Patents Assigned to Teca Technologies Limited
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Patent number: 10537208Abstract: A cooking apparatus includes first and second griddles, each having a generally planar cooking surface for cooking food. A first lifting mechanism is configured to elevate the first griddle such that a food item on the cooking surface of the first griddle is predisposed to fall onto the cooking surface of the second griddle. A first wiper is configured to sweep the cooking surface of the first griddle to facilitate detachment of any food item attached to the cooking surface of the first griddle for transfer such food item to the cooking surface of the second griddle. The first and second griddles, first lifting mechanism, and first wiper are interconnected preferably to form a portable, integrated cooking product. These components preferably are enclosed within a housing for presenting a refined consumer product for use in a home kitchen and are arranged so as to define a compact volume and footprint.Type: GrantFiled: August 6, 2018Date of Patent: January 21, 2020Assignee: TECA TECHNOLOGIES LIMITEDInventors: Andrew James Lee, Preston Moeller, Zhong Quan Si
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Patent number: 10039416Abstract: A cooking apparatus includes first and second griddles, each having a generally planar cooking surface for cooking food. A first lifting mechanism is configured to elevate the first griddle such that a food item on the cooking surface of the first griddle is predisposed to fall onto the cooking surface of the second griddle. A first wiper is configured to sweep the cooking surface of the first griddle to facilitate detachment of any food item attached to the cooking surface of the first griddle for transfer such food item to the cooking surface of the second griddle. The first and second griddles, first lifting mechanism, and first wiper are interconnected preferably to form a portable, integrated cooking product. These components preferably are enclosed within a housing for presenting a refined consumer product for use in a home kitchen and are arranged so as to define a compact volume and footprint.Type: GrantFiled: June 26, 2017Date of Patent: August 7, 2018Assignee: TECA TECHNOLOGIES LIMITEDInventors: Andrew James Lee, Preston Moeller, Zhong Quan Si
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Patent number: 9687110Abstract: A cooking apparatus includes first and second griddles, each having a generally planar cooking surface for cooking food. A first lifting mechanism is configured to elevate the first griddle such that a food item on the cooking surface of the first griddle is predisposed to fall onto the cooking surface of the second griddle. A first wiper is configured to sweep the cooking surface of the first griddle to facilitate detachment of any food item attached to the cooking surface of the first griddle for transfer such food item to the cooking surface of the second griddle. The first and second griddles, first lifting mechanism, and first wiper are interconnected preferably to form a portable, integrated cooking product. These components preferably are enclosed within a housing for presenting a refined consumer product for use in a home kitchen and are arranged so as to define a compact volume and footprint.Type: GrantFiled: December 1, 2014Date of Patent: June 27, 2017Assignee: TECA TECHNOLOGIES LIMITEDInventors: Andrew James Lee, Preston Moeller, Zhong Quan Si
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Patent number: 9521479Abstract: Headphones or a headset comprise a pair of electro-acoustic transducers (1, 2), both ear-pieces and an earpiece and a microphone are carried at opposite ends of a curved headband (3) that is formed by a chain of links (500-511) that are hinged to one another and the transducers (1, 2). Each link (5) involves a shell-casing (8) that on an underside has a first pair of mutually-spaced projecting lugs (9) and has a second pair of mutually-spaced projecting lugs (10) that nest with the first pair of lugs (9) of the next-following link (5). The nested lugs (9, 10) are pierced transversely and pivot pins (11) are inserted in the piercings to establish hinges (7) between the links (5). The transducers (1, 2) are hinged to the ends of the headband (3) to enable the headphones or headset to be rolled up lengthwise of the headband (3).Type: GrantFiled: August 30, 2013Date of Patent: December 13, 2016Assignee: Teca Technologies LimitedInventor: Andrew James Lee