Patents Assigned to Technologies AG
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Patent number: 9689770Abstract: A pressure sensor calibration system comprises one or more pressures sensors for calibrating sensor parameters based on a membrane deflection or a membrane displacement from an electrostatic force. A measuring component measures capacitance values corresponding to applied voltages at the electrodes of the one or more pressure sensors. Sensor parameters are derived from capacitance measurements and a pressure measurement, which are utilized by a calibration component for calibration and recalibration of the one or more pressure sensors.Type: GrantFiled: July 17, 2014Date of Patent: June 27, 2017Assignee: Infineon Technologies AGInventor: Dirk Hammerschmidt
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Patent number: 9687800Abstract: Disclosed is a method for carrying out a chemical reaction in a reactor, at least one substance is present in a container that is closed in a gas-tight manner, is introduced into the reactor in said container and is released by breaking open the container. The container is designed such that it breaks open when a specified bursting pressure difference between the internal pressure and external pressure is exceeded. The container is broken open and the substance located in the container is thus released as a result of deliberate application in the reactor of a pressure difference exceeding the bursting pressure difference.Type: GrantFiled: November 7, 2011Date of Patent: June 27, 2017Assignee: Chemspeed Technologies AGInventors: Rolf Gueller, Daniel Juchli, Michael Schneider, Annie Schnyder
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Patent number: 9691970Abstract: A magnetoresistive device includes a substrate and an electrically insulating layer arranged over the substrate. The magnetoresistive device further includes a first free layer embedded in the electrically insulating layer and a second free layer embedded in the electrically insulating layer. The first free layer and the second free layer are separated by a portion of the electrically insulating layer.Type: GrantFiled: December 11, 2015Date of Patent: June 27, 2017Assignee: Infineon Technologies AGInventors: Juergen Zimmer, Wolfgang Raberg, Stephan Schmitt
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Patent number: 9688060Abstract: A composite is produced by providing a first and a second joining partner, a connecting means, a sealing means, a reactor having a pressure chamber, and a heating element. The two joining partners and the connecting means are arranged in the pressure chamber such that the connecting means is situated between the first joining partner and the second joining partner. A gas-tight region is then produced, in which the connecting means is arranged. Afterward, a gas pressure of at least 20 bar is produced in the pressure chamber outside the gas-tight region. The gas pressure acts on the gas-tight region and presses the first joining partner, the second joining partner and the connecting means together. The joining partners and the connecting means are then heated by means of the heating element to a predefined maximum temperature of at least 210° C. and then cooled.Type: GrantFiled: August 10, 2012Date of Patent: June 27, 2017Assignee: Infineon Technologies AGInventors: Reinhold Bayerer, Olaf Hohlfeld
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Patent number: 9689462Abstract: A centrifugal pendulum device for vibration isolation of a power take-off system of a drive unit, having a first pendulum element with a first mass and a second pendulum element with a second mass, which are set up to counteract vibrations of the drive unit in a resonance range. The first pendulum element has a first resonance range and the second pendulum element has a second resonance range, where the first and the second resonance ranges differ. Using the centrifugal pendulum device it is possible in a small construction space using efficient means to isolate an extended frequency range of vibrations from the drivetrain. In particular, with drive units which are designed as internal combustion engines having activatable cylinders, it is possible, using the centrifugal pendulum device proposed here to achieve a vibration isolation for many states of the drive unit.Type: GrantFiled: July 3, 2013Date of Patent: June 27, 2017Assignee: Schaeffler Technologies AG & Co. KGInventors: Stephan Maienschein, Thorsten Krause
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Publication number: 20170175850Abstract: A damper system which is supportable rotatably around an axis of rotation, having a first absorber device and a second absorber device. The first absorber device includes at least one first pendulum mass, a first coupling device and a first flange part. The first pendulum mass is coupled with the first flange part by means of the first coupling device. The first coupling device is designed to guide the first pendulum mass along a first oscillation path. The second absorber device is offset radially from the first absorber device. The second absorber device includes an absorber element. The absorber element is coupled with the first flange part.Type: ApplicationFiled: July 22, 2015Publication date: June 22, 2017Applicant: Schaeffler Technologies AG & Co. KGInventors: Stephan Maienschein, Christian Huegel
