Patents Assigned to TDY Industries, Inc.
  • Patent number: 6358428
    Abstract: Method for removing a portion of the binder phase from the surface of a substrate that is composed of particles of at least a first phase joined together by the binder phase, and wherein the surface is etched by contacting it with a gas flow of an etchant gas and a second gas. The second gas is one or more gases that will not react with the substrate or the removed binder phase and will not alter the oxidation state of the substrate during etching.
    Type: Grant
    Filed: July 28, 2000
    Date of Patent: March 19, 2002
    Assignee: TDY Industries, Inc.
    Inventors: Roy V. Leverenz, John Bost
  • Patent number: 6315325
    Abstract: An apparatus for tuning the weight distribution in a vehicle, typically a high performance automobile, is provided. The apparatus includes a weight tray having an internal passage, a screw element, typically a threaded bolt, that extends into an end of the internal passage, a retainer at the same end of the passage, defining a hole through which the screw is rotatably retained, a primary weight is disposed within the passage and having a bore into which the screw extends and a nut or a threaded portion (i.e., a tapped portion) disposed within the bore that operatively engages the threads of the screw. Additional weights may be attached to the primary weight to increase the weight in the weight tray. The primary and additional weights may further include interlocking portions that are suitably configured to interlock with a corresponding interlocking portion on another weight. One or more of the weights may be assembled from two weight segments to facilitate assembly of the apparatus with minimal tools.
    Type: Grant
    Filed: October 23, 2000
    Date of Patent: November 13, 2001
    Assignee: TDY Industries, Inc.
    Inventor: Jerry R. Dunn
  • Patent number: 6214247
    Abstract: Method for removing a portion of the binder phase from the surface of a substrate that is composed of particles of at least a first phase joined together by the binder phase, and wherein the surface is etched by contacting it with a gas flow of an etchant gas and a second gas. The second gas is one or more gases that will not react with the substrate or the removed binder phase and will not alter the oxidation state of the substrate during etching.
    Type: Grant
    Filed: June 10, 1998
    Date of Patent: April 10, 2001
    Assignee: TDY Industries, Inc.
    Inventors: Roy V. Leverenz, John Bost