Abstract: A watchdog circuit for monitoring a plurality of virtual machines provided by one core of a plurality of cores. The watchdog circuit may include a first memory portion, a second memory portion, and a control logic configured to count a number of pulses, to, when starting the watchdog circuit, store a global watchdog counter value in the first memory portion, and to store a local counter value for each virtual machine of the one or more virtual machines in the second memory portion, and, after a predefined number of pulses, to modify the global watchdog counter value and the local counter values, and, if the global watchdog counter value fulfills a predefined global watchdog reference criterion or any of the local watchdog counter values fulfills a predefined local watchdog reference criterion, to output an error signal.

Abstract: This disclosure describes a protection circuit configured to protect a power converter. The protection circuit may be configured to determine when the power converter is operating in a tristate mode, and upon determining that the power converter is operating in the tristate mode, to disable a supply to the power converter based on a comparison of a switch node voltage on a switch node of the power converter to a feedback node voltage on an output node of the power converter.

Abstract: A method for measuring a complex impedance of a plurality of battery cells in a battery pack comprises controlling an excitation current through the plurality of battery cells in the battery pack; receiving, in a single common measurement circuit, a plurality of voltage signals corresponding to the plurality of battery cells; measuring the excitation current; and calculating a complex impedance of each of the battery cells in the plurality of battery cells based on the plurality of voltage signals and the measured excitation current in a single measurement cycle using either one analog-to-digital converter (ADC) per battery cell or two matched ADCs per battery cell.

Abstract: A driver circuit may be configured to control a power switch. The driver circuit may comprise an output pin configured to deliver signals to a gate of the power switch to control an ON/OFF state of the power switch, and a comparator configured to compare a gate-to-source voltage of the power switch to a first threshold when the power switch is ON and to compare the gate-to-source voltage of the power switch to a second threshold when the power switch is OFF.

Abstract: A hybrid module for a motor vehicle for coupling an internal combustion engine includes a disconnect clutch, an electrical machine, a clutch, a dry space and a wet space, and a seal. The disconnect clutch is for transmitting a first torque from the internal combustion engine to the hybrid module, and disconnecting the hybrid module from the internal combustion engine. The electrical machine is for generating a drive torque and includes a rotor. The clutch is for transmitting a second torque from the electrical machine or the disconnect clutch to a drivetrain. The seal is for sealing off the dry space with respect to the wet space. A one of the disconnect clutch or the clutch is a dry clutch in the dry space and the other of the disconnect clutch or the clutch is a wet clutch in the wet space.

Abstract: A data processing device is described including one or more processors implementing a plurality of data processing entities, one or more software interrupt nodes and an access register for each software interrupt node. The access register specifies which one or more data processing entities of the plurality of data processing entities is/are each allowed to, as interrupt source data processing entity, trigger an interrupt service request on the software interrupt node for another one of the plurality of data processing entities as an interrupt target processing entity. Each software interrupt node is configured to forward an interrupt service request triggered by an interrupt source data processing entity which is allowed to trigger an interrupt service request on the software interrupt node to an interrupt target processing entity.

Abstract: A semiconductor device includes a semiconductor die attached to a substrate and a metal clip attached to a side of the semiconductor die facing away from the substrate by a soldered joint. The metal clip has a plurality of slots dimensioned so as to take up at least 10% of a solder paste reflowed to form the soldered joint. Corresponding methods of production are also described.

Abstract: A one-way clutch, including: an outer race; an inner race; and a rocker assembly. The outer race includes: a first outer race plate defining a first rocker pocket; and a second outer race plate non-rotatably connected to the first outer race plate and defining a second rocker pocket. The inner race is axially disposed between the first and second outer race plates. The rocker assembly is at least partly disposed in the first and second rocker pockets and includes a rocker arranged to contact the inner race, a spring guide including a spring arm, and a spring wrapped around the spring arm and urging the rocker in a pivot direction. The one-way clutch includes: a first annular thrust washer axially disposed between the first outer race plate and the inner race; or a friction-reducing coating adhered to the first outer race plate and facing the inner race.

Abstract: An image projection system includes a cascaded waveguide system including a first waveguide and a second waveguide arranged downstream along a transmission path from the first waveguide. The first waveguide includes a first output structure and is configured to receive a light beam having a first beam width and output a first expanded light beam at the first output structure, wherein the first expanded light beam has a second beam width greater than the first beam width. The second waveguide includes a second output structure and is configured to receive the first expanded light beam from the first waveguide and output the first expanded light beam multiple times from the second output structure as a plurality of output light beams. Each of the plurality of output light beams is output from a different area of the second output structure along a propagation direction of the second waveguide.

Abstract: The disclosure relates to a vane type camshaft adjuster for a motor vehicle drive train. The camshaft adjuster having a stator, a rotor arranged such that it can rotate relative to the stator, working chambers formed between the stator and the rotor, each working chamber being divided into two sub-chambers by a radially projecting blade of the rotor, and a reservoir connected to the sub-chambers for storing hydraulic medium. The sub-chambers can be connected to a pump or a tank according to a switch position of a control valve of the camshaft adjuster. The control valve has a switch position in which a first sub-chamber of the two sub-chambers is connected to the tank and a second sub-chamber of the two sub-chambers is blocked from the pump.

