Abstract: According to an embodiment, an interface circuit includes a current replicator and a receiver. The current replicator includes a power terminal coupled to a first reference node, an output terminal configured to output a signal proportional to a signal received from a transducer, and an interface terminal coupled to the transducer. Using a single interface terminal, the current replicator may be configured to provide power to the transducer and receive output signals from the transducer. The receiver may include a first input terminal coupled to the output terminal, a second input terminal coupled to a second reference node, and a current converter circuit coupled to the first input terminal.

Abstract: Embodiments relate to a sensor device including a layer stack 600, the layer stack 600 including at least ferromagnetic and non-magnetic layers formed on a common substrate 620. The sensor device 600 further includes at least a first magneto-resistive sensor element 711 provided by a first section 611 of the layer stack 600. The first magneto-resistive sensor element 711 herein is configured to generate a first signal. The sensor device 600 also includes a second magneto-resistive sensor element 712 provided by a second section 612 of the layer stack 610. The second magneto-resistive sensor element 712 herein is configured to generate a second signal for verifying the first signal.

Abstract: In accordance with an embodiment, an interface circuit includes a variable voltage bias generator coupled to a transducer, and a measurement circuit coupled to an output of the transducer. The measurement circuit is configured to measure an output amplitude of the transducer. The interface circuit further includes a calibration controller coupled to the bias generator and the measurement circuit, and is configured to set a sensitivity of the transducer and interface circuit during an auto-calibration sequence.

Abstract: A transformer and a method of manufacturing a transformer are disclosed. The transformer can include a transformer core with at least three core limbs which are arranged in parallel with respect to one another and perpendicular to corner points of an area spanned by a polygon, and wherein axial end regions of each of the at least three core limbs transition into a respective yoke segment arranged transversely with respect to the axial end regions. Main windings can be arranged around each of the at least three core limbs in a hollow-cylindrical winding region. A magnetic cross section of a respective core limb can be greater than a magnetic cross section of the respective yoke segment. Additional windings can be electrically connected to a respective main winding and can be arranged around each of the respective yoke segments.

Abstract: An exemplary test arrangement for in-situ partial discharge measurements in distribution transformers has at least one test system with a plurality of test components including: an AC voltage source for producing a variable test voltage with a measuring apparatus for recording current pulses caused by partial discharge and with an evaluation apparatus for the recorded current pulses, a grounded test container in which at least some of the test components are arranged, and a distribution transformer connected to the AC voltage source as a test object. The test object is arranged on insulation means for electrically insulating the test object. Those parts of the test object which are grounded during normal operation being connected at least to the potential of the grounded test container.

Abstract: According to one embodiment, a data processing arrangement is described comprising a processor configured to carry out a computer program including a plurality of program instructions; a signature determination arrangement configured to determine a signature of the program instructions carried out by the processor wherein the processor is configured to, when it carries out a program instruction of the plurality of program instructions which indicates the next program instruction of the plurality of program instructions to be carried out, provide information about the indication to the signature determination arrangement; wherein the signature determination arrangement is configured to take into account the information in the determination of the signature; and a detector configured to check, when the computer program is completely carried out, whether the determined signature is equal to a reference signature.

Abstract: A method of forming a thinned encapsulated chip structure, wherein the method comprises providing a separation structure arranged within an electronic chip, encapsulating part of the electronic chip by an encapsulating structure, and thinning selectively the electronic chip partially encapsulated by the encapsulating structure so that the encapsulating structure remains with a larger thickness than the thinned electronic chip, wherein the separation structure functions as a thinning stop.

Abstract: A tunable capacitance circuit comprises a plurality of varactor transistors which are coupled in series. An antenna tuner comprises such a tunable capacitance circuit.

Abstract: In accordance with an embodiment, an interface circuit includes an amplifier configured to be coupled to a transducer, a first bypass circuit coupled to a first voltage reference and the amplifier, a second bypass circuit coupled to the first voltage reference and the amplifier, and a control circuit coupled to the second bypass circuit. The first bypass circuit conducts a current when an input signal amplitude greater than a first threshold is applied to the transducer and the control circuit causes the second bypass circuit to conduct a current for a first time period after the first bypass circuit conducts a current.

Abstract: The present invention relates to curable compositions comprising at least one specific blocked amine, at least one surface-deactivated polyisocyanate that is solid at ambient temperature and optionally water or a water-producing substance. Compositions of this type are characterized by an extremely high storage stability as long as they are not heated. Hot curing compositions that cure with the action of heat can thus be produced. Heat-activated compositions can also be produced. When heat is applied the latter compositions are not cured but are activated so that they are able to cure under the influence of moisture. The curable compositions are particularly suitable for use as adhesives.

