Abstract: Provided is a temperature control system configured to mix a low temperature heating medium and a high temperature heating medium to supply the heating mediums at a temperature according to a process recipe to an electrostatic chuck (ESC) configured to maintain a temperature and support a wafer in a chamber in which a semiconductor wafer processing process is performed, and a heating medium obtained by mixing a heating medium cooled through a thermoelectric element and a heating medium heated through a heater to a desired target temperature according to a first ratio and a second ratio is provided to a load and recovered from the load, and the heating medium is distributed to the thermoelectric element and the heater according to the first ratio and the second ratio, which are ratios upon the mixing, optimizing power consumption for cooling or heating.

Abstract: Provided is a temperature control system configured to mix a low temperature heating medium and a high temperature heating medium to supply the heating mediums at a temperature according to a process recipe to an electrostatic chuck (ESC) configured to maintain a temperature and support a wafer in a chamber in which a semiconductor wafer processing process is performed, and a heating medium obtained by mixing a heating medium cooled through a thermoelectric element and a heating medium heated through a heater to a desired target temperature according to a first ratio and a second ratio is provided to a load and recovered from the load, and the heating medium is distributed to the thermoelectric element and the heater according to the first ratio and the second ratio, which are ratios upon the mixing, optimizing power consumption for cooling or heating.

Abstract: Provided is a temperature control system configured to mix a low temperature heating medium and a high temperature heating medium to supply the heating mediums at a temperature according to a process recipe to an electrostatic chuck (ESC) configured to maintain a temperature and support a wafer in a chamber in which a semiconductor wafer processing process is performed, and a heating medium obtained by mixing a heating medium cooled through a thermoelectric element and a heating medium heated through a heater to a desired target temperature according to a first ratio and a second ratio is provided to a load and recovered from the load, and the heating medium is distributed to the thermoelectric element and the heater according to the first ratio and the second ratio, which are ratios upon the mixing, optimizing power consumption for cooling or heating.

Abstract: A wide range temperature control system for semiconductor manufacturing equipment uses a thermoelectric element applied to a chiller that is a temperature control device for semiconductor manufacturing equipment. The refrigerant circulated through a refrigerant tank passes through thermoelectric element block groups and is cooling and heating controlled, outputs of the thermoelectric element block groups are then supplied to a load, a heat exchanger using process cooling water (PCW) is configured in the refrigerant tank in which the refrigerant recirculated from a working load is stored, a heater for high temperature heating is further configured, some of the thermoelectric element block groups at a high temperature are bypassed through a variable valve, the polarity of a voltage is reversed in the thermoelectric element block groups through which a high-temperature refrigerant passes, and a part of an insulating element adjacent to the refrigerant is maintained at a lower temperature than the refrigerant.

Abstract: Provided is a temperature control system configured to mix a low temperature heating medium and a high temperature heating medium to supply the heating mediums at a temperature according to a process recipe to an electrostatic chuck (ESC) configured to maintain a temperature and support a wafer in a chamber in which a semiconductor wafer processing process is performed, and a heating medium obtained by mixing a heating medium cooled through a thermoelectric element and a heating medium heated through a heater to a desired target temperature according to a first ratio and a second ratio is provided to a load and recovered from the load, and the heating medium is distributed to the thermoelectric element and the heater according to the first ratio and the second ratio, which are ratios upon the mixing, optimizing power consumption for cooling or heating.

Abstract: Provided is a temperature control system configured to mix a low temperature heating medium and a high temperature heating medium to supply the heating mediums at a temperature according to a process recipe to an electrostatic chuck (ESC) configured to maintain a temperature and support a wafer in a chamber in which a semiconductor wafer processing process is performed, and a heating medium obtained by mixing a heating medium cooled through a thermoelectric element and a heating medium heated through a heater to a desired target temperature according to a first ratio and a second ratio is provided to a load and recovered from the load, and the heating medium is distributed to the thermoelectric element and the heater according to the first ratio and the second ratio, which are ratios upon the mixing, optimizing power consumption for cooling or heating.

Abstract: Provided is a temperature control system configured to mix a low temperature heating medium and a high temperature heating medium to supply the heating mediums at a temperature according to a process recipe to an electrostatic chuck (ESC) configured to maintain a temperature and support a wafer in a chamber in which a semiconductor wafer processing process is performed, and a heating medium obtained by mixing a heating medium cooled through a thermoelectric element and a heating medium heated through a heater to a desired target temperature according to a first ratio and a second ratio is provided to a load and recovered from the load, and the heating medium is distributed to the thermoelectric element and the heater according to the first ratio and the second ratio, which are ratios upon the mixing, optimizing power consumption for cooling or heating.

Abstract: Disclosed is a temperature control apparatus having a new structure capable of enhancing efficiency by reducing evaporation of a thermal medium at a high temperature and extending a life span of a heat exchanger.

Abstract: An edge ring cooling module for semiconductor manufacturing chuck is provided which effectively cools the edge ring equipped in electrostatic chuck. The edge ring cooling module forcibly exhausts the heat of an edge ring (20) using an electronic cooling device (32) to top of a large-diameter portion (11) to effectively cool the edge ring (20) so that the temperature of the edge ring (20) is similar to that of top of a small-diameter portion (12) of a chuck body (10) to eventually improve the yield ratio while reducing the failure ratio.

Abstract: A wide range temperature control system for semiconductor manufacturing equipment uses a thermoelectric element applied to a chiller that is a temperature control device for semiconductor manufacturing equipment. The refrigerant circulated through a refrigerant tank passes through thermoelectric element block groups and is cooling and heating controlled, outputs of the thermoelectric element block groups are then supplied to a load, a heat exchanger using process cooling water (PCW) is configured in the refrigerant tank in which the refrigerant recirculated from a working load is stored, a heater for high temperature heating is further configured, some of the thermoelectric element block groups at a high temperature are bypassed through a variable valve, the polarity of a voltage is reversed in the thermoelectric element block groups through which a high-temperature refrigerant passes, and a part of an insulating element adjacent to the refrigerant is maintained at a lower temperature than the refrigerant.