Patents Assigned to Tech-Sonic, Inc.
  • Publication number: 20230405706
    Abstract: An ultrasonic tab welder, useful for welding metal ribbon to metal sheet, has an ultrasonic stack having a horn configured to include a pair of ends between which are one or more upstanding welding stud surfaces and held by a bracket assembly. The bracket assembly includes a horn holder terminating at either end with U-shaped legs holding either end of the horn and an upper U-shaped legs having a generally horizontal piece carrying a strain gauge. A T-shaped assembly mated with the horn holder U-shaped legs that are carried by a U-shaped holder by a pair of downward holder legs. A pair of ball bearing assemblies are captured between the downward holder legs, the upper holder U-shaped legs, and the horn holder up U-shaped legs. The horn upstanding welding stud surfaces conformingly mate with the metal ribbon as it is welded to the metal sheet.
    Type: Application
    Filed: June 21, 2022
    Publication date: December 21, 2023
    Applicant: Tech-Sonic Inc.
    Inventors: David Lee Cyphert, Byoung Soo Ou
  • Patent number: 11517977
    Abstract: An ultrasonic welding apparatus joins metal pieces, such as wires, which are placed in a weldment zone where the metal pieces are subjected to pressure through a compressive height anvil and an adjustable width anvil, and intimate contact is made with a sonotrode of an ultrasonic stack. A first electric motor actuates movement of the height anvil to develop a compressive force for ultrasonic welding of the metal pieces. A second electric motor can position the width anvil before and during welding. A sensor, such as a load cell, measures the compressive force developed. The sensor directly can measure the load on the height anvil independent of the ultrasonic stack. A software algorithm can compensate for deflection of the load cell sensor and lost motion in the first electric motor actuating movement.
    Type: Grant
    Filed: March 21, 2018
    Date of Patent: December 6, 2022
    Assignee: Tech-Sonic, Inc.
    Inventors: Byoung Ou, David Lee Cyphert, Jason E. Smith
  • Publication number: 20210346977
    Abstract: An ultrasonic welding apparatus joins metal pieces, such as wires, which are placed in a weldment zone where the metal pieces are subjected to pressure through a compressive height anvil and an adjustable width anvil, and intimate contact is made with a sonotrode of an ultrasonic stack. A first electric motor actuates movement of the height anvil to develop a compressive force for ultrasonic welding of the metal pieces. A second electric motor can position the width anvil before and during welding. A sensor, such as a load cell, measures the compressive force developed. The sensor directly can measure the load on the height anvil independent of the ultrasonic stack. A software algorithm can compensate for deflection of the load cell sensor and lost motion in the first electric motor actuating movement.
    Type: Application
    Filed: March 21, 2018
    Publication date: November 11, 2021
    Applicant: Tech-Sonic, Inc.
    Inventors: Byoung Ou, David Lee Cyphert, Jason E. Smith
  • Publication number: 20200070276
    Abstract: An ultrasonic welding assembly joins bare ends of an insulated wire bundle to a wire terminal in a weldment zone by intimate contact with a sonotrode of an ultrasonic stack. A door allows the operator to place the terminal into the nest within the weldment zone. One operator hand holds the wire bundle while one contacts an external sensor. A pair of terminal clamps extend inwardly and down to secure the terminal and create a taller capture area for the loose bare wire ends. A pair of clamp finger assemblies reversibly extend towards the insulated wires away from the weldment zone for securing the wires. A wire gatherer descends upon and captures all of the wire bare ends and secures them until the horn descends, captures, and holds the wire ends in place, then extends away from the weldment zone for ultrasonic welding to commence.
    Type: Application
    Filed: August 31, 2018
    Publication date: March 5, 2020
    Applicant: Tech-Sonic, Inc.
    Inventors: Byoung Soo Ou, David Lee Cyphert