Abstract: A process is disclosed for selectively electrometallizing a non-conductive substrate such as the non-conductive surfaces of a circuit board and to directly effect through hole plating and/or form circuits of the boards without employing an electroless metal coating.A photoresist is employed in the process which is exposed, developed and neutralized prior to electrometallizing the substrate. Selectivity is obtained by neutralization.Metals are deposited on a non-conductive substrate in the process by using the reductive capacity of hydrogen in the presence of a metal catalyst of the substrate. The metal catalyst is combined with hydrogen that is generated electrolytically from a protic bath. The metal catalyst combined with hydrogen is contacted with a metal salt. The metal salt may be combined with the protic bath so that the hydrogen that is generated electrolytically combines with the metal catalyst and the metal salt is converted to a metal coating on the substrate.