type: GrantFiled: July 28, 2020Date of Patent: August 25, 2026Assignee: TDK ELECTRONICS AGInventors: Markus Koini, Markus Puff, Jan Ihle, Nele Reimer
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Patent number: 12695017Abstract: In an embodiment a choke includes a core assembly and a winding block having a predetermined number of turns for each conductor of a multi-conductor system, wherein the core assembly comprises at least one stacking unit comprising a closed ring and a separation unit, wherein the separation unit comprises a separation segment for each conductor, the separation segments being arranged on a first surface of the ring in a pre-determined spaced-apart relationship along a circumferential line of the ring such that a gap is present between each of the adjacent separation segments, wherein each separation segment comprises a ferromagnetic material and/or the closed ring is formed as a closed magnetic toroidal core, wherein the core assembly has an inner opening enclosed by the ring and at least partially by the separation unit, and wherein the winding blocks are arranged in correspondence with the separation segments so that windings of respective winding blocks extend through the inner opening of the core assembly aType: GrantFiled: January 12, 2022Date of Patent: July 28, 2026Assignee: TDK Electronics AGInventor: Michael Vornkahl
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Patent number: 12695040Abstract: Embodiments provide a housing assembly including a housing having a plug-in side and enclosing an electromechanical component, the housing configured for mounting on a carrier, wherein the housing has a first assembly guide configured for engaging in a first plug-in slot guide arranged on the carrier, and wherein the plug-in side of the housing is guidable into a plugged-in position on the carrier by this engagement.Type: GrantFiled: January 25, 2022Date of Patent: July 28, 2026Assignee: TDK Electronics AGInventors: Robert Hoffmann, Robert Minkwitz
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Patent number: 12688975Abstract: A bus bar for a capacitor is described, wherein the bus bar is laminated and wherein the bus bar includes a round shape. Furthermore, a capacitor including the bus bar is described.Type: GrantFiled: October 11, 2022Date of Patent: July 21, 2026Assignee: TDK Electronics AGInventors: Tomás Wagner, Fernando Rodríguez, Alvaro Gonzalez, Adrian Arcas, Manuel Gómez
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Patent number: 12684299Abstract: The present invention relates to split electrodes for microelectromechanical system (MEMS) microphones. In one embodiment, a MEMS sensor includes a membrane, a membrane electrode formed in a portion of the membrane, and a backplate situated parallel to the membrane and separated by a gap. The backplate includes a first region of the backplate, where the first region of the backplate has first perforations of a first density, a backplate electrode is formed in a portion of the first region of the backplate, and a portion of the membrane electrode overlaps a portion of the backplate electrode in a sensing region forming a sensing capacitor, the sensing capacitor being configured to sense motion of the membrane in response to acoustic pressure. The backplate also includes a second region of the backplate having second perforations of a second density, where the second density is greater than the first density.Type: GrantFiled: August 11, 2023Date of Patent: July 14, 2026Assignees: INVENSENSE, INC, TDK ELECTRONICS AGInventors: Joseph Seeger, Dennis Mortensen
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Patent number: 12683091Abstract: A capacitor includes a capacitive element arranged in a housing, wherein in or on the housing a gas dissipation element is arranged and/or wherein the capacitor has an electrolyte that comprises an organic acid having a pka of 4.1 or higher and/or wherein the capacitor has an OMS of 20% or higher.Type: GrantFiled: June 21, 2024Date of Patent: July 14, 2026Assignee: TDK Electronics AGInventor: László Dobai
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Patent number: 12652959Abstract: A piezoelectric assembly comprises a substrate of Ni, Cu, or steel, a first oriented layer assembled on the substrate, and a piezoelectric layer on the oriented layer. The piezoelectric layer has a degree of orientation with respect to the local surface normal of 90% or more.Type: GrantFiled: June 2, 2021Date of Patent: June 9, 2026Assignee: TDK ELECTRONICS AGInventors: Marko Vrabelj, Sebastian Redolfi
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Patent number: 12634019Abstract: In an embodiment an acoustic transmission system includes a primary side having a transmitting unit configured to provide a transmit signal, a receiving unit configured to receive a received signal in response to the transmitted signal and an electroacoustic transducer configured to convert the transmit signal into an acoustic signal and an acoustic signal into the receive signal and a secondary side having a transponder configured to receive a receive signal and transmit a transmit signal and an electroacoustic transducer located between the primary side and the secondary side, the electroacoustic transducer having a medium permeable to acoustic signals.Type: GrantFiled: March 1, 2021Date of Patent: May 19, 2026Assignee: TDK Electronics AGInventors: Michael Gebhart, Renate Walter