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Publication number: 20170179224Abstract: A power semiconductor device includes a semiconductor substrate including at least one electrical structure. The at least one electrical structure has a blocking voltage of more than 20V. Further, the power semiconductor device includes an electrically insulating layer structure formed over at least a portion of a lateral surface of the semiconductor substrate. The electrically insulating layer structure embeds one or more local regions for storing charge carriers. Further, the one or more local regions includes in at least one direction a dimension of less than 200 nm.Type: ApplicationFiled: December 21, 2016Publication date: June 22, 2017Applicant: Infineon Technologies AGInventors: Andreas HAERTL, Martin BRANDT, Andre Rainer STEGNER, Martin STUTZMANN
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Publication number: 20170175255Abstract: A film is sputter-deposited on an essentially plane, extended surface of a substrate which has recesses therein, namely at least one of grooves, of holes, of bores, of vias, of trenches. So as to establish on one hand a homogeneous thickness distribution of the film along the addressed surface of the substrate and, on the other hand, a thick film deposition within the recesses, sputter deposition is performed first at a large distance between a sputter surface of a target and the addressed surface of the substrate and then at a reduced distance between the addressed surfaces.Type: ApplicationFiled: February 13, 2015Publication date: June 22, 2017Applicant: EVATEC ADVANCED TECHNOLOGIES AGInventors: Oliver RATTUNDE, Hans HIRSCHER
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Publication number: 20170175860Abstract: Bearing component having an outer raceway, an inner raceway and balls accommodated therebetween; one raceway has an ogival profile while the other raceway has a spherical profile.Type: ApplicationFiled: March 12, 2015Publication date: June 22, 2017Applicant: Schaeffler Technologies AG & Co. KGInventor: Philippe Ott
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Patent number: 9685504Abstract: A semiconductor device includes a first semiconductor region having first charge carriers of a first conductivity type and a second semiconductor region having second charge carriers. The first semiconductor region includes a transition region in contact with the second semiconductor region, the transition region having a first concentration of the first charge carriers, a contact region having a second concentration of the first charge carriers, wherein the second concentration is higher than the first concentration, and a damage region between the contact region and the transition region. The damage region is configured for reducing lifetime and/or mobility of the first charge carriers of the damage region as compared to the lifetime and/or the mobility of the first charge carriers of the contact region and the transition region.Type: GrantFiled: August 31, 2016Date of Patent: June 20, 2017Assignee: Infineon Technologies AGInventors: Andreas Haertl, Frank Hille, Francisco Javier Santos Rodriguez, Daniel Schloegl, Andre Rainer Stegner, Christoph Weiss
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Patent number: 9683152Abstract: A two-component polyurethane adhesive is described. The polyurethane adhesive has high strength and extensibility, wherein the mechanical properties are only slightly dependent on the temperature. The polyurethane adhesive is suitable as a structural adhesive that is decomposed by heating in such a way that adhesive bonds can be undone in a temperature range of interest. The adhesive can include a triol, a diol, an alkoxylated aromatic diol, a polyamine, a polyisocyanate, and a polyurethane polymer having isocayanate groups in certain ratios.Type: GrantFiled: August 20, 2013Date of Patent: June 20, 2017Assignee: SIKA TECHNOLOGY AGInventors: Steffen Kelch, Wolfgang Roock, Florian Ittrich
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Patent number: 9683278Abstract: A method includes providing a first and a second joining partner each having a first main surface, wherein at least a portion of the first main surfaces of the first and joining partners each comprise a metal layer. The method further includes applying a plurality of solder preforms to the metal layer of the first main surface of at least one of the first and second joining partners, positioning the first and second joining partners so that the solder preforms contact the metal layers of the first main surfaces of the first and second joining partners, and melting the plurality of solder preforms under pressure to form a single continuous thin layer area interconnect comprising a diffusion solder bond which bonds together the metal layers of the of the first main surfaces of the first and second joining partners.Type: GrantFiled: June 8, 2015Date of Patent: June 20, 2017Assignee: Infineon Technologies AGInventors: Alexander Heinrich, Bernd Rakow
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Patent number: 9683644Abstract: A torque converter, including: an axis of rotation; a cover arranged to receive torque from an engine; an impeller shell fixedly secured to the cover; at least one impeller blade fixedly secured to the impeller shell; a turbine including a turbine shell and at least one turbine blade fixedly secured to the turbine shell; and an output arranged to non-rotatably connect to an input shaft for a transmission. The cover includes a plurality of indentations and a respective fastener located in each indentation and fixedly secured to the cover.Type: GrantFiled: November 17, 2015Date of Patent: June 20, 2017Assignee: SCHAEFFLER TECHNOLOGIES AG & CO. KGInventors: Matthew Smith, Timothy Hess, Drew Hilty
