Abstract: A defective pixel detection and correction mechanism for use in an image sensor integrated circuit determines whether a current pixel is a defective pixel in a consistent manner from frame to frame. The defective pixel detection and correction mechanism also replaces defective pixels with stable replacement values. The defective pixel detection and correction mechanism has a defective pixel detection mechanism that employs a look-up table with defective pixel locations for providing a non-varying determination of whether a pixel is defective or non-defective. The defective pixel detection and correction mechanism also has a defective pixel correction mechanism that employs a consistent replacement choice facility to provide a previous pixel value in the same frame, on the same row, and a predetermined number of pixels from the current pixel location as a replacement value and a replacement unit (e.g., multiplexer) for replacing the defective pixel value with the replacement value.

Abstract: A semiconductor integrated circuit structure and method for fabricating. The semiconductor integrated circuit structure includes a light sensitive device integral with a semiconductor substrate, a cover dielectric layer disposed over the light sensitive device, and a lens-formation dielectric layer disposed over the cover dielectric layer. Light is transmittable though the cover dielectric layer; and through the lens-formation dielectric layer. The lens-formation dielectric layer forms an embedded convex microlens. The microlens directs light onto the light sensitive device.

Abstract: A device is provided for inspecting an installed electrical system including a power panel and branch circuits with respective circuit breakers. The device includes a power interface unit with a Ground Fault Circuit Interrupter (GFCI) for connection with the power panel. Further, the device includes a power source for temporarily powering the electrical system through the GFCI. For safety purposes, the device allows the energized GFCI to be closed only when the device and the power panel are connected. Moreover, the device provides for selective closing of the circuit breaker of an individual branch circuit to test a power response thereof to indicate whether the individual branch circuit has a fault therein.

Abstract: A packet fiber node is described for use in an access network such as, for example, a cable network. The packet fiber node may differ from convention RF fiber nodes deployed in a cable network in that the packet fiber node is configured to communicate with the Head End of the network using baseband optical signals rather than frequency modulated optical signals. According to a specific embodiment of the present invention, one or more packet fiber nodes may be deployed in a cable network to service a plurality of different subscriber groups which are serviced by a single, conventional RF fiber node.

Abstract: Methods are provided for measuring the potential for mutual coupling in an integrated circuit package of any type or configuration using a network analyzer in conjunction with a coaxial test probe. Simple, low-cost test fixturing and methods of testing may be used to measure the parasitic capacitance and inductance of one or more I/O leads of an integrated circuit package, the measured parasitic capacitances and inductances providing an indication of the susceptibility of the integrated circuit package to mutual coupling between electrical leads of the package or between an electrical lead and other components of the integrated circuit package.

Abstract: A receiver includes a controller which receives A/D sampled input signals and shifts the sampled digital signal to compensate for Doppler effect in the input signal prior to demodulation. The controller compensates for a Doppler increased frequency by shifting the sampled digital signal so as to skip a sample period every n samples. This may be achieved by decreasing a cycle of m samples by one sample period every n samples. The controller compensates for a Doppler decreased frequency by shifting the sampled digital signal so as to add a sample period every n samples. This may be achieved by repeating a sample every n samples to shift the sampled digital signal. The compensation is performed in software on a multi-threaded processor.

Abstract: A memory device and method receives write data through a unidirectional downstream bus and outputs read data through a unidirectional upstream bus. The downstream bus is coupled to a pair of internal write data buses, and the upstream bus is coupled to a pair of internal read data buses. A first set of multiplexers selectively couple each of the internal write data buses to any of a plurality of banks of memory cells. Similarly, a second set of multiplexers selectively couple each of the banks of memory cells to any of the internal read data buses. Write data can be coupled to one of the banks concurrently with coupling read data from another of the banks. Also, write data may be concurrently coupled from respective write data buses to two different banks, and read data may be concurrently coupled from two different banks to respective read data buses.

Abstract: A method for fabricating a chip-scale package includes securing a device substrate that carries at least two adjacent semiconductor devices to a sacrificial substrate. The sacrificial substrate may include conductive elements on a surface thereof, which are located so as to align along a street between each adjacent pair of semiconductor devices on the device substrate. The device substrate is then severed along each street and the newly formed peripheral edge of each semiconductor device coated with dielectric material. If the sacrificial substrate includes conductive elements, they may be exposed between adjacent semiconductor devices and subsequently serve as lower sections of contacts. Peripheral sections of contacts are formed on the peripheral edge. Upper sections of the contacts may also be formed over the active surfaces of the semiconductor devices. Once the contacts are formed, the sacrificial substrate is substantially removed from the back sides of the semiconductor devices.

Abstract: The invention includes a chemical vapor deposition method of forming a barium strontium titanate comprising dielectric layer having a varied concentration of barium and strontium, and/or titanium, within the layer. A substrate is positioned within a chemical vapor deposition reactor. Barium and strontium are provided within the reactor by flowing at least one metal organic precursor to the reactor. Titanium is provided within the reactor. One or more oxidizers are flowed to the reactor. In one aspect, conditions are provided within the reactor to be effective to deposit a barium strontium titanate comprising dielectric layer on the substrate from the reactants.

