Patents Assigned to Technologies AG
  • Patent number: 12211703
    Abstract: A method of forming a semiconductor device includes: forming a first semiconductor layer on a semiconductor substrate, the first semiconductor layer being of the same dopant type as the semiconductor substrate, the first semiconductor layer having a higher dopant concentration than the semiconductor substrate; increasing the porosity of the first semiconductor layer; first annealing the first semiconductor layer in an atmosphere including an inert gas; forming a second semiconductor layer on the first semiconductor layer; and separating the second semiconductor layer from the semiconductor substrate by splitting within the first semiconductor layer. Additional methods of forming a semiconductor device are described.
    Type: Grant
    Filed: August 22, 2023
    Date of Patent: January 28, 2025
    Assignee: Infineon Technologies AG
    Inventors: Hans-Joachim Schulze, Alexander Breymesser, Bernhard Goller, Matthias Kuenle, Helmut Oefner, Francisco Javier Santos Rodriguez, Stephan Voss
  • Patent number: 12212293
    Abstract: The present disclosure relates to chopper amplifier circuits with inherent chopper ripple suppression. Example implementations can realize a doubly utilized chopper amplifier circuit that is a current-saving circuit with a wake-up function that is capable of providing a self-wake signal in order to change into a fast, low-jitter/low-latency mode, and to provide a wake-up signal for a sleeping microprocessor or a system in response to signal changes.
    Type: Grant
    Filed: July 27, 2023
    Date of Patent: January 28, 2025
    Assignee: Infineon Technologies AG
    Inventor: Mario Motz
  • Patent number: 12210075
    Abstract: A tunnel magnetoresistance (TMR) sensing element includes a layer stack having a tantalum-nitride (TaN) layer; a reference layer system; a magnetic free layer having a magnetically free magnetization; and a tunnel barrier layer arranged between the reference layer system and the magnetic free layer. The reference layer system includes a pinned layer having a fixed pinned magnetization; a reference layer having a having a fixed reference magnetization; a coupling interlayer arranged between the pinned layer and the reference layer; and a natural antiferromagnetic (NAF) layer comprising iridium-manganese (IrMn), wherein the NAF layer is formed in direct contact with the TaN layer, wherein the NAF layer is configured to hold the fixed pinned magnetization in a first magnetic orientation and hold the fixed reference magnetization in a second magnetic orientation, and wherein the direct contact of the NAF layer with the TaN layer increases a blocking temperature of the NAF layer.
    Type: Grant
    Filed: March 8, 2023
    Date of Patent: January 28, 2025
    Assignee: Infineon Technologies AG
    Inventor: Bernhard Endres
  • Patent number: 12212309
    Abstract: Switch modules, driver circuits for switch modules and corresponding methods are provided. In an implementation, a switch module includes a transistor switch including a control terminal, a first load terminal and a second load terminal, and a short circuit detection circuit configured to detect a short circuit state between the first load terminal and the second load terminal and to electrically couple the control terminal and the first load terminal in response to detecting the short circuit state. The short circuit detection circuit is supplied by a voltage between the control terminal and the first load terminal.
    Type: Grant
    Filed: August 14, 2021
    Date of Patent: January 28, 2025
    Assignee: Infineon Technologies AG
    Inventor: Daniel Domes
  • Patent number: 12211868
    Abstract: A photodetector device includes a photodetector array comprising an array of photodetectors and a plurality of metal structures arranged between photodetectors of the array of photodetectors, wherein the plurality of metal structures are arranged in a first pattern; and a transparent substrate comprising a plurality of diffusion structures being patterned according to a second pattern that matches the first pattern. Each diffusion structure of the plurality of diffusion structures is configured to redirect light that is incident thereon. Additionally, the transparent substrate and the photodetector array are coupled together such that the first pattern is aligned with the second pattern and the plurality of diffusion structures covers the plurality of metal structures.