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Patent number: 9685347Abstract: A semiconductor device comprises a semiconductor body with a front face and a back face, having an active zone located at the front face, a front surface metallization layer having a front face and a back face directed towards the active zone, the front surface metallization layer being provided on the front face of the semiconductor body and being electrically connected to the active zone, and a first barrier layer, comprising amorphous metal nitride, located between the active zone and the metallization layer. Further, a method for producing such a device is provided.Type: GrantFiled: November 4, 2014Date of Patent: June 20, 2017Assignee: Infineon Technologies AGInventors: Jochen Hilsenbeck, Jens Peter Konrath, Stefan Krivec
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Patent number: 9685687Abstract: In accordance with an embodiment, a circuit includes a directional coupler having a plurality of ports comprising an input port, a transmitted port, an isolated port and a coupled port, and an adjustable termination coupled to at least one of the plurality of ports.Type: GrantFiled: August 27, 2015Date of Patent: June 20, 2017Assignee: Infineon Technologies AGInventors: Valentyn Solomko, Bogdan-Nicolae Tanc
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Patent number: 9683630Abstract: The application describes and illustrates a timing belt, particularly a toothed belt, having a first end, a second end, a rear side, a front side, and having a plurality of teeth arranged on the rear side and/or the front side, wherein the first end has at least one cutaway, wherein the second end has at least one tine that is insertable into the cutaway, and wherein the first end and the second end are detachably connectable to each other and the teeth of the first end have an offset relative to the teeth of the second end in the connected condition under no tension.Type: GrantFiled: July 30, 2014Date of Patent: June 20, 2017Assignee: SIG Technology AGInventors: Jurgen Vollbarth, Bernd von Birgelen, Markus Klaus
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Patent number: 9682486Abstract: A rotary joint includes a hollow gear and a hollow wiring unit having a first flexible printed circuit board therein, to allow hose to pass through both the hollow gear and the hollow wiring unit. A robot includes the rotary joint.Type: GrantFiled: June 17, 2013Date of Patent: June 20, 2017Assignee: ABB Technology AGInventors: Xiaodong Cao, Tao Feng, Zhu Zhu
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Patent number: 9685967Abstract: A ?? ADC includes a forward path, a feedback path, and offset compensation circuitry. The forward path is configured to convert an analog input signal to a digital output signal and includes analog chopper circuitry configured to shift the analog input signal to a chopper frequency to generate a chopped analog signal. The feedback path includes a ?? DAC configured to convert a digital offset compensation signal configured to compensate for offset error in the analog input signal to an analog feedback signal that is subtracted from a forward path signal. The offset compensation circuitry is configured to accumulate a chopped digital signal from the forward path to generate a digital offset error signal; add the digital offset error signal to the digital output signal to generate the digital offset compensation signal; and provide the digital offset compensation signal to the ?? DAC.Type: GrantFiled: September 8, 2016Date of Patent: June 20, 2017Assignee: Infineon Technologies AGInventors: Mario Motz, Dan Stoica, Andrei Gheorghe
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Patent number: 9683629Abstract: A centrifugal force pendulum having a pendulum mass pair and a pendulum flange, in which an arcuate cut-out with a cut-out contour is provided, wherein the pendulum masses of the pendulum mass pair are situated on both sides of the pendulum flange and are connected to each other by at least one spacer bolt which is guided through the cut-out, wherein the spacer bolt has a damping arrangement which includes a stabilizing element and an elastic damping element, wherein the damping element is designed to damp a striking of the spacer bolt on the cut-out contour of the cut-out, wherein the damping element and the stabilizing element of the damping arrangement are positioned relative to each other so that the damping element is able to strike the cut-out contour of the cut-out directly.Type: GrantFiled: June 26, 2013Date of Patent: June 20, 2017Assignee: Schaeffler Technologies AG & Co. KGInventors: Thorsten Krause, Kai Schenck
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Patent number: 9684021Abstract: This disclosure describes techniques for measuring the resistance of a component with measurement circuitry that is electrically coupled to the component via one or more electrical conductors (e.g., one or more bond wires). The resistance measurement techniques of this disclosure may measure a resistance of an electrical conductor, and generate a value indicative of a resistance of a component other than the electrical conductor based on the measured resistance of the electrical conductor. The electrical conductor for which the resistance is measured may be the same as or different than one or more of the electrical conductors that the couple the measurement circuitry to the component to be measured. Using an electrical conductor resistance measurement to determine the resistance of a component may improve the accuracy of the resistance measurement for the component.Type: GrantFiled: July 15, 2013Date of Patent: June 20, 2017Assignee: Infineon Technologies AGInventor: Peter Bogner
