Abstract: A method for packaging one or more power semiconductor devices is provided. A lead frame comprising one or more base die paddles, multiple lead terminals, and a tie bar assembly is constructed. The lead terminals extend to a predetermined elevation from the base die paddles. The base die paddles are connected to the lead terminals by the tie bar assembly. The tie bar assembly mechanically couples the base die paddles to each other and to the lead terminals. The tie bar assembly is selectively configured to isolate the lead terminals from the base die paddles and to enable creation of multiple selective connections between one or more of the lead terminals and one or more power semiconductor devices mounted on the base die paddles, thereby enabling flexible packaging of one or more isolated and/or non-isolated power semiconductor devices and increasing their power handling capacity.

Abstract: Packaging for power circuitry. A circuit board and a power lead frame are packaged together in a module. In addition to providing electrical connections to power circuitry, the lead frame is employed to fix or partially fix the location of the circuit board in the package. For this purpose, one of the power lead frame and the circuit board includes a male portion and the other of the power lead frame and the circuit board includes a complementary female portion for mechanically coupling the circuit board and the lead frame.