Abstract: An electroless catalytic gold plating solution is disclosed comprising a water soluble organic thiol gold (I) complex, an alkali metal cyanide, an alkali metal hydroxide, a borohydride reducing agent, and may also contain a stabilizing agent. The electroless gold plating solution will deposit gold on a gold surface several times faster than the conventional electroless gold baths based on potassium aurous cyanide. The use of an organic thiol gold (I) complex eliminates the buildup of inhibitory cyanide ions as a result of replenishment.
Abstract: Baths and methods for the electroplating of tin, tin-lead, tin-antimony, and/or tin-bismuth are described. Specifically, electrodeposition solutions, based on alkanesulfonic acids, soluble metal salts, other additives, and at least one nonionic surfactant terminated with a ketone group, have been developed. The use of ketone (e.g., --OCH.sub.2 COCH.sub.3) terminated polyoxyalkylene surfactants results in electrodeposition solutions with reduced foam, and the tin and tin alloy electrodeposits from such plating baths are of superior quality.
Type:
Grant
Filed:
June 28, 1993
Date of Patent:
February 1, 1994
Assignee:
Technic Incorporated
Inventors:
Michael D. Gernon, Harry H. Kroll, Hanoch S. Elroi
Abstract: Disclosed are cyanide free electroplating solutions for gold or alloys thereof; said solutions comprising gold in the form of a soluble sulfite complex, an added source of sulfite and/or bisulfite ion and a supporting electrolyte; and said solutions further comprising both an organic polyamine or mixture of polyamines of molecular weight from about 60 to 50,000, and an aromatic organic nitro compound; wherein the pH of said solutions is below about 6.5.
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