Patents Assigned to Technologies AG
  • Patent number: 12068390
    Abstract: A power semiconductor device includes a semiconductor substrate and a plurality of transistor cells formed in the semiconductor substrate and electrically connected in parallel to form a power transistor. Each transistor cell includes a gate structure including a gate electrode and a gate dielectric stack separating the gate electrode from the semiconductor substrate. The gate dielectric stack includes a ferroelectric insulator and a first dielectric insulator. The first dielectric insulator has a relative permittivity greater than that of silicon dioxide. A driver device for switching the power transistor and a corresponding method of operating the power transistor are also described.
    Type: Grant
    Filed: July 28, 2021
    Date of Patent: August 20, 2024
    Assignee: Infineon Technologies AG
    Inventor: Frank Dieter Pfirsch
  • Patent number: 12066061
    Abstract: A central release mechanism, in particular for a hydraulic release system of a clutch system of a motor vehicle, including a central release mechanism housing with an annular central release mechanism piston chamber in which a central release mechanism piston is received axially movably by a hydraulic liquid that can be supplied to the central release mechanism piston chamber. The central release mechanism has at least one central release mechanism piston seal which seals the central release mechanism piston with respect to the central release mechanism piston chamber, and the central release mechanism piston seal is arranged in the central release mechanism housing so as to be axially secured at least on one side by a securing ring, the securing ring being connectable to the central release mechanism housing by means of a bayonet connection.
    Type: Grant
    Filed: March 18, 2022
    Date of Patent: August 20, 2024
    Assignee: Schaeffler Technologies AG & Co. KG
    Inventors: Alexander Glebov, Marcel Röll
  • Patent number: 12069795
    Abstract: Disclosed are aspects of apparatuses and methods of fitting a cooling device to a circuit board for cooling a high-power electronic component mounted on the circuit board. Cooling apparatuses, and arrangement thereof, are also described. The method provides the cooling device with a cooling surface having a cooling area for thermally connecting to a to-be-cooled surface of the electronic component. Fixing elements are provided for moving the cooling surface towards the circuit board. A distance position “d” of the to-be-cooled surface from the circuit board is determined, and on this basis spacer elements are selected to be interposed between the cooling device and the circuit board to limit the movement by the fixing elements to a position where the cooling area is in proximity to the to-be-cooled surface.
    Type: Grant
    Filed: September 15, 2022
    Date of Patent: August 20, 2024
    Assignee: Aptiv Technologies AG
    Inventors: Frank H. Adam, Falk Rademacher
  • Patent number: 12068709
    Abstract: An electrical circuit arrangement includes an inverter, a driver circuit and a protective circuit. The inverter includes a plurality of inverter switching elements each having a drive connection. The drive connection of at least one inverter switching element is connected to the driver circuit via a first switching element of the protective circuit (6). A drive connection of the first switching element is connected to a circuit node, which is connected to a first potential via a resistor and to a second potential via a second switching element.
    Type: Grant
    Filed: April 14, 2021
    Date of Patent: August 20, 2024
    Assignee: Schaeffler Technologies AG & CO. KG
    Inventors: Sebastian Ackermann, Patrick Augustin, Vincent Leonhardt, Denis Muller, Eduard Enderle
  • Patent number: 12068649
    Abstract: An electrical machine, includes a machine housing containing: a stator, which has a winding comprising a plurality of conductors, which are associated with one or more phases and are interconnected; and a power connection, which is arranged outside the winding and has a number of line portions corresponding to the number of phases. The line portions are connected to the conductors and are connected to phase connections or form such. The line portions being at least partly accommodated in a connection housing, which has a cavity through which the line portions extend, which cavity communicates, after the connection housing has been inserted into the machine housing, with a coolant channel provided there, such that a coolant flowing in the coolant channel flows through the cavity.
    Type: Grant
    Filed: June 23, 2020
    Date of Patent: August 20, 2024
    Assignee: Schaeffler Technologies AG & Co. KG
    Inventor: Andreas Ruppert
  • Patent number: 12066529
    Abstract: A radar device comprises a radar circuit configured to transceive first radar signals that occupy a first frequency band and second radar signals that occupy a second frequency band. An antenna device of the radar device comprises a first set and a second set of antennas and is configured to selectively transduce the first radar signals via the first set and not via the second set and to selectively transduce the second radar signals via the second set and not via the first set. A processing device of the radar device detects from the first radar signals target reflections via first propagation channels and from the second radar signals target reflections via second propagation channels. The signal processing device jointly evaluates the target reflections via the first and second propagation channels to form a common virtual antenna array for determining an angular position of a target object.
