Patents Assigned to TEAM GROUP INC.
  • Publication number: 20230033193
    Abstract: Disclosed is a water-cooling device for a solid-state disk, comprising: a water-cooling component, including a water block and a water pump disposed in the water block, the water block being provided with a heat conducting member to form heat conduction with the solid-state disk; a first pipe; a second pipe; and a water-cooling radiator component having a heat radiator, wherein the first pipe and the second pipe are connected between the radiator and the water-cooling component, the water pump is provided to drive cooling liquid to flow in a liquid circulating sequence of the water-cooling component, the second pipe, the water-cooling radiator component, the first pipe and the water-cooling component, and the heat radiator of the water-cooling radiator component is provided to transfer heat from the cooling liquid to the air.
    Type: Application
    Filed: March 22, 2022
    Publication date: February 2, 2023
    Applicant: TEAM GROUP INC.
    Inventors: Hsun Chia MA, Tzu Hsien CHUANG, Kuan Ting CHEN
  • Publication number: 20220418080
    Abstract: Disclosed is an active cooling storage device comprising: a memory having memory chips; a thermal pad attached to the memory chips; a heat dissipater having a heat sink and a metal base, a receiving concave being provided between the heat sink and the metal base, the metal base being contacted with a bottom surface of the heat sink an upper surface of the thermal pad; a thermoelectric cooler, which is disposed within the receiving concave in such a manner that a cold side of the thermoelectric cooler facing an upper surface of at least one of the memory chips and facing toward the metal base, and a hot side of the thermoelectric cooler facing toward the heat sink; and a cooler controller, which receives a memory temperature value of the memory, and controlling the thermoelectric cooler to be activated when the memory temperature value is higher than a threshold temperature value.
    Type: Application
    Filed: July 26, 2021
    Publication date: December 29, 2022
    Applicant: TEAM GROUP INC.
    Inventors: Hsun Chia MA, Tzu Hsien CHUANG, Kuan Ting CHEN
  • Patent number: 11488679
    Abstract: Disclosed is a method for grading memory modules comprising: a testing step which applies at least one test procedure to test a memory, each test procedure is provided with a reliability test; and a grading step which grades the memory into corresponding grade level according to test results of said at least one test procedure, and each test result includes a reliability test result wherein the reliability test has the following steps in sequence: performing a data-writing operation on the memory, wherein the data-writing operation is an operation that writes data to the memory; stopping electric charging the memory; halting a predetermined time period; electric charging the memory; checking data integrity of the memory; and generating the reliability test result according to the data integrity.
    Type: Grant
    Filed: September 14, 2021
    Date of Patent: November 1, 2022
    Assignee: TEAM GROUP INC.
    Inventors: Hsi-Lin Kuo, Ming-Hsun Chung, Chin-Feng Chang
  • Patent number: 11439004
    Abstract: Disclosed is a durable memory device comprising: a multilayer PCB having a plurality of circuit layers and a plurality of circuit layers insulating layers alternately arranged with each other, ach circuit layer being provided with a via through which the plurality of circuit layers are electrically connected, and the circuit layers has at least one ground layer; a memory member; a connection interface for connecting to a corresponding connecting portion of a computing device; and an anti-sulfuration-and-anti-high-voltage passive component which is disposed at the multilayer PCB and electrically connected to the connection interface and the memory member. By combining the anti-sulfuration-and-anti-high-voltage passive component and multilayer PCB, the durable memory device of the present invention is durable for the outdoor use.
    Type: Grant
    Filed: April 15, 2021
    Date of Patent: September 6, 2022
    Assignee: TEAM GROUP INC.
    Inventor: Chin Feng Chang
  • Publication number: 20220264740
    Abstract: Disclosed is a durable memory device comprising: a multilayer PCB having a plurality of circuit layers and a plurality of circuit layers insulating layers alternately arranged with each other, ach circuit layer being provided with a via through which the plurality of circuit layers are electrically connected, and the circuit layers has at least one ground layer; a memory member; a connection interface for connecting to a corresponding connecting portion of a computing device; and an anti-sulfuration-and-anti-high-voltage passive component which is disposed at the multilayer PCB and electrically connected to the connection interface and the memory member. By combining the anti-sulfuration-and-anti-high-voltage passive component and multilayer PCB, the durable memory device of the present invention is durable for the outdoor use.
    Type: Application
    Filed: April 15, 2021
    Publication date: August 18, 2022
    Applicant: TEAM GROUP INC.
    Inventor: Chin Feng CHANG
  • Patent number: 11051392
    Abstract: The present invention relates to a heat dissipating device disposed on a circuit board. The heat dissipating device is provided with a first glue layer, a first graphene composite heat dissipating layer, a second glue layer, a second graphene composite heat dissipating layer, and a resin layer in this order from bottom to top. Furthermore, the first graphene composite heat dissipating layer and the second graphene composite heat dissipating layer are doped with a plurality of metal particles, and the first graphene composite heat dissipating layer and the second graphene composite heat dissipating layer are respectively covered by a metal layer. The above structure is simple, space-saving, and has good thermal conductivity.
    Type: Grant
    Filed: November 26, 2019
    Date of Patent: June 29, 2021
    Assignee: Team Group Inc.
    Inventor: Chin Feng Chang
  • Patent number: 10803713
    Abstract: A luminous solid-state disk, comprises: a solid-state disk; a light-emitting member; a light-emitting controller; a disk enclosure accommodating the solid-state disk, the light-emitting member and the light-emitting controller, the disk enclosure having a connection interface, the light-emitting controller in connection to the connection interface to receive, through the connection interface, a computer terminal information from a computer, the light-emitting controller uses, according to the computer terminal information, a control signal to control the light-emitting member, the disk enclosure having a main wall surface, which is transparent, wherein light from the light-emitting member directly transmits through the main wall surface or is reflected to transmit through the main wall surface. Through the above structure, the main wall surface can be used as an information display to inform the user of the computer information.
    Type: Grant
    Filed: September 19, 2019
    Date of Patent: October 13, 2020
    Assignee: TEAM GROUP INC.
    Inventors: Chin-Feng Chang, Tzu-Hsien Chuang, Hung-Lieh Lin