    Type: Grant
    Filed: June 22, 2023
    Date of Patent: January 28, 2025
    Assignee: Infineon Technologies AG
    Inventors: Wojciech Kudla, Boris Kirillov, Marijn Van Os, Harm Wichers
  • Patent number: 12211233
    Abstract: Disclosed are computer systems and computer-implemented methods for training a machine-learning method for determining pre-determined points in an image. The method includes training a first machine-learning method based on training data indicating whether or not a pre-determined point is present in a cell of the image; training a second machine-learning method based on a position of pre-determined points in the cell and based on training of the first machine-learning method; and training a third machine-learning method based on a modified version of the image and based on training of the second machine-learning method. Also disclosed are methods and computer systems implementing the trained machine-learning method.
    Type: Grant
    Filed: April 14, 2022
    Date of Patent: January 28, 2025
    Assignee: Aptiv Technologies AG
    Inventors: Kamil Lelowicz, Mariusz Nowak
  • Patent number: 12210706
    Abstract: An ultrasonic touch sensor is proposed for attachment to a casing, having a semiconductor chip including a substrate side and a component side, the semiconductor chip including an ultrasonic transducer element and the ultrasonic transducer element being arranged on the component side, having an acoustic coupling medium covering the semiconductor chip at least in the region of the ultrasonic transducer element, having electrical contact elements for controlling the ultrasonic transducer element, and the electrical contact elements being arranged on the component side of the semiconductor chip.
    Type: Grant
    Filed: June 27, 2022
    Date of Patent: January 28, 2025
    Assignee: Infineon Technologies AG
    Inventors: Rainer Markus Schaller, Jochen Dangelmaier, Klaus Elian, Horst Theuss
  • Patent number: 12212098
    Abstract: A connector and a connector assembly are provided. The connector includes a housing and a locking/unlocking mechanism arranged on the housing that is configured to lock and unlock a connection between the connector and a mating connector. The locking/unlocking mechanism includes a cantilever structure arranged on a top surface of the housing and having a fixed end and a free end, with a pressing portion for unlocking being located adjacent to the free end and an unlocking prevention mechanism including a protection beam and a pair of protection walls. The protection beam spans over the cantilever. The pair of protection walls are arranged on both sides of the pressing portion of the cantilever. Each protection wall is provided with a first groove at a location close to the protection beam.
    Type: Grant
    Filed: April 29, 2022
    Date of Patent: January 28, 2025
    Assignee: Aptiv Technologies AG
    Inventors: Xiaoxian Tian, Haifei Guan, Yingquan Jing
  • Publication number: 20250027432
    Abstract: The disclosure relates to a camshaft phaser for adjusting a phase position between a crankshaft and a camshaft of a motor vehicle. The camshaft phaser comprises a stator, a rotor which is rotatable in relation thereto, and working chambers which are formed between the stator and the rotor and each of which are subdivided by a blade of the rotor into a first sub-chamber and a second sub-chamber. For storage of the hydraulic fluid, the camshaft phaser has a reservoir which is connected to the sub-chambers via one non-return valve each, in order that when a negative pressure prevails in one of the sub-chambers, hydraulic fluid is fed from the reservoir to this sub-chamber. The non-return valves are preloaded in such a way that they only open when a pressure within an associated sub-chamber falls below a predetermined negative pressure.
    Type: Application
    Filed: November 11, 2022
    Publication date: January 23, 2025
    Applicant: Schaeffler Technologies AG & Co. KG
    Inventor: Branimir Karic
  • Publication number: 20250027790
    Abstract: A computer implemented method for calibrating a motion sensor arranged at a vehicle and configured to output a raw motion measurement value indicative of a current motion condition of the vehicle comprises: computing processed motion measurement values by modifying the outputted raw motion measurement value based on a set of different calibration parameters, monitoring the vicinity of the vehicle by means of an environment perception sensor, determining a set of occupancy maps by means of mapping data acquired by the environment perception sensor in accordance with a motion model for the vehicle, wherein each of the processed motion measurement values is used to establish the motion model for one of the occupancy maps, and selecting, based on a comparison of the determined occupancy maps, one of the different calibration parameters for modifying subsequently outputted raw motion measurement values.