    Type: Grant
    Filed: December 7, 2021
    Date of Patent: August 20, 2024
    Assignee: APTIV TECHNOLOGIES AG
    Inventors: Dennis Vollbracht, Alexander Ioffe
  • Patent number: 12066087
    Abstract: A differential for a vehicle includes a final drive gear with a final drive gear spline, a differential carrier with a differential carrier spline, and an axially slidable clutch. The axially slidable clutch includes a first clutch spline drivingly engaged with a one of the final drive gear spline or the differential carrier spline and a second clutch spline for selectively drivingly engaging with the other one of the final drive gear spline or the differential carrier spline. In an example embodiment, the differential also includes a pair of side gears, each including an inner spline for drivingly engaging a respective axle shaft, a pair of radially offset spider gears, each drivingly engaged with both of the side gears, and a shaft extending through the pair of radially offset spider gears into the differential carrier.
    Type: Grant
    Filed: January 27, 2023
    Date of Patent: August 20, 2024
    Assignee: Schaeffler Technologies AG & Co. KG
    Inventors: Brian Lee, Michael Hodge
  • Patent number: 12066565
    Abstract: A radar system includes a first radar chip having one or more receiving channels and a second radar chip having one or more receiving channels, wherein the receiving channels of the first and second radar chips each have an RF input port and are configured to provide, based on an RF input signal received at the RF input port, a corresponding digital baseband signal that is characterizable by at least one signal parameter. The radar system further includes a power divider configured to forward an RF signal to both a first receiving channel integrated in the first radar chip and to a second receiving channel integrated in the second radar chip. A processor is configured to determine information indicating a deviation between the signal parameter of the digital baseband signal of the first receiving channel and the corresponding signal parameter of the digital baseband signal of the second receiving channel.
    Type: Grant
    Filed: April 6, 2021
    Date of Patent: August 20, 2024
    Assignee: Infineon Technologies AG
    Inventor: Stefan Helmut Schmalzl
  • Patent number: 12068274
    Abstract: A semiconductor device includes a first carrier, a first external contact, a second external contact, and a first semiconductor die. The first semiconductor die has a first main face, a second main face opposite to the first main face, a first contact pad disposed on the first main face, a second contact pad disposed on the second main face, a third contact pad disposed on the second main face, and a vertical transistor. The first semiconductor die is disposed with the first main face on the first carrier. A clip connects the second contact pad and the second external contact. A first wire is connected with the first external contact. The first wire is disposed at least partially under the clip.
    Type: Grant
    Filed: December 3, 2020
    Date of Patent: August 20, 2024
    Assignee: Infineon Technologies AG
    Inventor: Mark Pavier
  • Patent number: 12066966
    Abstract: A device configured to receive a set of bits for a first package from a previous device of a plurality of devices connected in a daisy chain configuration, the set of bits for the first package including a first priority value and if the device does not have a second package for output to a destination device of the plurality of devices, output the set of bits for the first package to a subsequent device of the plurality of devices. When the device has the second package for output to the destination device of the plurality of devices, the device is configured to determine whether the second priority value is higher than the first priority value and if the second priority value is higher than the first priority value output a set of bits for the second package to the subsequent device of the plurality of devices.
    Type: Grant
    Filed: January 13, 2022
    Date of Patent: August 20, 2024
    Assignee: Infineon Technologies AG
    Inventor: Ewald Frensch
  • Patent number: 12068754
    Abstract: An input stage for an analog/digital converter, an analog/digital converter and a method for testing analog/digital converters with successive approximation are disclosed. At an input stage, an input signal is supplied via a first transistor arrangement of a sampling capacitor arrangement. The sampling capacitor arrangement can be optionally connected to ground or to a reference voltage by way of a second transistor arrangement and a switch apparatus.
    Type: Grant
    Filed: July 26, 2022
    Date of Patent: August 20, 2024
    Assignee: INFINEON TECHNOLOGIES AG
    Inventors: Florian Renneke, Andreas Fugger, Jaafar Mejri
  • Patent number: 12068123
    Abstract: A switch device includes a phase change switch and a memory for storing a target state of the phase change switch. A controller determines a phase state of the phase change switch, and, if the state of the phase change switch does not correspond to the target state, controls a heater of the phase change switch to change the state of the phase changes switch to the target state.
    Type: Grant
    Filed: November 18, 2021
    Date of Patent: August 20, 2024
    Assignee: INFINEON TECHNOLOGIES AG
    Inventors: Hans Taddiken, Dominik Heiss, Christoph Kadow
  • Patent number: 12064901
    Abstract: A mixer includes a drum having at least one inlet and one outlet. The mixer furthermore includes a drive and a stirring shaft, which is arranged in the drum and is coupled to the drive. Furthermore, the mixer includes a conveying device, which is arranged in the drum and which is arranged on one and the same axis as the stirring shaft.