Abstract: An integrated wheel disconnect system is provided, including, a mechanically actuated engagement interlock selector assembly. The engagement interlock selector assembly including a housing, an interlock mechanism disposed in the housing, a spring disposed in the housing, and an actuator assembly, arranged to displace the interlock mechanism towards or away from the spring. The engagement interlock selector assembly is operated by an actuator module, such as a pin, sliding along an external ramp on the interlock mechanism, the mechanism moving axially to selectively engage and disengage the wheel hub from the drive axle.

Abstract: In an embodiment, an electrostatic discharge (ESD) circuit for providing protection between a first node and a second node includes a first MOS device having a first source/drain coupled to a first node, and a second source/drain coupled to an intermediate node. The ESD circuit also includes a first capacitor coupled between a gate of the first MOS device and the first node, a first resistor coupled between the gate of the first MOS device the intermediate node, a second MOS device having a first source/drain coupled to the intermediate node, and a second source/drain coupled to the second node, a second capacitor coupled between a gate of the second MOS device and the first node, and a second resistor coupled between the gate of the second MOS device and the second node.

Abstract: In various embodiments, a chip package is provided. The chip package may include at least one chip having a plurality of pressure sensor regions and encapsulation material encapsulating the chip.

Abstract: Structures and methods of forming moisture barrier capacitor on a semiconductor component are disclosed. The capacitor is located on the periphery of a semiconductor chip and includes an inner plate electrically connected to a voltage node, an outer plate with fins for electrically connecting to a different voltage node.

Abstract: A torque converter, including: a cover; a pump shell fixed to the cover; and a vibration damper with a plurality of springs, and a cover plate partially surrounding the springs. The torque converter includes a torque convert clutch with: a piston plate; and a drive plate with a first portion and a plurality of second portions including distal ends circumferentially aligned with the springs and circumferentially disposed between pairs of adjacent springs, and a plurality of centering protrusions extending radially outward beyond the distal ends or inward of the distal ends. The second portions are arranged to engage the springs to transmit the torque. When the torque converter is not rotating, the centering protrusions are free of contact with the cover plate. When the torque converter rotates at a rate greater than a threshold speed, the centering protrusions contact the cover plate to limit radial displacement of the drive plate.

Abstract: Embodiments relate to a semiconductor device, a semiconductor wafer structure, and a method for manufacturing or forming a semiconductor wafer structure. The semiconductor device includes a semiconductor substrate with a first region having a first conductivity type and a second region having a second conductivity type. The semiconductor device further includes an oxide structure with interrupted areas and a metal layer structure being in contact with the second region at least at the interrupted areas of the oxide.

Abstract: A radial rolling bearing (10) with rolling bodies (24) which are received in at least one cage (26, 28) and which are arranged between an inner ring (20) and an outer ring (22). The radial rolling bearing (12) is radially separable, and the radially multipart inner ring (20) can be fixed on a shaft (16) using two clamping rings (36, 38) which are attached to the axial ends of said inner ring. The inner ring (20) is designed without rims on the axially outer sides, and the clamping rings (36, 38) take on the function of inner ring rims, the rolling bodies (24) running against inner run-on surfaces (50) of the clamping rings (36, 38) in the axial direction. On the basis of the at least partial positioning of the clamping rings (36, 38) axially below the cages (26, 28) or the outer ring (22), the clamping rings (36, 38) take on two additional functions in addition to the actual clamping ring main function of fixing the inner ring (20) on the shaft (16).

Abstract: In one embodiment a method of forming a compressive polycrystalline semiconductive material layer is disclosed. The method comprises forming a polycrystalline semiconductive seed layer over a substrate and forming a silicon layer by depositing silicon directly on the polycrystalline silicon seed layer under amorphous process conditions at a temperature below 600 C.

Abstract: Disclosed are various embodiments of expandable barriers. Expandable barriers are typically barriers made from an expandable material and formed to fit within a cavity. After being placed inside a cavity, expandable barriers generally undergo an activation process, where the expandable barrier expands to fill the cavity and create a physical barrier. Using various extrusion processes to form an expandable barrier allows for a reduction in tooling costs, while also allowing more flexible barrier designs. Such designs can be specifically tailored for a particular cavity or cavities to ensure that the barrier fills the cavity after expansion.