    Type: Application
    Filed: June 28, 2024
    Publication date: January 23, 2025
    Applicant: Aptiv Technologies AG
    Inventors: Jens Westerhoff, Dominic Spata, Florian Kastner, Uri Iurgel
  • Publication number: 20250026147
    Abstract: A wheel bearing unit for a motor vehicle includes a wheel bearing hub with a first spur toothing, a constant velocity joint with a second spur toothing, a radially pretensionable element and a conical peripheral surface. The radially pretensionable element is disposed in a recess and protrudes radially from the recess in an unstressed state. The conical peripheral surface is disposed radially opposite the radially pretensionable element in a partially assembled state of the wheel bearing unit. During assembly of the wheel bearing unit, the radially pretensionable element applies an axially acting force to the conical peripheral surface to brace the wheel bearing hub against constant velocity joint. A method for assembling the wheel bearing unit is also disclosed.
    Type: Application
    Filed: December 5, 2022
    Publication date: January 23, 2025
    Applicant: Schaeffler Technologies AG & Co. KG
    Inventors: Andreas Kaiser, Frank Eichelmann
  • Publication number: 20250030319
    Abstract: The disclosure relates to an electric machine comprising a stator and a conductor support arranged at an axial end of the stator, wherein the conductor support comprises a ring-shaped sealing section and a ring-shaped or ring-segment-shaped conductor support section, wherein the sealing section has a first seal axially facing the stator and a second seal axially facing away from the stator, wherein the first seal is in contact with a sealing element arranged on the stator and sealing the stator against a radially adjacent air gap, and at least sections of the second seal are in contact with at least one cover at least partially surrounding the conductor support section and/or the axial end of the stator.
    Type: Application
    Filed: November 7, 2022
    Publication date: January 23, 2025
    Applicant: Schaeffler Technologies AG & Co. KG
    Inventors: Jens Bohnen, Christian Morgen
  • Patent number: 12203502
    Abstract: An improved configuration for a bearing housing assembly is disclosed herein in which a ring can be configured to be secured in at least two positions such that the bearing assembly positioned inside of the housing can be retained in either a fixed state or a floating state. The ring can be configured to be secured at least partially within the housing in at least a first configuration and a second configuration, such that: (i) the ring is configured to abut the bearing assembly in the first configuration such that the bearing assembly is axially fixed relative to the housing, and (ii) the ring is configured to be spaced apart from the bearing assembly in the second configuration such that the bearing assembly is axially displaceable within the housing.
    Type: Grant
    Filed: December 12, 2022
    Date of Patent: January 21, 2025
    Assignee: Schaeffler Technologies AG & Co. KG
    Inventors: Dennis Roffe, James Brown
  • Patent number: 12205842
    Abstract: A chuck for a laser beam wafer dicing equipment includes a wafer support plate having an upper surface for holding a wafer disposed on a dicing tape. The upper surface includes a topographically structured surface region that partly or completely overlaps an edge of the wafer when the wafer disposed on the dicing tape is placed on the upper surface. The topographically structured surface region provides for a reduction in an area of contact between the upper surface and the dicing tape.
    Type: Grant
    Filed: September 12, 2022
    Date of Patent: January 21, 2025
    Assignee: Infineon Technologies AG
    Inventors: Franz-Josef Pichler, Johannes Mueller, Christoph Ahamer, Gerald Lackner, Walter Leitgeb
  • Patent number: 12203544
    Abstract: A two-speed transmission system for an electric vehicle is disclosed. The system includes a housing, a one-way clutch assembly adapted to be mounted on an input shaft and to be coupled with a first gear drive assembly, a multi-plate friction clutch assembly adapted to be mounted on the input shaft and having a clutch hub disposed in the housing and mounted on the input shaft, a second gear drive assembly freely mounted on the input shaft and having external spline on an outer diameter adapted to be engaged with the clutch hub of the multi-plate friction clutch assembly. The one-way clutch assembly is adapted to rotate to operate the vehicle in the first gear drive when the input shaft is rotated in a drive direction, and the multi-plate friction clutch assembly is in a disengaged state when the vehicle is operated in the first gear drive.