    Type: Grant
    Filed: March 1, 2017
    Date of Patent: August 20, 2024
    Assignee: SIKA TECHNOLOGY AG
    Inventors: Patrik Kuhn, Armin Brühwiler, Raphael Bourquin, Didier Lootens, Luka Oblak
  • Patent number: 12064779
    Abstract: A liquid-dispensing system includes at least one nozzle configured to dispense a liquid. The liquid-dispensing system includes at least one sensor module, configured to provide a sensor signal comprising information related to whether liquid is dispensed by the at least one nozzle. At least a part of the at least one sensor is located in proximity of the nozzle.
    Type: Grant
    Filed: November 30, 2020
    Date of Patent: August 20, 2024
    Assignee: Infineon Technologies AG
    Inventors: Christian Illemann, Karl Pilch, Herbert Priess
  • Patent number: 12066055
    Abstract: A rolling bearing has an inner and an outer bearing ring. Each bearing ring has an inner and an outer shell surface. The roller bearing has rolling elements, which roll on raceways provided on the respective shell surfaces of the bearing rings, and a sealing disc connected to one of the bearing rings and operatively connected in a sealing manner to the other bearing ring. To connect the sealing disc to the bearing ring, one of the shell surfaces of the one bearing ring includes a first connecting means and the sealing disc includes a second connecting means. The first connecting means provide a rotating engagement in which the second connecting means engage in a connected state of the bearing ring and the sealing disc.
    Type: Grant
    Filed: January 8, 2021
    Date of Patent: August 20, 2024
    Assignee: Schaeffler Technologies AG & Co. KG
    Inventors: Andreas Bierlein, Rainer Schroeder, Lukas Paehler, Simon Wolf
  • Patent number: 12068213
    Abstract: A chip package including a semiconductor chip is provided. The chip package may include a packaging material at least partially around the semiconductor chip with an opening extending from a top surface of the packaging material to the semiconductor chip and/or to an electrical contact structure contacting the semiconductor chip, and a thermally conductive material in the opening, wherein the thermally conductive material is configured to transfer heat from the semiconductor chip to an outside, wherein the thermally conductive material extends laterally at least partially over the top surface of the packaging material.
    Type: Grant
    Filed: November 22, 2021
    Date of Patent: August 20, 2024
    Assignee: Infineon Technologies AG
    Inventors: Thai Kee Gan, Sanjay Kumar Murugan, Ralf Otremba
  • Patent number: 12065206
    Abstract: A steering torque sensor assembly includes a magnetically coded steering shaft section, which forms a primary sensor, and a secondary sensor for converting the changes in a magnetic field generated by the primary sensor into an electrical signal. The secondary sensor is situated on a sensor circuit board which runs parallel to the steering shaft section and is positioned opposite the primary sensor.
    Type: Grant
    Filed: April 20, 2020
    Date of Patent: August 20, 2024
    Assignee: Schaeffler Technologies AG &Co. KG
    Inventors: Thomas Lindenmayr, Bernd Wittmann, Stephan Neuschaefer-Rube
  • Patent number: 12066878
    Abstract: According to various aspects, a controller may be configured to: control a transmission over a single-wire interface of an instruction corresponding to a high-current operation; and control an electrical behavior of a charging path to provide current at the single-wire interface during a time period corresponding to an execution of the instructed high-current operation.
    Type: Grant
    Filed: May 27, 2022
    Date of Patent: August 20, 2024
    Assignee: Infineon Technologies AG
    Inventors: Tue Fatt David Wee, Chunyan Zhang
  • Patent number: 12068654
    Abstract: A stator for an electric machine is provided having a winding with plurality of interconnected conductors assigned to one or more phases. The ends of at least some of the conductors protrude axially or radially beyond the winding at the inner circumference or at the outer circumference of the winding, wherein an interconnection ring, to which the conductors are connected, is positioned axially or radially on the winding. The ends of in each case at least two conductors assigned to one phase protrude radially or axially outwards and are connected to a power connection arranged radially outside the winding.
    Type: Grant
    Filed: January 10, 2020
    Date of Patent: August 20, 2024
    Assignee: Schaeffler Technologies AG & Co. KG
    Inventor: Andreas Ruppert
  • Patent number: 12068226
    Abstract: A semiconductor device assembly includes a cooling system, a plurality of semiconductor packages, each including a semiconductor die and an encapsulant body, and a multi-device thermal interface interposed between the plurality of semiconductor packages and the cooling system, wherein the semiconductor packages are each configured as surface mount devices, and wherein the multi-device thermal interface thermally couples each of the semiconductor packages to the cooling system.
    Type: Grant
    Filed: September 13, 2021
    Date of Patent: August 20, 2024
    Assignee: Infineon Technologies AG
    Inventor: Ralf Otremba