Abstract: Methods relating to forming interconnects through injection of conductive materials, to fabricating semiconductor component assemblies, and to resulting assemblies. A semiconductor component substrate, such as a semiconductor die or other substrate, has dielectric material disposed on a surface thereof, surrounding but not covering interconnect elements, such as bond pads, on that surface. A second semiconductor component substrate, such as a carrier substrate with interconnect elements such as terminal pads, is adhered to the first semiconductor component substrate, forming a semiconductor package assembly having interconnect voids between the corresponding interconnect elements. A flowable conductive material is then injected into each interconnect void using an injection needle that passes through one of the substrates into the interconnect void, forming a conductive interconnect between the bond pads and terminal pads of the substrates.

Abstract: A disc assembly in a disc drive includes a hub rotatable about a central axis. Pluralities of disc elements are mounted about outer periphery of the central axis of the hub. An annular shaped disc clamp is located about a first axial end of the hub, the annular shaped clamp holding the outermost disc to the hub by a series of equally spaced fasteners along an inner diameter of the disc clamp. The improvement therein consisting of placing an offset angle on the underside, or disc-to-hub contact area. The offset angle sloping from the inner disc contact point outward to the end of the clamp such that application of pressure during clamping will make a uniform contact area along the clamp surface as the clamp fasteners are tightened to secure the clamp to the hub. This improves flatness, axial run out, reduces repeatable run out and increases reliability.

Abstract: A system and method of protecting a printer housing against moisture infiltration, including affixing a fixed covering portion over the printer housing, wherein the affixing includes exposing a printing opening of the printer housing, and securing a removable covering portion to the fixed covering portion, wherein the removable covering portion covers the printing opening.

Abstract: A method of repairing a paved surface utilizes a nonwoven or woven fibrous mat made from fibers including polymer fibers, the polymer fibers having a melting point greater than about 320° F. (160° C.). The mat has a load-elongation behavior such that when the mat is subject to tensile stress, the mat achieves at least 90% of its ultimate load at an elongation not greater than 5% of the specimen length in the direction of applied stress. Another mat comprises a nonwoven or woven fibrous mat made from fibers selected from the group consisting of mineral fibers, polymer fibers, natural fibers, and mixtures thereof, and a rubbery binder. Another mat comprises a nonwoven or woven fibrous mat made from a blend of high melt polymer fibers having a melting point of at least 350° F. (177° C.) and low melt polymer fibers having a melting point of less than 350° F. (177° C.).

Abstract: The invention includes a method of forming spaced conductive regions. A construction is formed which includes a first electrically conductive material over a semiconductor substrate. The construction also includes openings extending through the first electrically conductive material and into the semiconductor substrate. A second electrically conductive material is formed within the openings and over the first electrically conductive material and is in electrical contact with the first electrically conductive material. The second electrically conductive material is subjected to anodic dissolution while the first electrically conductive material is electrically connected to a power source.

Abstract: The present invention is a rubber modified monovinylidene aromatic polymer composition which can be used in conventional thermoforming or other highly orienting forming or shaping processes to produce tough, cost effective, transparent containers or other packaging materials.

Abstract: An enhanced fuse circuit is discussed that advances redundancy techniques in integrated circuits. The enhanced fuse circuit uses a single nonvolatile fuse and a latch that is coupled at a desired time. One embodiment of the invention discusses a fuse circuit that includes a volatile latch and a nonvolatile fuse. The nonvolatile fuse adapts to operate with a voltage supply greater than about 1.65 volts. The voltage supply is boosted at a desired time to a predetermined level and for a predetermined duration so that the nonvolatile fuse transfers its data to the volatile latch.

Abstract: A liquid crystal display (LCD) device and a driving method thereof are disclosed. In order to obtain high-quality images, a signal preprocessor is incorporated in the gray signal modulator of conventional LCDs. The signal preprocessor can be specifically designed as a noise-reduction preprocessor for suppressing the noise induced from the input gray signals, or designed for detecting a certain character of input gray signals for further processes. After be processed by the signal preprocessor, optimized modified gray signals can be obtained from the signal converter for driving the LCD, thereby producing high-quality images.

Abstract: A bio-separation instrument using a multi-segment cartridge. The cartridge includes a plurality of efficient, compact, portable, interchangeable, reusable, recyclable, modular, multi-channel segments. Each segment supports multiple capillaries for CE separation. Each segment has an integrated reservoir containing a buffer/gel common to all the capillaries. Air pressure can be supplied to the reservoir through the periphery of each segment. Each segment has an integrated LED array board directly coupled to capillaries for providing excitation light. Optical fibers of a fiber bundle are individually guided through the periphery of each segment to the capillaries for emission collection. The fiber bundle delivers emissions to a detector that can read the emissions in a time-staggered multiplexed scheme. Each segment includes electrodes electrically coupled to a voltage source through the periphery of the segment for effecting CE separation.

Abstract: A method of forming a composite image using a CMOS image sensor. The method comprises capturing a plurality of frames using the image sensor, identifying a reference point in each of the frames, and aligning the frames using the reference point. Finally, the frames are combines, such as be an arithmetic addition, into the composite image.

Abstract: An air induction system for a motor vehicle, having a pair of conduits fluidly connecting an engine to the ambient air and a housing located between the pair of conduits. The housing includes side walls and a top wall defining a chamber. A baffle plate for attenuating noise is positioned within the chamber adjacent to the top wall. Additionally, the baffle plate defines a plurality of openings extending therethrough.