Abstract: A device and a process for multilayer PVD ("Physical Vapor Deposition") coating of substances includes one or more sputter target systems. A sputter target system generally consists of a plurality of individual targets arranged in the cross-sectional shape of a hollow regular polygon. The arrangement is rotatably mounted about the axis of symmetry of the hollow polygon. In the interior of the hollow polygon, preferably magnetrons (inner magnetrons) are present. By virtue of shielding, only one individual target of the sputter target system is exposed to the ionic bombardment at any one time. The multilayer coating is accomplished according to the invention by a coating strategy with step wise rotation, controlled according to plan, of the sputter target system in angular steps corresponding to the order of symmetry of the hollow polygon.