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Patent number: 12620521Abstract: In an embodiment a coil includes a tube comprising a tube wall composed of an electrically conductive material, wherein the tube wall has an inductive portion in which a gap is arranged that shapes the tube wall so the tube wall forms a helix in the inductive portion, and wherein the tube wall has two contact portions, each contact portion forming an electrical terminal.Type: GrantFiled: February 14, 2020Date of Patent: May 5, 2026Assignee: TDK Electronics AGInventors: Stephan Bühlmaier, Felipe Jerez Galdeano, Joachim Nassal, Anneliese Drespling, Gerhard Proks, Herbert Lux
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Patent number: 12611537Abstract: A ceramic electrode comprising a support member as a mechanically stabilizing component, a dielectric layer having a thickness (D) which is less than or equal to 150 ?m, and an electrode layer.Type: GrantFiled: November 29, 2021Date of Patent: April 28, 2026Assignee: TDK Electronics AGInventors: Manfred Schweinzger, Stefan Obermair
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Patent number: 12597575Abstract: In embodiments a housing includes a first housing component and a second housing, the second housing component having a first guide groove, wherein the first housing component comprises a first complementary element, and wherein the first complementary element and the first guide groove are designed such that the housing components are connectable to form the housing by sliding one inside the other along a guide direction.Type: GrantFiled: January 25, 2022Date of Patent: April 7, 2026Assignee: TDK ELECTRONICS AGInventors: Robert Hoffmann, Robert Minkwitz
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Patent number: 12573541Abstract: In an embodiment a coil includes a tube having a tube wall of an electrically conductive material, wherein the tube has an inductive portion in which a gap is arranged in the tube wall which shapes the tube wall in the inductive portion to form a helix, wherein the tube has at least one contact section including a connection region and at least one terminal region, wherein the connection region has the same contour as an adjacent portion of the helix, wherein the terminal region is an electrical terminal of the coil, and wherein the connection region electrically connects the terminal region to the inductive portion.Type: GrantFiled: April 7, 2021Date of Patent: March 10, 2026Assignee: TDK Electronics AGInventors: Stephan Bühlmaier, Anneliese Drespling, Felipe Jerez Galdeano, Joachim Sorg, Herbert Lux, Gerhard Proks
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Patent number: 12560489Abstract: In an embodiment a sensor arrangement includes a ceramic-based substrate, at least one sensor chip connected directly to the substrate in a horizontal position by a bonding material, at least one first contact element and at least one second contact element configured to act as outer electrodes of the sensor arrangement, wherein the first contact element comprises a contact member configured to electrically contact the sensor chip by the bonding material and an insulating body enveloping the sensor chip and at least parts of the contact elements, wherein the substrate is mainly free from a material of the insulating body.Type: GrantFiled: December 1, 2021Date of Patent: February 24, 2026Assignee: TDK Electronics AGInventors: Abraham Kho, Guido Mauthe, Andi Permana
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Patent number: 12550258Abstract: A solder connection that connects a contact pad on a first surface to a strip-shaped conductor. The strip-shaped conductor has a widening at one end and a through opening therein. A solder ball is located in the opening and connects the end of the conductor to the contact pad.Type: GrantFiled: February 26, 2021Date of Patent: February 10, 2026Assignee: TDK Electronics AGInventors: Bettina Milke, Erkan Eser
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Patent number: 12545320Abstract: A control element for use, for example with a vehicle is disclosed. The control element includes at least one tubular section with a cavity at least partially surrounded by a wall, and a piezoelectric component. The piezoelectric component is arranged in the cavity and generates a haptic signal at at least one partial region of the control element and/or detects the action of pressure on at least one part of the piezoelectric component. Furthermore, the vehicle with the control element is also specified.Type: GrantFiled: April 9, 2021Date of Patent: February 10, 2026Assignee: TDK ELECTRONICS AGInventors: Bernhard Stanje, Andreas Pentscher-Stani, Johannes Burger