Abstract: A method for fabricating a p-n heterojunction device is provided, the device being preferably comprised of an n-type GaN layer co-doped with silicon and zinc and a p-type AlGaN layer. The device may also include a p-type GaN capping layer. The device can be grown on any of a variety of different base substrates, the base substrate comprised of either a single substrate or a single substrate and an intermediary layer. The device can be grown directly onto the surface of the substrate without the inclusion of a low temperature buffer layer.
Type:
Grant
Filed:
August 9, 2002
Date of Patent:
May 10, 2005
Assignee:
Technologies and Deviles International, Inc.
Inventors:
Sergey Karpov, Alexander Usikov, Heikki I. Helava, Denis Tsvetkov, Vladimir A. Dmitriev