Abstract: A method of removing coatings, such as paint, epoxy resin, comestible polymeric coatings, from the surface of metallic containers, such as aluminum beverage cans, is disclosed. The metallic surfaces of containers are contacted with a mixture of bacteria and nutrient medium. The bacteria used are capable of removing paint, epoxy resins, and coatings from metallic surfaces, and are preferably ATCC #53922 bacteria. Also disclosed is an apparatus suitable for use in the invention, and further described is a reagent for paint removal from beverage cans.
Type:
Grant
Filed:
August 31, 1989
Date of Patent:
February 4, 1992
Assignee:
Technical Research, Inc.
Inventors:
Gail L. A. Bowers-Irons, Quynh K. Tran, Robert J. Pryor
Abstract: Disclosed is a high temperature process (e.g.>60.degree. C.) for leaching selected metal compounds e.g. gallium or germanium from ore containing those compounds. The method includes placing the ore into a culture medium containing bacteria. Bacteria capable of leaching the metal compounds from the ore leach the metals from the ore. The bacteria preferably used will be bacteria ATCC 53921 and mutations and recombinants thereof. The ore is generally crushed to between 20 and -400 mesh before placement into the culture medium cThis invention was made with Government support under Contract No. F33615-87-C-5303 awarded by the United Stated Air Force. The Government has certain rights in this invention.
Type:
Grant
Filed:
August 31, 1989
Date of Patent:
July 9, 1991
Assignee:
Technical Research, Inc.
Inventors:
Gail L. A. Bowers-Irons, John R. Pease, Quynh K. Tran, Tracy Gibb, Robert J. Pryor, Sandra Haddad
Abstract: Disclosed is a process for leaching selected metal compounds (e.g. gallium arsenide) from integrated circuits containing those compounds. The method includes placing the integrated circuits into a culture medium containing bacteria. Bacteria capable of leaching the metal compounds from the integrated circuits leach the metals from the integrated circuits. The bacteria preferably used will be ATCC 53921 and mutations and recombinants thereof. The integrated circuits are generally crushed to between 20 and -400 mesh before placement into theThis invention was made with Government support under Contract No. F33615-87-C-5303 awarded by the United States Air Force. The Government has certain rights in this invention.