Abstract: One example of a semiconductor package includes a first substrate, a second substrate, a semiconductor die, and a spacer. The semiconductor die is attached to the first substrate. The spacer is attached to the semiconductor die and attached to the second substrate via solder. A surface of the second substrate facing the spacer includes a plurality of recesses extending from proximate at least one edge of the spacer to contain a portion of the solder.

Abstract: A rotation sensor system includes a rotatable target object configured to rotate about a rotational axis in a rotation direction; a first millimeter-wave (mm-wave) metamaterial track coupled to the rotatable target object, where the first mm-wave metamaterial track is arranged around the rotational axis, and where the first mm-wave metamaterial track includes a first array of elementary structures having at least one first characteristic that changes around a perimeter of the first mm-wave metamaterial track; at least one transmitter configured to transmit a first electro-magnetic transmit signal towards the first mm-wave metamaterial track, where the first mm-wave metamaterial track converts the first electro-magnetic transmit signal into a first electro-magnetic receive signal; at least one receiver configured to receive the first electro-magnetic receive signal; and at least one processor configured to determine a rotational parameter of the rotatable target object based on the received first electro-magne

Abstract: A chip package includes a chip configured to generate and/or receive a signal; a laminate substrate including a substrate integrated waveguide (SIW) for carrying the signal, the substrate integrated waveguide including a chip-to-SIW transition structure configured to couple the signal between the SIW and the chip and a SIW-to-waveguide transition structure configured to couple the signal out of the SIW or into the SIW, wherein the SIW-to-waveguide transition structure includes a waveguide aperture; and a plurality of electrical interfaces arranged about a periphery of the waveguide aperture, the plurality of electrical interfaces configured to receive the signal from the SIW-to-waveguide transition structure and output the signal from the chip package or to couple the signal to the SIW-to-waveguide transition structure and into the chip package.

Abstract: A hydraulic camshaft adjuster (1), in which the locking system (7, 8) includes a first and a second control element (7, 8). In order to approach the middle position easily, the first control element (7) has a first and a second switching position, wherein in the first switching position a fluidic connection between the hydraulic pump (P) and a first of the two sub-chambers (B) and a fluidic connection between the other, second sub-chamber (A) and the tank (T) can be established, and in the second switching position a fluidic connection between the hydraulic pump (P) and the second of the two sub-chambers (A) and a fluidic connection between the other, first sub-chamber (B) and the tank (T) can be established, and the second control element (8) is free from different switching positions and has no influence on the flow of hydraulic fluid.

Abstract: An integrated circuit may include a power transistor coupled between a supply pin and an output pin; a current sensing circuit configured to sense a load current passing through the power transistor and to provide a respective current sense signal; a first configuration pin; a current output circuit configured to provide a diagnosis current at a current output pin; a diagnosis pin for receiving a diagnosis request signal; and a control circuit configured to: select a characteristic curve representing a current versus time characteristic dependent on a external circuit connected to the first configuration pin; generate a drive signal for the power transistor dependent on the selected characteristic curve and the current sense signal; and control—dependent on a pulse pattern of the diagnosis request signal—the current output circuit to set the value of the diagnosis current such that it represents the load current or the selected characteristic curve.

Abstract: The present disclosure relates to a magnetic-sensor device comprising a circuit board made of an electrically insulating material and having conductor tracks, and comprising a permanent magnet surface-mounted on the circuit board, and a magnetic-field sensor connected to the conductor tracks of the circuit board. An SMD component for populating a circuit board is also proposed, which SMD component comprises a permanent magnet and a magnetic-field sensor.

Abstract: This disclosure is directed to circuits and techniques for protecting a power switch when the power switch is turned ON. A driver circuit may detect whether the power switch is in a desaturation mode or an overcurrent state based on a signal at a detection pin, and disable the power switch in response to detecting that the power switch is in the desaturation mode or the overcurrent state. In addition, the driver circuit may detect whether the power switch is trending towards a safe operating area (SOA) limit of the power switch based on a rate of change of the signal, and disable the power switch in response to detecting that the power switch is trending towards the SOA limit.

Abstract: A method of manufacturing a module is disclosed. In one example, the method comprises providing at least one solder body with a base portion and an elevated edge extending along at least part of a circumference of the base portion. At least one carrier, on which at least one electronic component is mounted, is placed in the at least one solder body so that the at least one carrier is positioned on the base portion and is spatially confined by the elevated edge.

Abstract: A method of controlling a vehicle hybrid propulsion system is provided. The propulsion system includes an internal combustion engine, first and second clutches, an electric motor, and a gearbox having an input shaft and an output shaft connected to drive wheels. The method includes a first operating mode of starting the engine by the motor, a second operating mode of actuating a gear shift, and a third operating mode which actuates starting of the engine and the gear shift. The method includes passing from the first to the third operating modes even if starting of the engine has not been completed, or passing from the second to the third operating modes even if actuation of the gear shift has not been completed, so that the transition from one operating mode to another can be freely actuated at any time, depending upon operating conditions of the hybrid propulsion system.

Abstract: A semiconductor module arrangement includes a housing and at least one pair of semiconductor substrates arranged inside the housing. Each pair of semiconductor substrates includes first and second semiconductor substrates. The first semiconductor substrate includes a first dielectric insulation layer arranged between a first metallization layer and a third metallization layer, and a second dielectric insulation layer arranged between the third metallization layer and a second metallization layer. The second semiconductor substrate includes a first dielectric insulation layer arranged between a first metallization layer and a third metallization layer, and a second dielectric insulation layer arranged between the third metallization layer and a second metallization layer.