Abstract: The invention relates to a medical diagnostic device (1) having at least one sensor matrix (2) for capturing electrical voltage signals at a plurality of locations on the body surface of a person or animal, wherein the diagnostic device (1) is set up for capturing a signal (12) representing the position of the sensor matrix (2) relative to the body of the person or animal, and for determining position information (14) about the position of the sensor matrix (2) relative to the body, localized image information (13) is determined from the voltage signals, and the localized image information (13) is associated with the position information (14).

Abstract: A method of manufacturing of a semi-conductor element, comprising the following steps: providing a substrate, the substrate having a surface, the surface being partially coated with a coating and having at least one uncoated area, and growing a truncated pyramid of gallium nitride on the uncoated area, wherein the method comprises the following step: growing at least one gallium nitride column on the truncated pyramid.

Abstract: A method is provided for producing microscopically small components. The method can produce components with a size of less than 10 ?m. The method includes: (a) Production of a precipitation hardenable alloy comprising at least two phases, in which alloy of a first phase forms a matrix structure in which a second phase is embedded in the form of discrete particles of a size less than 10 ?m; (b) Dissolution of the matrix and separation of particles from the alloy; and (c) Mechanical deformation by forging respectively a separated particle with at least one striking tool to form the desired element.

Abstract: A multi-layer capacitor includes several electrically insulating layers that are stacked on top of one another. Parallel electrode plates are arranged between the insulating layers alternately one on top of the other, with each of the plates being separated by an intervening insulating layer. At least one first connecting line which extends perpendicularly through the layers is connected to one set of electrode plates and is insulated in relation to the other set of second electrode plates. Similarly, second connecting lines extend perpendicularly through the layers and are connected to the other set of plates and are insulated in relation to the one set of plates. The first connecting line extends centrally through the stacked electrode plates and is designed to carry a high-frequency signal.

Abstract: A multichip circuit module includes a main board, at least one carrier substrate mounted on and in electrical contact with the main board, and at least one semiconductor chip arranged on the carrier substrate and in electrical contact therewith. The carrier substrate has at least one cavity on an assembly surface for receiving the semiconductor chip. The cavity includes connecting contacts which join with associated bumps on the semiconductor chip using a flip-chip technique. The assembly surface of the carrier substrate is placed on a contact surface of the main board, and a filling material is provided between the contract surface of the main board and the assembly surface of the carrier substrate.

Abstract: An optical component for effecting frequency selective reflection in the gigahertz and terahertz frequency ranges and for effecting wave permeability includes at least one first layer (1, 3, 5) made of a first material (m1). The first material is optically permeable to electromagnetic radiation of a reference frequency (f) between 5 gigahertz (GHz) and 10 terahertz (THz) and has a first refractive index (n1) and an optical thickness of approximately one-fourth the wavelength (?) of the electromagnetic radiation of the reference frequency (f) in the first material (m1).