Abstract: The invention relates to a silicon-ceramic composite substrate (01), which comprises a low-temperature ceramic (02) having at least one pre-structured ceramic layer and a silicon substrate (03). According to the invention, the low-temperature ceramic (02) forms a carrier layer and the silicon substrate surface has nanostructures (06), which are completely penetrated into the low-temperature ceramic (02), in a contact area (04) with the carrier layer.
Type:
Application
Filed:
December 4, 2008
Publication date:
October 7, 2010
Applicant:
TECHNISCHE UNIVERSITAT LLMENAU
Inventors:
Michael FISCHER, Heike BARTSCH DE TORRES, Martin HOFFMANN, Jens MULLER, Beate PAWLOWSKI, Stefan BARTH