    Type: Grant
    Filed: June 28, 2021
    Date of Patent: January 21, 2025
    Assignee: Schaeffler Technologies AG & Co. KG
    Inventors: PS Satyanarayana, Prajod Ayyappath
  • Patent number: 12204724
    Abstract: An ultrasonic touch sensor includes a touch structure configured to receive a touch; a transmitter arrangement configured to transmit one or more ultrasonic transmit waves toward the touch structure; a receiver arrangement configured to receive ultrasonic reflected waves produced by reflections of the one or more ultrasonic transmit waves and generate a plurality of measurement signals representative of the ultrasonic reflected waves; and a measurement circuit configured to measure a degree of variation of a plurality of measurement signals, compare the degree of variation with a detection threshold, and determine whether a no-touch event or a touch event has occurred at the touch structure based on whether the degree of variation satisfies the detection threshold.
    Type: Grant
    Filed: February 3, 2023
    Date of Patent: January 21, 2025
    Assignee: Infineon Technologies AG
    Inventors: Emanuel Stoicescu, Erhard Landgraf
  • Patent number: 12205826
    Abstract: A method for forming a semiconductor substrate arrangement includes: forming a mask on a semiconductor substrate, the semiconductor substrate including and a metallization layer arranged on an insulation layer, the metallization layer arranged between the mask and insulation layer; forming a layer of electrically conductive coating on the metallization layer, the electrically conductive coating formed in at least one opening of the mask on regions of the metallization layer that are not covered by the mask; and after forming the electrically conductive coating, removing the mask. Forming the mask includes either applying an even layer of material on the metallization layer, or applying the material of the mask on the metallization layer such that the thickness of the mask in a region adjacent to edges of the mask is greater than the thickness of the regions of the mask further away from the edges.
    Type: Grant
    Filed: March 16, 2021
    Date of Patent: January 21, 2025
    Assignee: Infineon Technologies AG
    Inventors: Charles Rimbert-Riviere, Martin Goldammer, Lydia Lottspeich, Ulrich Wilke
  • Patent number: 12206294
    Abstract: The disclosure relates to a sensor fastener for measuring a temperature on a busbar assembly with a busbar, said assembly has at least one busbar assembly with at least one busbar. One or more busbars have bending elements, each of which has a free end; and a connecting ring for connecting to the busbar assembly. The bending elements extend through the connecting ring such that the free ends are free-standing in such a manner that the temperature of the free ends can be measured by a temperature sensor, thereby allowing a precise measurement of the temperature in a winding of an electric machine for a motor vehicle.
    Type: Grant
    Filed: July 2, 2020
    Date of Patent: January 21, 2025
    Assignee: Schaeffler Technologies AG & Co. KG
    Inventors: Christian Silvery, Matthias Kästle, Marie-Luise Anke
  • Patent number: 12206215
    Abstract: A method of method of resistance soldering may include providing a controllable electrical power supply having a negative pole and a positive pole. The method may include providing an electrical terminal having a first surface and a second surface opposite the first surface on which a solder layer is disposed. The method may include providing a resistance soldering device with an electrode having a first electrical conductor connected to the positive pole of the electrical power supply, a second electrical conductor connected to the negative pole of the electrical power supply, an electrically resistive bridge interconnecting the first and second electrical conductors. The method may include turning the electrical power supply on to provide an electrical current between the positive and negative poles. The method may include contacting the electrode to the first surface of the electrical terminal.
    Type: Grant
    Filed: March 11, 2024
    Date of Patent: January 21, 2025
    Assignee: Aptiv Technologies AG
    Inventor: William Falk
  • Patent number: 12203547
    Abstract: A hydraulic parking lock actuation module for a parking lock with a parking lock piston, which can be hydraulically actuated in a parking lock cylinder from an initial position in an actuation direction by applying an actuation pressure, and which is mechanically coupled to an actuation rod which can be fixed via an engaging device in order to act as a locking mechanism for the parking lock piston. In order to simplify the actuation of the parking lock, for actuating the parking lock piston and the locking mechanism for the parking lock piston, the hydraulic parking lock actuation module includes only one active actuation valve with a tank connection and a working pressure connection at which different hydraulic pressure levels are applied.
    Type: Grant
    Filed: April 9, 2021
    Date of Patent: January 21, 2025
    Assignee: Schaeffler Technologies AG & Co. KG
    Inventors: Peter Greb, Laszlo Man