Abstract: An assembly includes a circuit carrier having a first surface and a second surface opposite to the first surface, a first sub-assembly detachably connected to the first surface of the circuit carrier, and a second sub-assembly detachably connected to the second surface of the circuit carrier. The circuit carrier has an electrically conductive lead interconnecting the first sub-assembly and the second sub-assembly.
Type:
Application
Filed:
February 11, 2020
Publication date:
August 13, 2020
Applicants:
TE Connectivity India Private Limited, TE Connectivity Italia Distribution S.r.I.